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Competitive Analysis: Leading Companies and New Entrants in the Connected Packaging Market
The connected packaging sector is set to experience significant expansion over the coming years, driven by technological advances and changing market demands. As digital integration becomes more prevalent, the industry is poised for rapid growth, with new innovations enhancing both consumer engagement and supply chain efficiency. Let's explore the current market size projections, influential players, emerging trends, and detailed segmentation shaping the connected packaging field.Projected Market Size and Growth Drivers in the Connected Packaging Market
The connected packaging market is predicted to grow rapidly, reaching a value of $57.55 billion by 2030, at a compound annual growth rate (CAGR) of 10.6%. This upward trajectory is largely fueled by the increasing adoption of Internet of Things (IoT) enabled packaging and a stronger focus on digital integration. Additionally, rising demands for effective anti-counterfeiting solutions, the expansion of e-commerce and retail channels, and a growing commitment to sustainability in packaging are key contributors to this growth. Leading trends expected to influence the market during the forecast period include breakthroughs in augmented reality packaging, intelligent sensor innovations, the development of comprehensive connected packaging platforms, advancements in data analytics tools, and the integration of blockchain technology to ensure product traceability.
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Key Players Making an Impact in the Connected Packaging Landscape
The connected packaging market features several prominent companies that play a vital role in driving innovation and market penetration. Some of the major participants include International Paper Company, Tetra Pak International S.A., Amcor plc, Ball Corporation, Avery Dennison Corporation, Mondi plc, Smurfit Kappa Group plc, CCL Industries Inc., Multi-Color Corporation, Fedrigoni S.p.A., SML Group Limited, Impinj Inc., ePac Flexible Packaging, Paragon ID, Identiv Inc., PragmatIC Semiconductor Ltd., Wiliot Ltd., Tadbik Ltd., WestRock Company, and Touchcode Inc.
In a notable development, October 2024 saw Japan-based TOPPAN Holdings Inc., a provider of printing, security, and integrated digital solutions, acquire Belgium's Selinko SA for an undisclosed sum. This strategic acquisition aims to bolster TOPPAN's IoT and smart packaging capabilities, particularly focusing on NFC-based ID authentication and anti-counterfeit technologies tailored for luxury brands, thereby enhancing the connected packaging offerings.
View the full connected packaging market report:
https://www.thebusinessresearchcompany.com/report/connected-packaging-market-report
Current Trends Driving Innovation in Connected Packaging
Leading companies in the connected packaging industry are prioritizing the development of consumer-centric technologies to enhance product engagement and supply chain transparency. Advances such as QR codes, NFC tags, and RFID are being integrated to create interactive packaging experiences, enable product authentication, and facilitate real-time data tracking throughout the product lifecycle.
A significant example of this momentum is the launch of the Consumer Connected Packaging initiative by the Active & Intelligent Packaging Industry Association (AIPIA) in November 2023. This program unites brands and technology partners to promote the adoption of various digital tools including QR codes, NFC, RFID, augmented reality, and blockchain technologies. The initiative supports large-scale deployment of connected packaging by enabling interactive traceability and fostering transparent consumer interactions. This collaboration marks a major technological leap, bridging innovative digital solutions with packaging and supply chain operational needs, and offering scalable benefits in transparency, engagement, and traceability.
Comprehensive Segmentation of the Connected Packaging Market
The connected packaging market report classifies the industry into several detailed segments to provide a clear understanding of its structure. These include:
1) By Component: This covers mobile applications, web applications, artificial intelligence recommendation engines, cloud backend services, and collaboration tools.
2) By Technology: Key technologies include machine learning, natural language processing, voice recognition, predictive analytics, and computer vision.
3) By Deployment Mode: The market is segmented into cloud-based solutions, on-device artificial intelligence, and hybrid deployment models.
4) By Application: This includes personal task management, professional workflow management, team collaboration, automated scheduling, reminder and notification management, and productivity tracking.
5) By End User: Important industries served include banking, financial services and insurance (BFSI), information technology and telecommunications, retail, healthcare, manufacturing, travel and hospitality, among others.
Further subsegments provide granular insights such as types of mobile apps (iOS, Android, cross-platform), web-based dashboards, AI-driven task prioritization models, cloud backend data management, and collaboration features like team messaging and shared task boards. These layers of segmentation offer a comprehensive view of the connected packaging market's ecosystem and potential growth areas.
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