Press release
Semiconductor Assembly & Testing Services Market is Expected to Cross US$ 39,000 Million Globally by 2021
The semiconductor assembly & testing services market is segmented on the lines of its services, application and regional. Based on service segmentation it covers assembly and packaging services and testing services. Assembly and packaging services is further segmented into wafer level packaging, copper wire and gold wire bonding, flip chip, copper clip and TSV. Under application segmentation it covers automotive electronics, communication, industrial, consumer electronics, computing and networking application.Browse Full Report @: https://www.marketresearchengine.com/reportdetails/semiconductor-assembly-and-testing-services-market
How Big is the Semiconductor Assembly & Testing Services Market?
The semiconductor assembly & testing services market is expected to exceed more than US$ 39,000 Million by 2021; Growing at a CAGR of more than 4.5% in the given forecast period.
The report covers detailed competitive outlook including the market share and company profiles of the key participants operating in the global market. Key players profiled in the report include ASE Group, Amkor Technologies Inc., STATS ChipPAC Ltd. (JCET), Silicon Precision Industries Co. Ltd., Powertech Technology Inc., CORWIL Technology corporation, Psi Technologies Inc. (IMI), Global Foundries and Chipbond Technology Corporation. Company profile includes assign such as company summary, financial summary, business strategy and planning, SWOT analysis and current developments.
The semiconductor assembly & testing services marketis geographic segmentation covers various regions such as North America, Europe, Asia Pacific, Latin America, Middle East and Africa. Each geographic market is further segmented to provide market revenue for select countries such as the U.S., Canada, U.K. Germany, China, Japan, India, Brazil, and GCC countries.
Table of Contents
1. INTRODUCTION
2. Assumptions & Acronyms Used
3. Research Methodology
4. Market Overview
5. Global Semiconductor Assembly and Testing Services Market Analysis, By Services
6. Global Semiconductor Assembly and Testing Services Market Analysis, By Packaging Solutions
7. Global Semiconductor Assembly and Testing Services Market Analysis, By Applications
8. Global Semiconductor Assembly and Testing Services Market Analysis, By Region
9. North America North America Semiconductor Assembly and Testing Services Market Analysis
10. APAC (Excluding Taiwan) Semiconductor Assembly and Testing Services Market Analysis
11. Taiwan Semiconductor Assembly and Testing Services Market Analysis
12. Europe Semiconductor Assembly and Testing Services Market Analysis
13. Middle East & Africa (MEA) Semiconductor Assembly and Testing Services Market Analysis
14. Latin America Semiconductor Assembly and Testing Services Market Analysis
15. Competition Landscape
15.1. Competition Dashboard
15.2. Competitive Strategies
15.3. Market Structure
15.4. Company Profiles
15.4.1. ASE Group
15.4.1.1. Revenue
15.4.1.2. Products/Brand Offerings
15.4.1.3. Company Highlights
15.4.2. Amkor Technology Inc.
15.4.3. STATS chipPAC Ltd. (JCET)
15.4.4. Powertech Technology Inc.
15.4.5. Silicon Precision Industries Company Ltd.
15.4.6. CORWIL Technology Corp.
15.4.7. Chipbond Technology Corporation
15.4.8. Integrated Microelectronics Inc.(Psi Technologies Inc.)
15.4.9. GlobalFoundries Inc.
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