Global 3D IC Market Set for Rapid Growth, To Reach Around $8.6 Bn by 2020

Zion Research has published a new report titled “3D IC (LED, Memories, MEMS, Sensor, Logic and Others) Market by Substrate Type (Silicon On Insulator and Bulk Silicon) and by Fabrication Process (Silicon Epitaxial Growth, Beam Re-Crystallization, Solid Phase Crystallization and Wafer Bonding) for Information and Communication Technology, Military, Consumer Electronics and Others Applications: Global Industry Perspective, Comprehensive Analysis and Forecast, 2014 – 2020.” According to the report, global demand for 3D IC market was valued at USD 2.9 billion in 2014, and is expected to reach USD 8.6 billion in 2020, growing at a CAGR of 17.0% between 2015 and 2020.

3D IC is an innovative technology that is primarily employed in the electronic industries. 3D IC helps to reduce the size of the component used in any system such as consumer goods and also increase the capability such as speed, memory, efficiency and durability. Hence, 3D IC technology is becoming popular in various industries and seems to be used at growing extent.

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LED, memories, MEMS, sensor, logic are some of the key product segments of the 3D IC market. Memories, MEMS and sensors emerged as a dominating product segments and they were accounted together around 60% share of the total revenue generated in 2014. Memory segment is expected to grow due to growing demand for the expanded memory devices coupled with advancing technologies and trends. LED is another product segmented that is expected to grow with a significant share due to rising adoption of LED products as it saves power consumption and provides efficiency.

Silicon on insulator (SOI) and bulk silicon are the major segments of 3D IC market based on substrate type. SOI segment dominated the global 3D IC market and accounted for significant share of the entire market in 2014. This is owing to its ability of reducing the surplus heat production and parasitic capacitance.

Based on fabrication process, the 3D IC market is segmented as silicon epitaxial growth, beam re-crystallization, solid phase crystallization and wafer bonding. Wafer bonding is highly used fabrication process for 3D IC. This process helps to stack the IC and makes the IC size thin compared to the conventional IC.

Information and communication technology, military, consumer electronics are the key applications sectors of global 3D IC market. In 2014, information and communication technology emerged as a leading segment and it accounted for around 25% share of the entire market. ICT is also predicted to continue the trend during the forecast period due to the high adoption rate of 3D IC integration technology. Consumer electronics is another important segment of the market that is likely to grow with consistent rate due rising demand for consumer electronics products with smaller size and enhanced performance.

Based on regional segmentation, Asia Pacific dominated the global 3D IC market and accounted for over 40% share of the total market in 2014. It is also estimated to be the fastest growing market during the estimated period due to strong demand from emerging consumer electronics industries. Asia Pacific is followed by North America and Europe. North America was the second largest market for 3D IC and further it is expected to witness strong growth over the forecast period. 3D IC market in North America is predicted to be mainly driven by demand from the U.S. and Canada.

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Some of the key players of global 3D IC market include 3M Company, Tezzaron Semiconductor Corporation, Xilinx, United Microelectronics Corporation, Samsung, Taiwan Semiconductor Manufacturing Company, Ltd., STMicroelectronics and amongst others.

This report segments the global 3D IC market as follows:

3D IC Market: Product Segment Analysis

LED
Memories
MEMS
Sensor
Logic
Others
3D IC Market: Substrate Segment Analysis

Silicon on Insulator (SOI)
Bulk Silicon
3D IC Market: Fabrication Process Segment Analysis

Silicon Epitaxial Growth
Beam Re-Crystallization
Solid Phase Crystallization
Wafer Bonding
3D IC Market: Application Segment Analysis

Information and Communication Technology
Military
Consumer Electronics
Others
3D IC Market: Regional Segment Analysis

North America
Europe
Asia Pacific
Latin America
Middle East and Africa

Browse the full “3D IC (LED, Memories, MEMS, Sensor, Logic and Others) Market by Substrate Type (Silicon On Insulator and Bulk Silicon) and by Fabrication Process (Silicon Epitaxial Growth, Beam Re-Crystallization, Solid Phase Crystallization and Wafer Bonding) for Information and Communication Technology, Military, Consumer Electronics and Others Applications: Global Industry Perspective, Comprehensive Analysis and Forecast, 2014 – 2020” report at http://www.marketresearchstore.com/report/3d-ic-market-z51272

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