Advanced Spectral Technology to Demonstrate the Zentura Wafer-Level Metrology System at the 2026 Kyushu Semiconductor Industry Exhibition

AST will show a live Zentura system at the NANYO Corporation booth at Marine Messe Fukuoka, September 30 to October 1, 2026, with an AST applications engineer on-site for technical discussions.
SIMI VALLEY, Calif. - August 17, 2026 - Advanced Spectral Technology, Inc. (AST) will demonstrate its Zentura Wafer Level Metrology System [https://advancedspectral.com/metrology-systems/zentura-wafer-metrology-system/] at the 2026 Kyushu Semiconductor Industry Exhibition, held September 30 and October 1, 2026 at Marine Messe Fukuoka Halls A and B in Fukuoka City, Japan. The system will be exhibited in the Na row booth of NANYO Corporation, AST's partner in Japan.

The exhibition brings together approximately 450 exhibiting companies and 14,000 visitors across semiconductor design, manufacturing equipment and software, materials, testing and inspection services, and factory equipment. Kyushu remains one of the highest-density semiconductor manufacturing regions in Japan, with substantial front-end and back-end capacity concentrated across the island.

Zentura is a high-precision metrology platform that supports wafer thickness, adhesive layer thickness, etch depth, wafer shape, and vision-based critical dimension measurements on wafers up to 300mm (Larger wafers and panels can also be supported). The platform integrates flexible sensor options developed to address critical wafer processing applications within a turnkey system, allowing a single tool to be configured against the specific measurement requirements of a process line rather than a fixed set of capabilities.

Zentura measurement capabilities include:

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Wafer & multi-layer thickness measurement from 10 to 1200 microns

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Bonded wafer adhesive layer & photoresist measurement from 1 to 50 microns

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TSV/TGV and etch depth measurement without aspect-ratio limitations, on trenches down to 1m width and vias down to 1m diameter

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Vision-based CD measurement of line width, feature diameter, and alignment with accuracy better than 0.1m

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Wafer shape measurement including bow, warp, and flatness

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Thickness mapping with TTV, Avg, STD, TIR, and Min/Max reporting

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Throughput up to 60 WPH

The measurements are performed by three selectable sensor options. The AS4000 optical stylus handles wafer shape and step height with 10nm sensitivity across a 100m range. The AS5000 white light thickness sensor maps ultra-thin silicon from 0.45m with 2nm sensitivity and repeatability under 10nm (3). The AS6000 IR thickness sensor maps silicon up to 1.4mm and measures etch depth independent of aspect ratio and vibration, at data rates to 20 KHz.

Zentura is available in manual load or fully automated configurations, supports wafer sizes from 50mm to 300mm, and is compatible with ISO 5 (Class 100) and ISO 4 (Class 10) cleanroom environments. The platform is Semi S2/S8 protocol compliant and integrates with factory automation through a SECS-GEM interface. Measurement recipes are built in the ScopeViewer3 Software Application Suite with flexible part-programming and recipe generation in a Python layer.

The unit on the exhibition floor will be a manual-load Zentura configuration, shipped from AST's Simi Valley facility for live demonstration. Automated wafer handling options, including cassette, SMIF, and FOUP load ports, will be presented alongside the system.

"Wafer-level metrology requirements differ from one process line to the next, which is why Zentura was built as a configurable platform capable of integrating different AST sensor technology that is best optimized for the product characteristics and measurement requirements" said Randy Anderson, VP of Business Development at Advanced Spectral Technology. "Bringing a working system to Fukuoka lets engineering teams evaluate the technology, and gives us the chance to work through specific applications with manufacturers across the region."

An AST applications and sales engineer will be present in the NANYO booth for both days of the exhibition to answer technical questions, review measurement applications, and discuss system configuration.

Event details

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Event: 2026 Kyushu Semiconductor Industry Exhibition

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Dates: September 30 and October 1, 2026, 10:00 to 17:00

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Venue: Marine Messe Fukuoka, Halls A and B, Fukuoka City, Japan

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Booth: NANYO Corporation, Na row, Booth B8-18

About Advanced Spectral Technology

Advanced Spectral Technology, Inc. develops and manufactures turnkey multi-spectral imaging systems for defect inspection and metrology. From its facility in Simi Valley, California, AST builds configurable platforms serving semiconductor fabrication, MEMS, VCSEL, advanced packaging, and power semiconductor manufacturing, with imaging across the visible, NIR, SWIR, MWIR, and UV spectrums. AST is ISO 9001:2015 certified and provides NIST traceable calibration services. The company works collaboratively with customers across their respective engineering teams to configure systems against specific process requirements. Learn more at https://advancedspectral.com/.

About NANYO Corporation

NANYO Corporation is a general machinery trading company headquartered in Fukuoka, Japan, founded in 1950 and listed on the Tokyo Stock Exchange Standard Market. Through its Industrial Machinery Sales Division and Construction Machinery Sales Division, NANYO sells and manufactures semiconductor equipment and supplies components and consumable parts, serving customers in Japan and across Asia. NANYO acts as a distributor in Japan for overseas equipment manufacturers, supporting them from sales through installation and after-sales service. The company employs 155 people, 475 on a consolidated basis.

Media Contact
Company Name: Advanced Spectral Technology
Contact Person: Randy Anderson
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City: Simi Valley
State: CA
Country: United States
Website: https://advancedspectral.com/

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