Global System on Chip (SoC) Market Analysis & Future Outlook Reveals Growth by 2025
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The SoC (System on Chip) components vary based on the device it is to be used in. Mostly it consists of a graphic processing unit (GPU), microprocessor, timing sources, memory, analog interfaces, peripherals, external interfaces, power management circuits and voltage regulators among others. SoC contains everything that is present within the motherboard of a computer but consumes much lesser space and power. The compact System on Chip gives similar or better performance that has ultimately resulted in its growing applications across different industries and hence growth in its market growth at a fast pace.
The report starts with the global system on chip market overview; product definition, industry evolution, drivers & restraints, porter’s analysis, global market attractiveness analysis, share analysis by company (2016) and finally, competitive strategies adopted by leading players. Further, the global SoC on the basis of different types has been segmented that comprises digital, analog, mixed signal and others. Telecommunication, consumer electronics, automotive and others are the various application feature in the report. On the geographical basis, various regions that are considered under this report are North America, Asia Pacific, Europe, Middle East, Africa and Latin America. A precise detail about the revenue has also been provided in USD billion for this market along with the CAGR for the forecast period of 2017 to 2025. The discussed region’s (SoC) market analysis is done that discusses market key trends, market by country, market by type and market by application.
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The last section detail the company with description, business overview, SWOT analysis, financial overview and strategic overview. Various company listed with provided detail are Broadcom Limited (Singapore), Apple Inc. (The U.S.), Intel Corporation (The U.S.), Infineon Technologies (The U.S.), Qualcomm Inc. (The U.S.), Samsung Electronics (South Korea), STMicroelectronics N.V. (Switzerland), Taiwan Semiconductor Manufacturing Co. Ltd. (Taiwan), MediaTek Inc. (Taiwan) and Toshiba Corporation (Japan).
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