Molded Interconnect Devices Market to expand $629.5bn by 2023

According to global molded interconnect devices market share to hit USD 629.5 billion by 2023. These devices are reshaping electrical and mechanical designs in many applications, particularly those in telecommunication and automotive sectors. They lead to more effective low-cost designs and are best options for replacingmany parts of a circuit board product by integrating electrical& mechanical functions in a single product.

MIDare cost effective for complex electromechanical functions and minimize the number of parts in circuit saving space & reducing assembly time. All these factors have contributed to the growth of the global industry during forecastperiod.High designing flexibility and functional density is predicted to fuel the demand and growth of the industry.

RTP Company had set its production unit in China in 2006. The new specialty thermoplastic compound facility provided technical support, product development and customer support to its clients in China along with increased support and service to international clients.It was the second production unit establishment of the company in Asia after it first opened its manufacturing set up in Singapore in 2002. The firm has seven production units set up in three continents along with sales representatives in Asia Pacific, Europe and North America.

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Global molded interconnect devices market is segmented into key geographical regions including North America, Asia Pacific, Europe, Latin America and MEA.

Asia Pacific molded interconnect devices market size was evaluated at more than $175 million for 2015. The growth can be attributed to availability of low cost parts in countries like China.
European industry is predicted to witness high growth due to presence of many automotive industries in the region. It was evaluated at $24 million for 2015 and is predicted to register CAGR of 12.2% during the forecast period.

US molded interconnect devices market size is predicted to surpass $25 million by end of forecast period. This has contributed to the rapid growth of the industry in North America.
Browse key industry insights spread across 83 pages with 79 market data tables & 28 figures & charts from the report, “Molded Interconnect Devices (MID) Market Size By Process (Laser Direct Structuring (LDS), Two-Shot Molding), By Application (Automotive, Telecommunication, Consumer, Industrial, Medical), Industry Analysis Report, Regional Outlook (U.S., Germany, UK, China, Japan), Application Potential, Price Trends, Competitive Market Share & Forecast, 2016 – 2023” in detail along with the table of contents:

https://www.gminsights.com/industry-analysis/molded-interconnect-devices-MID-market

Key industry players profiled in the report includes, Molex, LPKF Laser & Electronics, RTP Company, TE Connectivity, MacDermid Incorporated, SelectConnect Technologies, Harting Technology Group.

This latest molded interconnect devices market research report offers in-depth analysis, key industry insights, market sizing & forecast on a granular level for key products, applications across number of regional markets. The report also analyzes the molded interconnect devices industry from business strategy perspective, describing in detail growth drivers, pitfalls &challenges for participants, accompanied by a detailed competitive benchmarking including company market share analysis and detailed business profiles.

Reasons to Buy This Report:

• Global Molded Interconnect Devices Market size & forecast by product & application.
• Growth drivers, pitfalls & industry challenges.
• Key Molded Interconnect Devices Market growth opportunities & emerging business models.
• Competitive benchmarking with market share analysis and company profiles.

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