Global Sputtering Equipment Market Technological Breakthroughs by 2025

Sputtering is a thin film deposition manufacturing method in today’s semiconductor, CDs, disk drives, and the optical devices industry. On the atomic level, sputtering is a method whereby atoms are being ejected from the target or the source material which is actually to be deposited on the substrate – like a silicon wafer, optical device or the solar panel because of the bombardment of the target by the high energy particles.

For purpose of in depth analysis, the sputtering equipment market is been segmented on the basis of product types, applications andgeography. Based on the product type, the market has been segmented into four types they are like logic, memory, analog and discrete. Various types of applications of sputtering equipment’s include application in consumer electronics, automotive sector and healthcare electronics and in other industrial applications. Moreover, this report also provides the cross functional analysis of all the above mentioned segment across different regions such as Europe, North America, Asia Pacific, Middle East and Africa and Latin America.

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Extensive use of sputter deposition for the purpose of semiconductor manufacturing and to deposit thin film of different material used for the purpose of IC processing on the substrate is one of the key drivers for the growth of Sputtering equipment market. The tri axis capability of sputtering system having orientations like sputtering up, sputtering down and sputtering horizontally can be easily used for achieving any types of desired pumping operation like turbo or cryo. It is also possible use to have a simple single chamber orientation, which is to be fully vented for the purpose of unloading and loading, or for the purpose of adding either a mechanized or manual transfer arm loading lock.Therefore, the growing need of small chambered confocial sputtering equipments is the main factor anticipated to catalyze the growing demand of different sputtering equipment’s during the forecasted period from 2017 to 2025. In addition, growth of smaller chamber sputtering system for higher throughput value and less cost is also anticipated to increase the demand of sputtering equipment’s in the upcoming years. In turn this is also projected to affect the Sputtering equipment market in a positive manner during the forecasted period.

Inspite of having lot of driving factors, the Sputtering equipment market is expected to show a fluctuation and shrink in the growth rate because of the variation in the semiconductor industry. Slow speed of deposition in comparison to the arc technology and very low plasma density around 5% are also restraining factors for the global Sputtering equipment market. The lower adhesion and coatings of the sputtering equipment is also creating challenges for this market .Lower density of the magnetron sputtering technology is also going to act as a restraining factor for Sputtering equipment market during the forecasted period from 2017-2025.

By application, automotive segment held the largest market share because of the increasing demand of semiconductor ICs in the automobile sector. However, the consumer electronics segment isprojected to achieve steady growth during the forecasted period. Transition in the wafer size and the emerging Finfet technology and 3D ICs is the key driver of growing applications in consumer electronics segment.

Geographically, the global Sputtering equipment market is mainly driven by Asia Pacific region. Growing demand of electronic sputtering and chemical sputtering in consumer electronics and healthcare electronics is driving the Asia Pacific region. Rapidly growing demand of electronic sputtering in devices like CD, disk drive and optical devices is predicted to fasten the demand of sputtering equipments, thereby expected to drive the Sputtering equipment market rapidly. This region is expected to maintain its dominance in the market during the forecasted period owingto the presence of huge number of sputtering equipment manufacturers in countries like China, Taiwan, South Korea and Japan among others.

Some of the leading players operating in the Sputtering equipment market includes Applied Materials (The U.S.), Canon Anelva Corporation (Japan), ULVAC Inc. (Japan), BOBST (Switzerland), JX Nippon Mining & Metals (Japan), KOBE STEEL (Japan) among others.

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