Market Dynamics to Escalate Demand for Ion Beam Based Deposition Throughout 2017 - 2025

Ion beam deposition technology is method of forming high purity solid film on a substrate by the process of irradiating a low energy and mass separated ion beam in an ultrahigh vacuum environment. Through ion beam deposition technology, secondary particles that are emitted from a sputtering target are deposited as a thin layer on a substrate by utilizing a geometrical arrangement which is specially designed for the process. This technology helps to obtain ultra-precise, high purity and thin film layer devices having maximum uniformity.

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Some of the common materials that are deposited onto a substrate by utilizing this technology includes various oxides such as Ta2O5, Al2O3, TiO2 and SiO2. Other, materials such as LaF3, MgF2, ZrO3, Nb2O5, HfO2, Y2O3 and YF3 among others can also be deposited by utilizing an assisted and/or reactive ion beam sputtering. The list also includes material such as VOX that requires very definite control of process gas ratios in order to allow very distinct thermo electrical properties that is to be achieved for various sensitive thermal imaging processes.

Increasing demand for improved quality, functionality and homogeneity of individual substrate layers used across various applications of high-precision optics and semiconductor manufacturing is one of the most important factor predicted to accelerated the demand of ion beam deposition system in the coming years. Moreover, rapidly growing demand of the thin film technology across the globe is also anticipated to trigger the demand of the ion beam deposition system during the forecast period for providing dielectric coating.

In order to provide a comprehensive and detailed analysis of the market, the global ion beam based deposition market has been segmented on the basis of technology and application. Different techniques of ion beam deposition used across various semiconductor device manufacturing process includes single ion beam deposition technology and dual ion beam deposition technology. Moreover, different applications for which ion beam deposition techniques are majorly utilized including micro electro mechanical system (MEMS), logic and memory, radio frequency identification (RFID) devices, power devices and CMOS (complementary metal oxide semiconductor) image sensor is also provided in this report. In addition, information related to current market situations along with future expected growth trend of all the above mentioned technology and application segment across different regions such as Asia Pacific, North America, Europe, Middle-East and Africa (MEA) and Latin America is also highlighted in this report.

Geographically, in 2016, the ion beam based deposition equipment market is anticipated to be majorly driven by Asia Pacific in terms of market share holding. Moreover, in terms of market growth, this region is also predicted to witness the most promising growth during the forecast period from 2017 to 2025. Wide concentration of semiconductor manufacturing company in Asia Pacific region coupled with increasing adoption of this film technology is the primary factor responsible for the growing demand of ion beam deposition system used for providing dielectric coating on thin film. China, Korea and Japan are the most important contribution countries responsible for the rapid demand of ion beam deposition system in Asia Pacific region. In terms of revenue generation, the ion beam based deposition equipment market of Asia Pacific region is followed by North America in 2016.

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In terms of competitive analysis, the ion beam deposition equipment market across the globe is competitive in nature due to the presence of few market player holder holding majority of the market share. Moreover, entry of new and local players is also anticipated to intensify the competition during the forecast period. Some of the major players operating in the ion beam based deposition market includes Veeco Instruments Inc. (New York), Scia Systems GmbH (Germany), Hitachi High-Technologies Corporation (Japan) and Canon Anelva Corporation (Japan) among others.

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