SiC Wafer Thermal Laser Separation Cutting Equipment Market Set to Surge - Key Insights You Must Know

SiC Wafer Thermal Laser Separation Cutting Equipment Market Size

The global market for SiC Wafer Thermal Laser Separation Cutting Equipment was valued at US$ 15 million in the year 2024 and is projected to reach a revised size of US$ 25.5 million by 2031, growing at a CAGR of 8.0% during the forecast period.

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According to our Semiconductor Research Center, in 2022, the global SiC wafer was valued at US$ 750 million, will grow rapidly in next six years, driven by the strong demand from electric vehicle (EV). Currently the 6 inch SiC substrates are dominating this market, and in next six years, more players will put into production the 8 inch SiC wafers. Currently the key players of SiC are mainly located headquartered United States, Europe, Japan and China, especially in China, more companies are entering the SiC market. It is predicted that, Chinese companies will play key roles in the SiC market in next ten years.

Report Scope

This report aims to provide a comprehensive presentation of the global market for SiC Wafer Thermal Laser Separation Cutting Equipment, with both quantitative and qualitative analysis, to help readers develop business/growth strategies, assess the market competitive situation, analyze their position in the current marketplace, and make informed business decisions regarding SiC Wafer Thermal Laser Separation Cutting Equipment.

The SiC Wafer Thermal Laser Separation Cutting Equipment market size, estimations, and forecasts are provided in terms of output/shipments (K Units) and revenue ($ millions), considering 2024 as the base year, with history and forecast data for the period from 2020 to 2031. This report segments the global SiC Wafer Thermal Laser Separation Cutting Equipment market comprehensively. Regional market sizes, concerning products by Type, by Application, and by players, are also provided.

For a more in-depth understanding of the market, the report provides profiles of the competitive landscape, key competitors, and their respective market ranks. The report also discusses technological trends and new product developments.

The report will help the SiC Wafer Thermal Laser Separation Cutting Equipment manufacturers, new entrants, and industry chain related companies in this market with information on the revenues, production, and average price for the overall market and the sub-segments across the different segments, by company, by Type, by Application, and by regions.

Market Segmentation

By Type
• for 6 inches wafer
• for 8 inches wafer

By Application
• Foundry
• IDM

Key Companies
3D-Micromac AG

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