Press release
Copper Foil Market 2017- Fukuda, Mitsui Mining & Smelting, Hitachi Cable, Furukawa Electric, JX Nippon Mining & Metal Products
“Copper foil is a foil form of copper less than the thickness of 150μm and there are two types, a rolled copper foil and an electrolytic copper foil. Normally, a rolled copper foil is made by rolling and annealing electrolytic copper continuously and there is a restriction of the length. In contrast, an electrolytic copper foil has no restriction of the length. Copper Foils are mostly used for printed circuit boards, flexible printed circuit boards, and lithium-ion batteries.
Scope of the Report:
This report focuses on the Copper Foil in Global market, especially in North America, Europe and Asia-Pacific, South America, Middle East and Africa. This report categorizes the market based on manufacturers, regions, type and application.
Market Segment by Manufacturers, this report covers
Fukuda
Mitsui Mining & Smelting
Hitachi Cable, Furukawa Electric
JX Nippon Mining & Metal Products
Olin Brass
Circuit Foil
3M, LS Mtron
Iljin Materials
CCP
NPC
Co-Tech
LYCTh
Jinbao Electronics
Kingboard Chemical
KINWA
Tongling Nonferrous Metal Products
For Detail Research Report and TOC visit at: http://marketinsights.biz/global-north-america-europe-and-asia-pacific-south-america-middle-east-and-africa-copper-foil-market-2017-forecast-to-2022/
Market Segment by Regions, regional analysis covers
North America (USA, Canada and Mexico)
Europe (Germany, France, UK, Russia and Italy)
Asia-Pacific (China, Japan, Korea, India and Southeast Asia)
South America (Brazil, Argentina, Columbia etc.)
Middle East and Africa (Saudi Arabia, UAE, Egypt, Nigeria and South Africa)
Market Segment by Type, covers
Type 1
Type 2
Market Segment by Applications, can be divided into
Printed Circuit Board
Lithium-ion Batteries
Electromagnetic Shielding
Other
Finally, The study analyzes market competition and industry players. This report Describe Copper Foil sales channel, distributors, traders, dealers, Research Findings and Conclusion, Appendix, methodology and data source
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