Global Liquid Encapsulation Materials Market Size, Share, Development, Growth and Demand Forecast to 2020

The global liquid encapsulation materials market is growing, due to upsurge in demand for consumer electronics products, increasing demand for advanced packaging techniques and trend of miniaturization of electronic products. The increasing automotive electronics application is providing ample opportunities for the growth of the global liquid encapsulation materials market in the coming years. However, the sluggish demand for liquid encapsulates in the developed regions such as Europe and North America is restraining the growth of the global liquid encapsulation materials market.

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The Asia-Pacific liquid encapsulation materials market leads the global liquid encapsulation market; and is also expected to grow with the fastest rate. This is due to the growing demand from optoelectronics, wireless technologies and sensors devices segment in the Asia- Pacific liquid encapsulation market. Additionally, Asia-Pacific countries such as South Korea, Taiwan, China and Japan are expected to provide ample opportunities for the growth of the liquid encapsulation materials market in the region, due to up surging telecommunication and electronics sector in these countries, which is likely to fuel the growth of the global liquid encapsulation materials market.

With the development of advanced process technologies and products for numerous applications and end users, the semiconductor technology has rapidly evolved within few years. The strong research initiatives, advancements in the sensors market, growing investments from private and public firms, upsurge in the consumer electronics market, and growing market for integrated circuits are some of the factors driving the growth of the semiconductor industry.

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Encapsulation offers high thermal conductivity, low warpage, and low stress in the packaging processes of all types of semiconductor and electronic devices. Encapsulation can be done in two ways: liquid encapsulation and solid encapsulation. Epoxy-molding compounds blended with flame retardants, hardeners, fillers, solid epoxy resins, and several other additives, are used as solid encapsulants in the process of encapsulation. Liquid encapsulants hold the similar compositions just like solid encapsulants; however hardener and resin have liquid in them and allow direct use of material onto the chip. Liquid encapsulants interconnect generally through wire bonding, as an alternative of molding. Some of the commonly used types of encapsulants are polymer, plastic, glass, ceramic and metal. In the liquid encapsulation process, the encapsulants are embedded on the device to ensure the proper functioning of the device and overcome the problems, such as improper connections of electrical components in devices.

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