Global Semiconductor Assembly & Testing Services Market is Expected to Get US$ 39,000 Million By 2021

The semiconductor assembly & testing services market is expected to exceed more than US$ 39,000 Million by 2021; Growing at a CAGR of more than 4.5% in the given forecast period.

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The semiconductor assembly & testing services market is segmented on the lines of its services, application and regional. Based on service segmentation it covers assembly and packaging services and testing services. Assembly and packaging services is further segmented into wafer level packaging, copper wire and gold wire bonding, flip chip, copper clip and TSV. Under application segmentation it covers automotive electronics, communication, industrial, consumer electronics, computing and networking application. The semiconductor assembly & testing services marketis geographic segmentation covers various regions such as North America, Europe, Asia Pacific, Latin America, Middle East and Africa. Each geographic market is further segmented to provide market revenue for select countries such as the U.S., Canada, U.K. Germany, China, Japan, India, Brazil, and GCC countries.

The Semiconductor Assembly & Testing Services Market has been segmented as below:

By Services Analysis

Assembly & Packaging Services

• Wafer Level Packaging
• Copper Wire and Gold Wire Bonding
• Flip Chip
• Copper Clip
• TSV

Testing Services

By Application Analysis

• Automotive Electronics
• Communication
• Industrial
• Consumer Electronics
• Computing and Networking

By Regional Analysis

North America
Europe
Asia-Pacific
Rest of the World

This report provides:

1) An overview of the Global Market for Semiconductor Assembly & Testing services and related technologies.

2) Analyses of global market trends, with data from 2013, estimates for 2014 and 2015, and projections of compound annual growth rates (CAGRs) through 2021.

3) Identifications of new market opportunities and targeted promotional plans for semiconductor assembly & testing services.

4) Discussion of research and development, and the demand for new products and new applications.

5) Comprehensive company profiles of major players in the industry.

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The scope of the report includes a detailed study of global and regional markets for semiconductor assembly & testing services with the reasons given for variations in the growth of the industry in certain regions.

Table of Contents
1. INTRODUCTION
2. Assumptions & Acronyms Used
3. Research Methodology
4. Market Overview
5. Global Semiconductor Assembly and Testing Services Market Analysis, By Services
5.1. Introduction
5.2. Global Semiconductor Assembly and Testing Services Market Forecast By Services
5.2.1. Assembly & Packaging services (Interconnecting technologies)
5.2.1.1. Copper and gold wire bonding
5.2.1.2. Copper clip
5.2.1.3. Flip Chip
5.2.1.4.Wafer Level Packaging
5.2.1.5. TSV
5.2.2. Testing Services
5.3. Basis Point Share (BPS) Analysis, By Services
5.4. Y-o-Y Growth Comparison, By Services
5.5. Market Absolute $ Opportunity, By Services
5.6. Global Semiconductor Assembly and Testing Services Market Attractiveness Analysis, By Services
5.7. Qualitative Analysis
6. Global Semiconductor Assembly and Testing Services Market Analysis, By Packaging Solutions
7. Global Semiconductor Assembly and Testing Services Market Analysis, By Applications
8. Global Semiconductor Assembly and Testing Services Market Analysis, By Region
9. North America North America Semiconductor Assembly and Testing Services Market Analysis
10. APAC (Excluding Taiwan) Semiconductor Assembly and Testing Services Market Analysis
11. Taiwan Semiconductor Assembly and Testing Services Market Analysis
12. Europe Semiconductor Assembly and Testing Services Market Analysis
13. Middle East & Africa (MEA) Semiconductor Assembly and Testing Services Market Analysis
14. Latin America Semiconductor Assembly and Testing Services Market Analysis
15. Competition Landscape
15.1. Competition Dashboard
15.2. Competitive Strategies
15.3. Market Structure
15.4. Company Profiles
15.4.1. ASE Group
15.4.1.1. Revenue
15.4.1.2. Products/Brand Offerings
15.4.1.3. Company Highlights
15.4.2. Amkor Technology Inc.
15.4.3. STATS chipPAC Ltd. (JCET)
15.4.4. Powertech Technology Inc.
15.4.5. Silicon Precision Industries Company Ltd.
15.4.6. CORWIL Technology Corp.
15.4.7. Chipbond Technology Corporation
15.4.8. Integrated Microelectronics Inc.(Psi Technologies Inc.)
15.4.9. GlobalFoundries Inc.

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