Press release
Semiconductor Packaging Materials Industry :Worldwide key Vendors, Trends, Analysis, Segmentation, Forecast to 2017-2022
Semiconductor Packaging Materials Industry
About this Report
Semiconductor packaging materials comprise metals, plastic, and ceramic components. They not only protect the IC on the semiconductor die, but also interconnect the die and the PCB. They protect the die from external mechanical impacts and corrosion, and also act as an electrically conductive interconnects with excellent signal propagation properties. Excessive heat in the circuits is dissipated through heat spreaders. Packaging components vary in dimensions and functionality.
TechNavio's analysts forecast the Global Semiconductor Packaging Materials market to grow at a CAGR of 4.33 percent over the period 2014-2019
Covered in this Report
The Global Semiconductor Packaging Materials market can be divided into seven segments based on the type of product: Organic Substrates, Bonding Wires, Leadframes, Encapsulation Resins, Ceramic Packages, Die Attach Materials, and Other Semiconductor Packaging Materials. The key consumers of these packaging materials are the Electronics Industry, the Semiconductor Industry, and the Automotive Sector.
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TechNavio's report, Global Semiconductor Packaging Materials Market 2015-2019, has been prepared based on an in-depth market analysis with inputs from industry experts. The report covers the APAC region, North America, and Europe; it also covers the Global Semiconductor Packaging Materials market landscape and its growth prospects over the coming years. The report also includes a discussion of the key vendors operating in this market.
Key Regions
• APAC
• Europe
• North America
Key Vendors
• Alent
• BASF
• Henkel
• Hitachi Chemical
• Kyocera
Other Prominent Vendors
• Beijing Doublink Solders
• Beijing Kehua New Chemical Technology
• Cheil Industries
• Diehl Metall
• Duksan Hi-metal
• DuPont
• Dynacraft
• Evergreen Semiconductor Materials
• Guangdong Rongtai
• Heesung Metal
• Heraeus
• Honeywell Electronic Materials
• Ibiden
• Indium
• IQE
• KCC
• LG Innotek
• Lintec
• Lord
• Mitsui High-Tec
• MK Electron
• Nanya PCB
• Ningbo Dongsheng IC
• Nippon Micrometal
• Nitto Denko
• Poongsan
• Samsung Techwin
• Shanghai Sinyang Semiconductor Materials
• Shin-Etsu Chemical
• Shinko
• Sumitomo Metal Mining
• Tanaka Denshi Kogyo
• Tatsuta Electronic Materials
• Xiamen Yonghong Electronics
Key Market Driver
• Surge in Sales of Smartphones and Smart Devices
• For a full, detailed list, view our report
Key Market Challenge
• High Dependency on Performance of Semiconductor Equipment Industry
• For a full, detailed list, view our report
Key Market Trend
• Popularity of Redistributed Chip Packaging
• For a full, detailed list, view our report
Key Questions Answered in this Report
• What will the market size be in 2019 and what will the growth rate be?
• What are the key market trends?
• What is driving this market?
• What are the challenges to market growth?
• Who are the key vendors in this market space?
• What are the market opportunities and threats faced by the key vendors?
• What are the strengths and weaknesses of the key vendors?
For any Questions or Special Requirements related to Semiconductor Packaging Materials you can write us @ https://www.wiseguyreports.com/enquiry/38521-global-semiconductor-packaging-materials-market-2015-2019
List of Abbreviations
1. Executive Summary
02. List of Abbreviations
03. Scope of the Report
03.1 Market Overview
03.2 Product Offerings
04. Market Research Methodology
04.1 Market Research Process
04.2 Research Methodology
05. Introduction
06. Market Landscape
06.1 Market Size and Forecast
06.2 Five Forces Analysis
07. Market Segmentation by Type of Material
07.1 Global Semiconductor Packaging Materials Market by Type of Material 2014-2019
07.2 Global Organic Substrates Market
07.2.1 Market Size and Forecast
07.3 Global Bonding Wires Market
07.3.1 Market Size and Forecast
07.4 Global Leadframes Market
07.4.1 Market Size and Forecast
07.5 Global Encapsulation Resins Market
07.5.1 Market Size and Forecast
07.6 Global Ceramic Packages Market
07.6.1 Market Size and Forecast
07.7 Global Die Attach Materials Market
07.7.1 Market Size and Forecast
07.8 Global Other Semiconductor Packaging Materials Market
07.8.1 Market Size and Forecast
08. Market Segmentation by Packaging Technology
08.1 Global SO Market
08.1.1 Market Overview
08.2 Global GA Packages Market
08.2.1 Market Overview
08.3 Global Flat No-leads Packages Market
08.3.1 Market Overview
08.4 Global QFP Market
08.4.1 Market Overview
08.5 Global DIP Market
08.5.1 Market Overview
08.6 Global Other Technologies Market
08.6.1 Market Overview
09. Geographical Segmentation
09.1 Global Semiconductor Packaging Materials Market by Geographical Segmentation 2014-2019
09.2 Semiconductor Packaging Materials Market in the APAC Region
09.2.1 Market Size and Forecast
09.3 Semiconductor Packaging Materials Market in North America
09.3.1 Market Size and Forecast
09.4 Semiconductor Packaging Materials Market in Europe
09.4.1 Market Size and Forecast
10. Key Leading Countries
10.1 Taiwan
10.2 China
10.3 Japan
11. Buying Criteria
12. Market Growth Drivers
13. Drivers and their Impact
14. Market Challenges
15. Impact of Drivers and Challenges
16. Market Trends
17. Trends and their Impact
18. Vendor Landscape
18.1 Competitive Scenario
18.2 Other Prominent Vendors
19. Key Vendor Analysis
19.1 Alent
19.1.1 Key Facts
19.1.2 Business Overview
19.1.3 Business Segmentation By Revenue 2013
19.1.4 Key Financials by Revenue 2013 and 2014
19.1.5 Business Segmentation by Revenue 2012 and 2013
19.1.6 Geographical Segmentation by Revenue 2013
19.1.7 Business Strategy
19.1.8 SWOT Analysis
19.2 BASF
19.2.1 Key Facts
19.2.2 Business Overview
19.2.3 Business/Product Segmentation
19.2.4 Business Segmentation by Revenue 2012 and 2013
19.2.5 Geographical Segmentation by Revenue 2013
19.2.6 Business Strategy
19.2.7 Recent Developments
19.2.8 SWOT Analysis
19.3 Henkel
19.3.1 Key Facts
19.3.2 Business Overview
19.3.3 Key Brands and Technologies
19.3.4 Business Strategy
19.3.5 Recent Developments
19.3.6 SWOT Analysis
19.4 Hitachi Chemical
19.4.1 Key Facts
19.4.2 Business Overview
19.4.3 Business Segmentation by Revenue 2014
19.4.4 Business Segmentation by Revenue 2013 and 2014
19.4.5 Geographical Segmentation by Revenue 2014
19.4.6 Business Strategy
19.4.7 Recent Developments
19.4.8 SWOT Analysis
19.5 Kyocera
19.5.1 Key Facts
19.5.2 Business Overview
19.5.3 Business Segmentation by Revenue 2014
19.5.4 Business Segmentation by Revenue 2013 and 2014
19.5.5 Geographical Segmentation by Revenue 2014
19.5.6 Recent Developments
19.5.7 SWOT Analysis
20. Other Reports in this Series
Complete Report: https://www.wiseguyreports.com/reports/38520-global-professional-hair-care-market-2015-2019
Continued……………
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