Segment Evaluation and Major Growth Areas in the Wire-to-Board Connector Market

The wire-to-board connector market is positioned for steady expansion over the coming years, driven by technological advancements and increasing demand across various industries. As connectors become more sophisticated and applications more diverse, this market is set to experience significant growth through 2030. Let's explore the current market size, key players, emerging trends, and important segments shaping this industry.

Projected Market Size of the Wire-to-Board Connector Industry by 2030
The wire-to-board connector market is expected to grow steadily, reaching a valuation of $6.41 billion by 2030. This reflects a compound annual growth rate (CAGR) of 5.0% during the forecast period. The expansion is largely fueled by rising demand for high-power and miniaturized connectors, the growth of electric mobility applications, increasing automation in industrial systems, the proliferation of smart consumer electronics, and innovations in PCB testing and power supply solutions. Important trends anticipated to influence the market include the adoption of intelligent high-density connectors, IoT-enabled PCB connectivity, advancements in automated manufacturing for precise connector production, rising electrification requirements, and the use of AI for quality inspection.

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Key Industry Leaders in the Wire-to-Board Connector Market
The market features a mix of prominent global companies driving innovation and supply, including Hon HAI Precision Industry Co Ltd., Yamaichi Electronics Co. Ltd., 3M Co., Fujitsu Limited, Luxshare Precision Industry Co. Ltd., Kyocera Corporation, TE Connectivity Ltd., Amphenol Corporation, Molex LLC., Phoenix Contact GmbH and Co KG., ITT Inc., Japan Aviation Electronics Industry Ltd., Panduit Corp., Hirose Electric Co Ltd., Wurth Elektronik GmbH and Co KG., Harting Technology Group, Lemo SA, Samtec Inc., Smiths Interconnect Inc., AVX Corporation, Glenair, Souriau SAS, ERNI Deutschland GmbH, Rosenberger Group, I-PEX Inc., Omnetics Connector Corporation, JST MFG Co Ltd., Nicomatic SA, and Advanced Interconnections Corp.

Significant Acquisition Strengthens Molex LLC's Position
In December 2024, Molex LLC, a technology and manufacturing firm based in the U.S., acquired AirBorn Inc. for an undisclosed sum. This acquisition aims to broaden Molex's portfolio of ruggedized, high-performance interconnect solutions, particularly catering to demanding aerospace, defense, and industrial applications. AirBorn Inc. specializes in engineered interconnect solutions, offering custom connectors, power products, and RF components for mission-critical environments.

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How Innovation and New Technologies Are Shaping Market Trends
Companies in the wire-to-board connector space are increasingly focusing on developing innovative products to meet evolving needs. A prime example is the rise of USB 3.2 compatible connectors, which support faster data transfers and reliable connections across automotive and electronics sectors. These connectors provide data transmission speeds up to 20 Gbps, surpassing previous USB standards, and facilitate efficient transfer of data, video, and power.

For example, in February 2025, Hirose Electric Co. Ltd., based in Japan, launched its AU1 Series, a USB 3.2 compatible wire-to-board connector specifically designed for automotive use. This series builds on the internal design of their CX Series USB Type-C connectors, offering high-speed signal transmission while complying with strict automotive standards such as USCAR-2 and USCAR-30 for vibration and heat resistance. It features a reinforced shell, Connector Position Assurance (CPA) mechanism, and multiple key codes to enhance reliability and design flexibility. The AU1 Series is suitable for in-vehicle infotainment systems, internal signal transmission, and charging ports, supporting USB 3.2 Gen2, DisplayPort 1.4, and HDMI standards. Plans include expanding the series to 24-pin versions to address a wider range of automotive connection needs.

Detailed Segment Breakdown of the Wire-to-Board Connector Market
The market for wire-to-board connectors is categorized into several key segments:
1) By Type: Below 1.00 mm, 1.00 mm to 2.00 mm, Above 2.00 mm
2) By Style: Accessory, Header, Housing, Plug, Receptacle, Socket
3) By Application: Transportation, Consumer Electronics, Communications, Industrial, Military, and Other Applications

Further subcategories include:
- Below 1.00 mm: 0.30 mm, 0.50 mm, 0.75 mm
- 1.00 mm to 2.00 mm: 1.00 mm, 1.25 mm, 1.50 mm, 1.75 mm, 2.00 mm
- Above 2.00 mm: 2.50 mm, 3.00 mm, 4.00 mm, 5.00 mm

This comprehensive segmentation offers detailed insight into connector sizes, styles, and industries served, supporting targeted development and market strategies.

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This release was published on openPR.