Rising Trend of Internet of Things Fuels the Global 3D Semiconductor Packaging Market

Global 3D Semiconductor Packaging Market Report, published by Variant Market Research, forecast that the global market was valued at $4 billion in 2016 and is expected to reach $12 billion by 2024, growing at a CAGR of 15.2% from 2016 to 2024. In geographical segments, Asia-Pacific and Rest of the World (RoW) are expected to grow at a CAGR of 16.2% and 14.8%, respectively, during the forecast period 2016-2024.

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Rising requirement for size reduction in electronic devices, less power consumption, improved efficiency, and technological advantages over 2D packaging technology are some of the primary aspects that fuels the global 3D semiconductor packaging market. However, high capital investment is expected to decline the market growth. Moreover, upsurge in demand for consumer electronics products, and rising trend of IoT would generate numerous profitable growth opportunities for the market in the forecasted period.

The global 3D semiconductor packaging market has been classified as technology, material type and industry vertical. By technology, the market categorized into 3D wire-bonded, 3D package-on-package, 3D fan-out based, 3D through-silicon-via, and others. Among which, 3D wire-bonded sub-segment dominated the market with prime share in the year 2016. Material type segment includes encapsulation resin, bonding wire, leadframe, ceramic package, organic substrate, die attach material, and others. By industry vertical, the market is further bifurcated into industrial, healthcare, aerospace & defense, electronics, IT & telecommunication, automotive & transport, and others. Where, electronics is the principal segment and occupied for around half of the total market share in 2016, driven by increased implementation of 3D semiconductor packaging in portable electronic devices.

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North America, Europe, Asia-Pacific, and Rest of the World (RoW) are the major geographical segments of the global 3D semiconductor packaging market. The largest market share was occupied by Asia-Pacific in the year 2016, and it is expected to remain the same throughout the forecast period. The growth is majorly seen due to growing demand for these chips in China, Japan, and Taiwan. North America held for the second position with respect to market with share of 23.1%. Although, in terms of growth, Asia-Pacific is also likely to achieve the fastest CAGR of 16.2% during the forecast time 2016-2024.

Major players in the 3D semiconductor packaging market include International Business Machines Corporation (IBM), Intel Corporation, Jiangsu Changjiang Electronics Technology Co. Ltd., Siliconware Precision Industries Co., Taiwan Semiconductor Manufacturing Company, SÜSS MicroTec AG., Qualcomm Technologies Inc., Amkor Technology, ASE group, Ltd., and STMicroelectronics, among others.

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Scope of 3D Semiconductor Packaging Market

Technology Type Segments
• 3D package-on-package
• 3D wire-bonded
• 3D fan-out based
• 3D through-silicon-via
• Others

Materials Type Segments
• Bonding wire
• Organic substrate
• Encapsulation resin
• Leadframe
• Ceramic package
• Die attach material
• Others

Industry Vertical Type Segments
• Industrial
• Electronics
• Healthcare
• IT & telecommunication
• Automotive & transport
• Aerospace & defense
• Others

Geographical Segments
• North America
o US
o Canada
o Mexico

• Europe
o U.K.
o Italy
o France
o Germany
o Others

• Asia-Pacific
o China
o India
o Japan
o South Korea
o Others

• RoW
o South America
o Middle East
o Africa

About Variant Market Research

Variant Market Research offers syndicated and customized reports to fulfill clients' objectives. We also provide customized data pack proposing market sizing in an Excel/PDF/PowerPoint or Word format as per the requirement of clients. We cover several industry domains, namely Semiconductor & Electronics, Consumer Electronics, Information and Communication Technology, Automotive, Consumer Goods, Food & Beverages, Pharmaceuticals, Medical Devices, Chemicals, Industrial, Mining Equipment, Automation, Manufacturing, Construction, Energy & Power, Defense & Aerospace and Banking, Financial services and Insurance (BFSI). Our expertise are data triangulation, competitor benchmarking, parent market benchmarking, estimating market size and forecast of the market from 2016 to 2024.
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