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Electrostatic Discharge Packaging Market Emerging Trends and New Technologies Research 2017 to 2025

Electrostatic Discharge Packaging Market Emerging Trends

Electrostatic discharge (ESD) packaging, also called antistatic packaging, includes range of special feature packaging products for protecting electronic items particularly static sensitive items. ESD packaging has proven to be an effective solution for protection of static sensitive electronic components and metal items during transportation, shipping, storage and material handling processes.

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The global ESD packaging or antistatic packaging market is characterized by key players focusing on market segments with ESD protection needs. Focus market strategy adopted by key market players has allowed the global ESD packaging market to achieve impressive year on year (Y-o-Y) growth performance.

ESD packaging products have allowed original equipment manufacturers (OEMs) to operate with much more flexibility in terms of disseminated production facilities. ESD or antistatic packaging is characterized by better resistance to accumulation of static, shielding against electric field and insulation from transfer of electronic charge.

Manufacturers modify design and implement technological alterations to traditional packaging systems, in terms of material properties, in order to achieve ESD packaging systems. The primary aim of ESD packaging is to protect ESD sensitive products, components and devices from getting damaged by static electricity. ESD packaging can be of three primary forms including anti-static or low charging, offering resistance to electricity and shielding against electrostatic discharge or electric field.

ESD packaging manufacturers provide range of ESD packaging products such as anti-static bags, anti-static stretch films, shielding bags, shielding bubble bags, pink anti-static bubble bags, in plant handling systems, in plant handler trays, ESD storage containers, etc.

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Global ESD Packaging Market: Market Dynamics

The global trend of internet-of-things (IOT) has led to technology being rapidly adopted across industries. The use of integrated circuits to implement IOT in consumer products and to launch innovative technological products into consumer markets have led to growing demand for ESD packaging products.

ESD packaging products with printing capabilities have allowed manufacturers to communicate brand and product info to users in b2b markets. ESD packaging manufacturers are further adding product variants to their ESD packaging portfolio in order to meet wide range of ESD requirements of their clients. ESD requirements such as separating electronic components from ESD protected area, material handling of WIP components, clean room practices, storage and stoking of static sensitive items, etc. require diverse packaging formats such as ESD foam sheets, insert trays, boxes, layer pads, totes and other accessories.

Damage to electronic products, chips and circuit boards due to electronic discharge has resulted in huge losses to companies across industries such as medical, automotive etc. Shipping high volume of electronic components require careful attention being given to its packaging needs. Demand for ESD protection of circuit boards and other WIP components by OEMs driven by technological competencies have propelled the global ESD packaging market.

Emerging trend observed in the global ESD packaging market is shift in focus to cater to demand arising from automation practices in manufacturing. Operational requirement among OEMs to separate ESD sensitive items, components and devices during manufacturing, assembling and shipping process has led to packaging manufactures cater to such specific packaging needs.

Controlling moisture and humidity from affecting electronic products need packaging system to have barrier or resistance properties. The global ESD packaging market serves moisture controlling needs by supplying moisture barrier bags, desiccants, humidity indicator systems etc.

Global ESD Packaging Market: Market Segmentation

The global ESD packaging market is segmented as per ESD feature type, product type, and application type.

As per the product type, the global ESD packaging market is segmented into

Bags
Trays
Boxes & Containers
Films
Tapes
ESD foams
Others (labels, desiccants, etc.)

As per the application type, the global ESD packaging market is segmented into

Automotive
Medical Devices
Military Devices
Electronic
Clean Room Packaging
Others

Global ESD Packaging Market: Regional Outlook

Geographically the global ESD packaging market is segmented into 7 key regions including North America, Latin America, Europe, Asia Pacific excluding Japan (APEJ), Japan, and Middle East and Africa (MEA). The global ESD packaging market is expected to witness high growth in North America and APEJ, as manufacturing activities is expected to gain traction over the forecast period.

Global ESD Packaging Market: Key Players

Some of the players operating in the ESD packaging market include Tandem Equipment Sales, Inc., Stephen Gould Corp., Teknis Limited, Elcom (UK) Ltd, Statico, Summit Packaging Solutions, Protektive Pak, Desco Industries Inc. and GWP Group

About TMR

TMR is a global market intelligence company providing business information reports and services. The company’s exclusive blend of quantitative forecasting and trend analysis provides forward-looking insight for thousands of decision makers. TMR’s experienced team of analysts, researchers, and consultants use proprietary data sources and various tools and techniques to gather and analyze information.

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