Press release
Flip Chip Market Spurred By Advancement Of Technology
Flip Chip Market deals with semiconductor devices integrating them with external circuit with solder bump on the chip pads. Flip chip is a method of interconnecting semiconductor devices with solder bumps. This technology by general electric’s light military electronics department. These offer reduced size of devices with high performance.Chip package allows easy handling and assembly onto printed circuit boards and protects devices from damage. Wafer packaging is a mechanism that packaging an integrated circuit while still part of the wafer, in contrast to more conventional method of slicing it into some parts and then packing it. Wafer level packaging consists of extending the water fab processes to include device interconnection and device protection processes. The major applications of this are smart phones. Flip Chip Market increases with rise in new technology.
Wafer bumping process is gradually replacing wire bonding as the interconnection of choice for some good growing number of components. Actually, wafer bumping is the process where solder is in the form of bumps and applied to the device at wafer level. Flip Chip Market tries to integrate more circuits for better growth.
Scope & Regional Forecast of the Flip Chip Market:
Semiconductor packaging is more a metal, glass or ceramic casing containing one and many semiconductor electronic components. Semiconductor package may have as less as two leads for devices like diodes. This is cheaper than wire bonding. Flip Chip Market is also increasing in electroplating sector.
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Flip Chip Market estimates that Asia-Pacific region will have highest growth due to the major manufacturing hubs present and also they are demanded.
Segmentations & Key Players Involved in the Flip Chip Market:
According to IndustryARC findings, the Flip Chip Market can be broken down into various segmentations on the basis of –
Joining process: Solder Joining, Thermo Compression, Thermo Sonic Joining, Joining by Adhesive and. others.
Bumping process: Copper (Cu) pillar, Lead (Pb) – free solders, Tin-Lead (Sn-Pb) eutectic solder, Gold stud and plated solder and others.
Packaging type: Flip Chip Ball Grid Array (fcBGA) Technology, Flip Chip Chip Scale Package (fcCSP) Technology, Wafer Level Packaging and Others.
Application: 2D logic system-on-a-chip (SoC), Light Emitting Diode, Memory, Imaging, Integrated Circuits and Others.
End user: Telecommunications, Consumer Electronics (Smartphones, Laptops, Personal Computers and Gaming Devices), Automotive, Industrial (Robotics and Others), Medical devices and others.
Geographic Location: Americas, Europe, Asia-Pacific and Rest of the world.
Some of the key players involved in the Flip Chip Market according to IndustryARC are as follows:
Samsung Group
Global Foundries
Intel Corporation
Nepes Ltd.
Amkor technology
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About IndustryARC:
IndustryARC is a Research and consulting firm that publishes more than 500 Reports Annually in various industries, such as Agriculture, Automotive, Automation & Instrumentation, Chemicals and Materials, Energy and Power, Electronics, Food & Beverages, Information Technology, Life sciences & Healthcare.
IndustryARC primarily focuses on Cutting Edge Technologies and Newer Applications of the Market. Our Custom Research Services are designed to provide insights on the constant flux in the global demand-supply gap of markets. Our strong analyst team enables us to meet the client research needs at a very quick speed with a variety of options for your business.
We look forward to support the client to be able to better address customer needs; stay ahead in the market; become the top competitor and get real-time recommendations on business strategies and deals. Contact us to find out how we can help you today.
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