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New SMD Adhesive is Fast Curing and Easily Dispensed

11-08-2017 04:18 PM CET | Science & Education

Press release from: Techsil Ltd

Techsil has launched a new fast curing epoxy adhesive, Structalit® 5610, from manufacturers Panacol. This adhesive is specially designed for bonding Surface Mounted Devices (SMDs) on to circuit boards. Due to its high viscosity the adhesive is well-suited for screen printing.

Structalit® 5610 is a red-coloured epoxy adhesive which makes a perfect contrast to green circuit boards. The one-component adhesive is easily applied via dispenser, screen printing or needle transfer.

The SMD adhesive cures thermally within minutes, even at low temperatures. At the same time it is highly temperature-resistant: Temporarily it can be exposed to temperatures up to 280° C, making it the perfect adhesive for reflow soldering.

Once cured, Structalit® 5610 is extremely shock-resistant and features very high adhesion to FR4 circuit boards, to metals and to epoxy-based mould materials.

About Techsil
Trading since 1989, UK based Techsil has grown into a global supplier of industrial RTV silicones, adhesives, sealants, encapsulants, conformal coatings, tapes, casting and mould making materials to a wide range of manufacturing industries including Automotive, Medical, Electronics, Aerospace, LED Lighting and Rapid Prototyping.

About Panacol
Hönle Group member Panacol-Elosol GmbH is an internationally active provider in the growth market of industrial adhesives with an extensive product range that includes UV adhesives, structural adhesives and conductive adhesives. Together with Dr. Hönle AG, the parent company of the Hönle Group and a global leader in industrial UV technology, Panacol is a reliable systems provider for adhesives complete with suitable curing technology.

Techsil Ltd
34 Bidavon Industrial Estate
Waterloo Road
B50 4JN

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