ULVAC Launches NA-1500 Dry Etching System for 600mm Advanced Packaging Substrates

Chigasaki, Japan - (JCN Newswire) - ULVAC, Inc. is pleased to announce the NA-1500 dry etching system for 600mm advanced packaging substrates, providing for uniform Descum and Ti etching processes.

Higher data transfer speeds require higher-density packaging technologies, while advanced mobile and wireless devices require thinner and higher-pin-count IC packages. Fan-Out Wafer Level Packaging (FO-WLP) is widespread, while Panel Level Packaging increases substrate size from 300mm to 600mm.

While there are many 200mm/300mm wafer dry etching systems in the market today, there was no dry etching system for 600mm substrates, providing for a uniform Descum process and Ti etching process. ULVAC developed the new system to address this need, and support mass-produced packaging processes.

The new NA-1500 dry etching system is made possible by enhancing our proven plasma source. Our plasma source enables fast, low-temperature etching in the resin layer, which had been previously impossible with existing CCP methods.

Our plasma source is also applicable to fluorine gases, so seed layer Ti etching, which requires a wet process, can proceed without side etching. SiO2 and SiN etching is available on the NA-1500 as well.

The NA-1500 dry etching system provides stable transfer and processes without abnormal discharge, ensuring warpage from the enlarged substrate is never an issue.

Applications:
1. Descum
2. Desmear
3. Surface treatment (Hydrophobicity Hydrophilicity)
- Pretreatment for wet process such as plating, etc.
- Pretreatment for underfill
4. Resin material ashing
5. Seed layer Ti etching
6. SiO2/SiN etching

Notes:
1. Descum: Removal of residue (scum) in photolithography of photopolymer
2. CCP: Capacitive Coupling Plasma
3. Desmear: Removal of residue (smear) in Via formation with laser drill
4. Full Release with Process Performance (PDF) http://bit.ly/2nJgf4M

ULVAC has sold more than 200 dry etching systems since releasing its first 200mm wafer system more than 20 years ago. We continue to support the industry by providing systems that meet customer's future needs for flexible, invisible and wearable devices.

ULVAC, Inc. is a Japan-based vacuum equipment manufacturer. Founded in 1952, ULVAC has contributed to the development of industry and technology through the comprehensive use of vacuum technology and its peripheral technology. Our solutions comprise equipment, materials, analytic evaluation, vacuum components and various services for flat panel displays, solar cells, semiconductors, electronic components, and general industrial equipment. For more information, please visit www.ulvac.co.jp/en/.

Masahiro Harada
ULVAC, Inc.
Corporate Sales & Marketing Division I
Advance Electronics Equipment Sales Dept.
Chigasaki, JAPAN
TEL: +81-467-89-2139 / FAX: +81-467-89-2254

This release was published on openPR.