United States Wi-Fi 6 & Wi-Fi 6E Chipset Market to Reach US$ 10.32 Billion by 2031 | Top Companies - Broadcom, Qualcomm, Intel, MediaTek & NXP | Exclusive Report by DataM Intelligence

Leander, Texas and Tokyo, Japan - Jan.22.2026
The Global Wi-Fi 6 And Wi-Fi 6E Chipset Market reached US$ 12.7 billion in 2025 and is expected to reach US$ 34.4 billion by 2031, growing with a CAGR of 13.3% during the forecast period 2025-2031.

The Wi-Fi 6 and Wi-Fi 6E chipset market is experiencing rapid growth as next-generation wireless connectivity becomes essential for high-speed, low-latency, and high-capacity networking. The expansion of remote work, cloud computing, video streaming, online gaming, and smart home ecosystems is driving strong demand for advanced Wi-Fi standards. Wi-Fi 6 improves efficiency and performance in dense environments, while Wi-Fi 6E unlocks the 6 GHz band, enabling wider channels, reduced interference, and ultra-low latency. Continuous innovation in semiconductor design, power efficiency, and AI-based network optimization is accelerating global adoption across consumer, enterprise, and industrial applications.

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Wi-Fi 6 and Wi-Fi 6E Chipset Market: Competitive Intelligence
Broadcom Inc | Qualcomm Technologies Inc | ON Semiconductor Connectivity Solutions Inc | Intel Corporation | Celeno | MediaTek Inc | Texas Instruments Incorporated | Cypress Semiconductor Corporation | STMicroelectronics N.V | NXP Semiconductors N.V.

In the Wi-Fi 6 and Wi-Fi 6E Chipset Market, Broadcom, Qualcomm, ON Semiconductor Connectivity Solutions, Intel, Celeno, MediaTek, Texas Instruments, Cypress Semiconductor, STMicroelectronics, and NXP Semiconductors collectively shape a highly competitive and innovation-driven ecosystem focused on delivering high-throughput, low-latency wireless solutions. These companies design and supply chipsets for routers, access points, smartphones, PCs, IoT devices, and enterprise networking equipment, enabling next-generation connectivity for data-intensive and latency-sensitive applications.

Individually and in combination, these players create strong competitive advantage through advanced RF design, system-on-chip (SoC) integration, and close partnerships with OEMs and telecom operators. Qualcomm and Broadcom lead in high-performance consumer and enterprise Wi-Fi platforms, powering premium routers and access points. Intel drives adoption in PCs and enterprise networking with integrated Wi-Fi solutions. MediaTek expands cost-efficient Wi-Fi 6/6E platforms for mass-market consumer electronics. NXP, STMicroelectronics, Texas Instruments, and ON Semiconductor support industrial, automotive, and IoT connectivity use cases, while Celeno and Cypress focus on performance optimization and embedded connectivity. Together, these companies are accelerating the transition to high-capacity, low-latency wireless networks and strengthening the foundation for smart homes, Industry 4.0, and next-generation digital infrastructure.

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United States: Recent Industry Developments
✅ In January 2026, major U.S. networking OEMs expanded deployment of Wi-Fi 6E-enabled enterprise access points to support high-density office and campus environments.

✅ In October 2025, leading chipset suppliers introduced power-optimized Wi-Fi 6/6E platforms for laptops and smartphones to extend battery life while maintaining high throughput.

✅ In July 2025, U.S. telecom and broadband providers accelerated rollout of Wi-Fi 6E home gateways to improve gigabit broadband performance.

✅ In April 2025, enterprise IT vendors integrated AI-based traffic management with Wi-Fi 6E chipsets to enhance network reliability and user experience.

Japan: Recent Industry Developments
✅ In January 2026, Japanese electronics manufacturers expanded adoption of Wi-Fi 6E chipsets in premium consumer electronics and gaming devices.

✅ In September 2025, telecom operators in Japan upgraded enterprise and public Wi-Fi infrastructure with Wi-Fi 6E to support high-capacity urban networks.

✅ In June 2025, semiconductor and device makers collaborated to integrate Wi-Fi 6/6E into smart factory and industrial IoT platforms.

✅ In March 2025, R&D initiatives focused on low-power Wi-Fi 6 chipsets for wearable and battery-powered IoT devices.

Segment Covered in the Wi-Fi 6 and Wi-Fi 6E Chipset Market
By Chipset
The market is segmented into Wi-Fi 6 chipsets and Wi-Fi 6E chipsets. Wi-Fi 6 dominates current deployments due to broader device compatibility and lower cost. Wi-Fi 6E is the fastest-growing segment, driven by demand for access to the 6 GHz band and ultra-high-speed, low-interference connectivity.

By Device
Devices include routers & gateways 35%, smartphones & tablets 25%, PCs & laptops 20%, enterprise access points 10%, and IoT & others 10%. Routers and gateways dominate due to rapid broadband upgrades, while smartphones and PCs drive high-volume chipset shipments.

By Application
Applications include consumer electronics 40%, enterprise networking 25%, industrial & IoT 15%, healthcare 10%, and automotive & transportation 10%. Consumer electronics lead adoption, while enterprise and industrial applications are growing rapidly with increased demand for reliable, low-latency wireless connectivity.

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Regional Analysis
North America - 38% Share
North America leads due to early adoption of Wi-Fi 6E, strong broadband infrastructure, and high enterprise IT spending.

Europe - 25% Share
Europe holds a significant share supported by smart city initiatives, enterprise network upgrades, and increasing consumer demand for high-speed home Wi-Fi.

Asia Pacific - 27% Share
Asia Pacific is the fastest-growing region, driven by large consumer electronics manufacturing, rapid smartphone adoption, and expanding 5G and broadband infrastructure in China, Japan, South Korea, and India.

Latin America - 6% Share
Latin America shows steady growth with gradual broadband upgrades and increasing demand for modern home and enterprise networking equipment.

Middle East & Africa - 4% Share
Middle East & Africa hold a smaller share, supported by smart city projects, enterprise digitalization, and gradual rollout of advanced wireless infrastructure.

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