AI Data Center Liquid Cooling Market: NVIDIA, Ecolab, Molex & Next-Gen Cooling, $27B Growth, 120kW Racks & New Partnerships

AI Data Center Liquid Cooling Market reached US$ 3.39 billion in 2025 and is expected to reach US$ 23.23 billion by 2035, growing at a CAGR of 21.21% during the forecast period 2026-2035.

DataM Intelligence has released its latest "AI Data Center Liquid Cooling Market Size 2026" report, delivering comprehensive insights into market trends, growth opportunities, competitive dynamics, and regional performance. The report covers market size by value and volume, CAGR forecasts, and emerging opportunities, the report delivers data-driven insights into industry developments, competitive trends, and future market outlook, enabling more effective strategic planning and market expansion.

1. Trinovium & Echelon Target AI's Liquid Cooling Challenge

• Trinity Biotech's Trinovium partnered with Echelon Data Centres to develop direct-to-chip cooling fluids and thermal-management solutions for AI infrastructure.

• The collaboration targets a liquid-cooling segment projected to grow from US$4 billion in 2026 to US$27 billion by 2033.

• Trinovium will contribute ultra-high-purity fluids and monitoring technology, while Echelon brings hyperscale data-center infrastructure expertise.

• Echelon: More than 700 MW under development and over 1.4 GW of secured capacity across its strategic markets.

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United States: Recent Industry Developments

✅ July 2026: Ecolab completed its approximately US$4.75 billion acquisition of CoolIT Systems, strengthening its direct liquid cooling platform for high-density AI data centers.

✅ June 2026: JetCool, a Flex company, launched a liquid-cooled Dell PowerEdge XE7745 server solution, integrating direct-to-chip cooling with deployment and lifecycle services for enterprise AI.

✅ May 2026: LiquidStack commercially launched its GigaModular CDU platform, offering scalable liquid cooling capacity up to 14 MW for high-density AI infrastructure.

✅ January 2026: LiquidStack secured a 300 MW CDU order from a major U.S. data center operator to support multi-site AI-ready data center deployments.

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Top List of Key Player:

Schneider Electric SE, Vertiv Group Corporation, Asetek A/S, LiquidStack Inc., Submer Technologies SL, CoolIT Systems Inc., Midas Green Technologies LLC, Iceotope Technologies Limited, Chilldyne Inc. and Asperitas BV.

Key Industry Developments 2026:

✅ July 2026: Ecolab completed its approximately US$4.75 billion acquisition of CoolIT Systems, expanding its direct liquid cooling capabilities for high-density AI data centers and positioning the company across the AI infrastructure cooling value chain.

✅ June 2026: JetCool, a Flex company, launched a liquid-cooled Dell PowerEdge XE7745 server solution, combining direct-to-chip cooling with deployment, commissioning, maintenance, and warranty services for enterprise AI infrastructure.

✅ May 2026: Dell Technologies introduced its 18th-generation PowerEdge servers with advanced air and liquid cooling designs, including the liquid-cooled PowerEdge M9825 for high-density AI and HPC workloads.

✅ April 2026: Carrier Ventures expanded its investment in ZutaCore, strengthening Carrier's liquid cooling capabilities and advancing waterless direct-to-chip cooling solutions for high-density AI data centers.

✅ March 2026: Alfa Laval launched FreeWaterLoop, a liquid-based data center cooling system combining pumps, heat exchangers, and filtration to support high-density computing while reducing net water consumption.

✅ February 2026: Trane Technologies announced an agreement to acquire LiquidStack, strengthening its end-to-end data center thermal management portfolio with direct-to-chip and immersion cooling technologies for AI-scale workloads.

✅ January 2026: LiquidStack secured a 300 MW Coolant Distribution Unit order from a major U.S. data center operator to support multi-site AI-ready infrastructure deployments.

2. 120 kW AI Racks Push Data Centers Beyond Air Cooling

• NVIDIA GB200 racks: Consume approximately 120 kW, compared with air cooling capacity of roughly 20-30 kW per rack.

• Direct liquid cooling can remove approximately 60-80% of generated heat directly from high-performance chips.

• Asia: Shanghai's Hai Lan Yun launched a 24 MW underwater data center, using more than 95% renewable energy and seawater cooling.

How Our Market Research Process Works 2026-2033:

The AI Data Center Liquid Cooling Market report by DataM Intelligence delivers comprehensive insights backed by extensive primary and secondary research. It analyzes key market trends, competitive dynamics, regulatory developments, technological advancements, emerging innovations, and growth opportunities while highlighting potential challenges and evolving market conditions. The report provides actionable intelligence to support strategic planning and identify future market potential.

Latest M & A/ partnerships in 2026:

• July 2026: Ecolab completed its $4.75 billion acquisition of CoolIT Systems, adding direct liquid cooling, coolant distribution units, cold plates and thermal-management technologies for AI data centers.

• April 2026: Vertiv acquired Strategic Thermal Labs, strengthening its liquid-cooling portfolio with advanced cold-plate design capabilities for high-density AI and data center applications.

• March 2026: Vertiv acquired ThermoKey, expanding its data center cooling portfolio with dry coolers and microchannel heat-exchanger technologies.

• February 2026: Trane Technologies agreed to acquire LiquidStack, adding direct-to-chip and immersion cooling technologies designed for high-density generative AI and hyperscale workloads; financial terms were not disclosed.

• February 2026: Johnson Controls signed an agreement to acquire Alloy Enterprises, adding advanced direct-liquid-cooling components and thermal-management technology for high-performance data centers.

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Japan: Recent Industry Developments

✅ July 2026: Daikin Industries and NTT DATA launched a joint AI-driven data center cooling optimization PoC, integrating HVAC, chiller and liquid cooling controls for AI server environments.

✅ June 2026: Nidec developed the STC 1.0 prototype, a stackable liquid cooling solution allowing up to five OCP-compliant CDU units to be configured according to server cooling requirements.

✅ June 2026: IIJ, NTT DATA and Hibiya Engineering began a joint verification project for hybrid air- and liquid-cooling in modular edge data centers supporting high-density AI infrastructure.

✅ January 2026: KDDI commenced operations at its Osaka Sakai Data Center, implementing direct liquid cooling alongside conventional air cooling for NVIDIA GB200 NVL72 AI servers.

4. Ferveret Brings Nuclear-Reactor Cooling to AI Data Centers

• Ferveret, founded by two MIT researchers, developed Adaptive Phase Cooling (APC) using controlled boiling to remove chip heat.

• Testing with CleanSpark, FuriosaAI and Switch showed a 15% improvement in computational power efficiency versus leading liquid-cooling systems.

• Ferveret says its power-control technology can deliver 35% more AI tokens with the same power, while consuming zero water.

• The startup is targeting resource-constrained regions including Africa, the Middle East and parts of the U.S.

3. Molex Invests in CAEPlus for Active Chip Cooling

• Molex invested in CAEPlus to advance BoundaryCool, an active liquid-cooling platform for GPUs, CPUs and TPUs.

• The technology actively removes processor heat while remaining compatible with legacy data-center infrastructure.

• The partnership targets AI and HPC data centers, where increasing processor power is creating higher thermal loads.

• Molex will retain exclusive licensing rights to apply CAEPlus technology across its pluggable I/O solutions.

Key Segmentation Plannings (2026):

By Cooling Technology: Direct-to-Chip Cooling, Single-Phase Immersion Cooling, Two-Phase Immersion Cooling, Rear-Door Heat Exchangers, Hybrid Air-Liquid Cooling and Spray/Jet Cooling

By Component: Solutions, Coolant Distribution Units, Cold Plates, Heat Exchangers, Pumps, Valves, Manifolds, Sensors, Leak Detection Systems, Coolants, Dielectric Fluids and Services

By Data Center Type: Hyperscale AI Data Centers, Colocation AI Data Centers, Enterprise AI Data Centers, Edge AI Data Centers and HPC & Research Facilities

By Workload: Generative AI Training, AI Inference, High-Performance Computing, Cloud AI Infrastructure, Semiconductor Design & Simulation, Defense and Research Computing and Enterprise Analytics

By End User: Cloud Service Providers, Colocation Providers, Server OEMs, Enterprises, Government & Defense, BFSI, Healthcare & Life Sciences, Telecom and Manufacturing

5. Rittal Positions Direct Liquid Cooling for High-Density AI

• Rittal is promoting Direct Liquid Cooling (DLC) for AI, HPC and accelerated-computing environments.

• DLC transfers heat directly from high-performance processors, supporting higher rack power densities than conventional air cooling.

• The technology can reduce dependence on room-level air cooling while improving thermal stability and energy efficiency.

• Europe: Rittal is positioning scalable DLC infrastructure for next-generation European data-center deployments.

6. Unisys & Refroid Build Global AI Cooling Services

• Unisys partnered with India-based Refroid Technologies to deploy and maintain liquid cooling for AI data centers.

• Refroid provides direct-to-chip, immersion cooling, CDUs and hybrid load-bank systems, while Unisys delivers global field services.

• Gartner: Global AI spending is forecast at US$2.59 trillion in 2026, including more than US$1.4 trillion in AI infrastructure.

• India: The partnership addresses the shortage of skilled expertise needed to deploy and service high-density AI cooling systems.

Global Market Growth Regional Analysis:

⇥ North merica (U.S., Canada, Mexico)

⇥ Europe (U.K., Italy, Germany, Russia, France, Spain, The Netherlands and Rest of Europe)

⇥ Asia-Pacific (India, Japan, China, South Korea, Australia, Indonesia Rest of Asia Pacific)

⇥ South America (Colombia, Brazil, Argentina, Rest of South America)

⇥ Middle East & Africa (Saudi Arabia, U.A.E., South Africa, Rest of Middle East & Africa)

7. Ecolab Expands Cooling Stack With CoolIT

• Ecolab expanded its AI data-center cooling portfolio through its acquisition of CoolIT Systems, combining hardware, fluid chemistry and monitoring.

• CoolIT: More than 25 years of direct-to-chip engineering experience and deployments across 300+ data centers, including NVIDIA and AMD projects.

• Ecolab's 3D TRASAR monitors coolant concentration, temperature, pH and flow to improve direct-to-chip system reliability.

• Global reach: Ecolab has approximately 48,000 associates across 170+ countries, supporting international deployment and service.

8. AI Rack Density Makes Liquid Cooling a Strategic Priority

• Ecolab reports AI rack densities have moved beyond 100 kW, creating new requirements for chip-level thermal management.

• NVIDIA's next-generation Vera Rubin platform is adopting 100% liquid cooling, reinforcing the shift toward liquid-based architectures.

• CoolIT + Ecolab: The combination brings direct-to-chip hardware, coolant chemistry, digital monitoring and lifecycle services under one platform.

• Industry focus: Ecolab is working with the Open Compute Project (OCP) on cooling practices and standardization as AI deployments scale globally.

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Market Drivers

• High-Density AI Racks: Advanced GPUs are pushing rack power levels beyond 100 kW, making liquid cooling essential for effective heat removal.

• AI GPU Infrastructure: Platforms such as NVIDIA GB200 and GB300 NVL72 use rack-scale liquid cooling to support dense GPU configurations and high-performance AI workloads.

• Lower Cooling Energy Costs: Direct-to-chip liquid cooling transfers heat more efficiently than air, reducing cooling-related electricity use and supporting better data center efficiency.

• Water & Sustainability Goals: Liquid cooling can operate with warmer coolant temperatures and reduce reliance on mechanical chillers, helping data centers lower water and cooling footprints.

FAQ's

Q1: What is the current market size of the AI Data Center Liquid Cooling Market and its future outlook?

Ans: The global AI Data Center Liquid Cooling Market reached US$ 3.39 billion in 2025 and is forecast to attain US$ 23.23 billion by 2035

Q2: How fast is the AI Data Center Liquid Cooling Market expected to grow during the forecast period?

Ans: The market is projected to expand at a CAGR of 21.21% from 2026 to 2035, reflecting strong growth potential over the forecast period.

Q3: Which region leads the AI Data Center Liquid Cooling Market?

Ans: North America accounted for the largest market share in 2025

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