Global Fan-in Wafer Level Packaging Market Industry Analysis, Size, Share, Growth, Trends and Forecast 2016 - 2024

"The Report Fan-in Wafer Level Packaging Market - Global Industry Analysis, Size, Share, Growth, Trends and Forecast 2016 - 2024 provides information on pricing, market analysis, shares, forecast, and company profiles for key industry participants. - MarketResearchReports.biz"

Description
Wafer Level Packaging (WLP) is intrinsically a chip size package and has the huge potential for future single chip packages. Wafer Level Packaging (WLP) technologies have been segmented, among which two major categories can be identified, fan-in WLP and fan-out WLP technologies, respectively.

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The market has been bifurcated into by application automotive, telecommunication, consumer electronics, industrial, medical, defense and aerospace, among others. Furthermore, the market by geography has been segmented into Europe, Asia Pacific, North America, South America, Middle East and Africa.
Fan-in WLP technology confirms its presence on the semiconductor industry with indisputable advantages associated to form and cost factor. In addition, technological advancement and innovation continues and widens the area of possibilities of fan-in WLP solutions. Increasing application and usage of fan in wafer level packaging in automotive, consumer electronics and industrial applications is fueling the demand for advanced fan-in WLP solutions globally. Moreover, the “IoT” (Internet of Things) promises a wide array of new applications for which fan-in WLP would be a ideal option presenting an lucrative opportunity to boost the demand further.
Fan in wafer level packaging solution is playing an important role in semiconductor packaging field owing to the rapid advances in IC (integrated circuit) fabrication. Furthermore the demand for lighter, faster, smaller and cost effective electronic equipments with high performance and low-cost packaging is one of the prime factors fueling the market for fan-in wafer level packaging solutions. WLP have application in the ICs used in consumer electronic devices; for example, smartphones and other semiconductor devices. Growing demand for technologically advancement in mobile devices which are capable of performing an array of programs in a single small-end product is one of the prime factors fueling demand for fan-in wafer level packaging technology than the conventional form of packaging solutions.

North America and Asia Pacific is leading the market for fan-in wafer level packaging market globally. The U.S., China, Japan and India are anticipated to see positive growth over the forecast period from 2016 to 2024. At present, consumer electronics industry is leading the market for FIWLP (Fan-in Wafer Level Package) in terms of application. However, automotive and aerospace and defense segment is anticipated to witness positive growth over the forecast period from 2016 to 2024. The major driving factors contributing in the growth of this market is increasing usage of smartphones and other portable advance semiconductor equipments, which is having a positive impact on the FIWLP market at the global level. In addition, rising opportunities in the medical field is fueling the growth of Fan-in WLP market. Furthermore, new advance technologies for cost effective packaging solutions across different industries are major factor behind the positive growth of this market. The market for fan-in wafer level packaging is expected to witness positive growth over the forecast period from 2016 to 2024.

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Fan-in WLP technology is on an evolutionary track, growing production and attracting new applications in various industries. Research and development along with merger and acquisitions are some of the major business strategies adopted by the companies operating in this industry in order to strengthen foothold globally. Some of the major players operating in the Fan-in WLP market are Amkor Technology Inc.( Arizona, The U.S.), Aixtron SE (Herzogenrath, Germany), AT&S (Leoben, Austria), Chipbond Technology Corp.(Taiwan), China Wafer Level CSP Co. Ltd. (Suzhou, China), Chipmos Technologies Inc.(Taiwan), DECA Technologies (The U.S.), Fujitsu Ltd.(Tokyo, Japan), International Quantum Epitaxy Plc (U.K.), Insight SIP (France), Jiangsu Changjiang Electronics Technology Co. Ltd (China), Nanium, S.A (Portugal), Nemotek Technologie (Morocco, North Africa), Powertech Technology Inc.(Taiwan), Qualcomm Inc.( California, The U.S.), Siliconware Precision Industries Co., Ltd (Taiwan), SUSS Microtec (Germany), Triquint Semiconductor Inc. (Oregon, The U.S.) and Toshiba Corp (Japan) among others.
The report offers a comprehensive evaluation of the market. It does so via in-depth qualitative insights, historical data, and verifiable projections about market size. The projections featured in the report have been derived using proven research methodologies and assumptions. By doing so, the research report serves as a repository of analysis and information for every facet of the market, including but not limited to: Regional markets, technology, types, and applications.

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The study is a source of reliable data on:
Market segments and sub-segments
Market trends and dynamics
Supply and demand
Market size
Current trends/opportunities/challenges
Competitive landscape
Technological breakthroughs
Value chain and stakeholder analysis
The regional analysis covers:
North America (U.S. and Canada)
Latin America (Mexico, Brazil, Peru, Chile, and others)
Western Europe (Germany, U.K., France, Spain, Italy, Nordic countries, Belgium, Netherlands, and Luxembourg)
Eastern Europe (Poland and Russia)
Asia Pacific (China, India, Japan, ASEAN, Australia, and New Zealand)
Middle East and Africa (GCC, Southern Africa, and North Africa)

The report has been compiled through extensive primary research (through interviews, surveys, and observations of seasoned analysts) and secondary research (which entails reputable paid sources, trade journals, and industry body databases). The report also features a complete qualitative and quantitative assessment by analyzing data gathered from industry analysts and market participants across key points in the industry’s value chain.
A separate analysis of prevailing trends in the parent market, macro- and micro-economic indicators, and regulations and mandates is included under the purview of the study. By doing so, the report projects the attractiveness of each major segment over the forecast period.

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Highlights of the report:
A complete backdrop analysis, which includes an assessment of the parent market
Important changes in market dynamics
Market segmentation up to the second or third level
Historical, current, and projected size of the market from the standpoint of both value and volume
Reporting and evaluation of recent industry developments
Market shares and strategies of key players
Emerging niche segments and regional markets
An objective assessment of the trajectory of the market
Recommendations to companies for strengthening their foothold in the market

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