Semiconductor Assembly & Testing Services Market is Determined to Cross US$ 39,000 Million Globally By 2021

The global semiconductor assembly & testing services market is segmented on the basis of key regions, namely, North America, Europe, Asia Pacific, Latin America, and the Middle East and Africa. Furthermore, each region is segmented to provide market revenue for select countries such as the U.S., Canada, the U.K., Germany, China, Japan, India, Russia, Brazil, and GCC countries. The report includes a detailed study of global and regional semiconductor assembly & testing services market and analyzes the variations in the growth of the industry in certain regions.

The global semiconductor assembly & testing services market is expected to reach US$ 39,000 million by 2021, registering a compound annual growth rate (CAGR) of 4.5% during the forecast period.

A glimpse of the report structure is provided in the report description available on the website.
https://www.marketresearchengine.com/reportdetails/semiconductor-assembly-and-testing-services-market

ASE Group, Amkor Technologies Inc., STATS ChipPAC Ltd. (JCET), Silicon Precision Industries Co. Ltd., Powertech Technology Inc., CORWIL Technology Corporation, Psi Technologies Inc. (IMI), Global Foundries, and Chipbond Technology Corporation are the most active players in the semiconductor assembly & testing services market.


The major driving factors of Semiconductor Assembly & Testing Services Market are as follows:

• Growing requirement for mobility and connectivity in customer electronic products.
• Rising demand of higher electronic systems in the automobiles.


The restraining factors of Semiconductor Assembly & Testing Services Market are as follows:

• High capital necessity for offering superior end packaging solutions.
• Fluctuations in exchange rates.
• Instability in the market.

The growing requirement for mobility and connectivity in customer electronic products and rising demand for higher electronic systems in automobiles are expected to drive the market. In addition, increasing technological advancement is expected to fuel the growth of the semiconductor assembly & testing services market. However, the regulations regarding the use of environmentally-friendly products, fluctuations in exchange rate, and flux in the market are expected to hamper the growth of the market.

In this report, the global semiconductor assembly & testing services market is segmented by service, application, and region. On the basis of service, the market is segmented into assembly & packaging services and testing services. The assembly & packaging services segment is subdivided into wafer level packaging, copper wire and gold wire bonding, flip chip, copper clip, and TSV. The market on the basis of application is segmented into automotive electronics, industrial, consumer electronics, computing & networking, and communication.

This report covers the semiconductor assembly & testing services market, in terms of value, and forecasts the market size till 2021. It includes the market segmentation by service, application, and region. In addition, the report identifies key growth segments and opportunities in the industry. This report also covers detailed competitive outlook including the share and company profiles of the key players in the global market. Company profile includes company summary, financial summary, business strategy and planning, SWOT analysis, and current developments.

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This deep-dive study on the semiconductor assembly & testing services market will help customers identify new market opportunities and targeted promotional plans.

Table of Contents

1. INTRODUCTION
2. Assumptions & Acronyms Used
3. Research Methodology
4. Market Overview
5. Global Semiconductor Assembly and Testing Services Market Analysis, By Services
5.1. Introduction
5.2. Global Semiconductor Assembly and Testing Services Market Forecast By Services
5.2.1. Assembly & Packaging services (Interconnecting technologies)
5.2.1.1. Copper and gold wire bonding
5.2.1.2. Copper clip
5.2.1.3. Flip Chip
5.2.1.4.Wafer Level Packaging
5.2.1.5. TSV
5.2.2. Testing Services
5.3. Basis Point Share (BPS) Analysis, By Services
5.4. Y-o-Y Growth Comparison, By Services
5.5. Market Absolute $ Opportunity, By Services
5.6. Global Semiconductor Assembly and Testing Services Market Attractiveness Analysis, By Services
5.7. Qualitative Analysis
6. Global Semiconductor Assembly and Testing Services Market Analysis, By Packaging Solutions
7. Global Semiconductor Assembly and Testing Services Market Analysis, By Applications
8. Global Semiconductor Assembly and Testing Services Market Analysis, By Region
9. North America North America Semiconductor Assembly and Testing Services Market Analysis
10. APAC (Excluding Taiwan) Semiconductor Assembly and Testing Services Market Analysis
11. Taiwan Semiconductor Assembly and Testing Services Market Analysis
12. Europe Semiconductor Assembly and Testing Services Market Analysis
13. Middle East & Africa (MEA) Semiconductor Assembly and Testing Services Market Analysis
14. Latin America Semiconductor Assembly and Testing Services Market Analysis
15. Competition Landscape
15.1. Competition Dashboard
15.2. Competitive Strategies
15.3. Market Structure
15.4. Company Profiles
15.4.1. ASE Group
15.4.1.1. Revenue
15.4.1.2. Products/Brand Offerings
15.4.1.3. Company Highlights
15.4.2. Amkor Technology Inc.
15.4.3. STATS chipPAC Ltd. (JCET)
15.4.4. Powertech Technology Inc.
15.4.5. Silicon Precision Industries Company Ltd.
15.4.6. CORWIL Technology Corp.
15.4.7. Chipbond Technology Corporation
15.4.8. Integrated Microelectronics Inc.(Psi Technologies Inc.)
15.4.9. GlobalFoundries Inc.

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