Press release
Wafer Carrier Front Opening Unified Pod(FOUP) Market Set to Surge - Key Insights You Must Know
Wafer Carrier Front Opening Unified Pod(FOUP) MarketThe global market for Wafer Carrier Front Opening Unified Pod(FOUP) was valued at US$ million in the year 2024 and is projected to reach a revised size of US$ million by 2031, growing at a CAGR of %during the forecast period.
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Wafer carrier front opening unified pod(FOUP) is a device used in the semiconductor manufacturing process. It is used to store and transfer wafers. It has a front-opening structure to facilitate operators to put in or take out wafers. The wafer carrier front opening unified pod(FOUP) features a clean environment, anti-static design, lightweight design, standard size, marking and tracking, helping to ensure that by providing convenient operation, clean environment and safe storage and transfer functions Wafer safety and quality during manufacturing.
North American market for Wafer Carrier Front Opening Unified Pod(FOUP) is estimated to increase from $ million in 2024 to reach $ million by 2031, at a CAGR of % during the forecast period of 2025 through 2031.
Asia-Pacific market for Wafer Carrier Front Opening Unified Pod(FOUP) is estimated to increase from $ million in 2024 to reach $ million by 2031, at a CAGR of % during the forecast period of 2025 through 2031.
The major global manufacturers of Wafer Carrier Front Opening Unified Pod(FOUP) include Entegris, Miraial, Shin-Etsu Polymer, Pozzetta, 3S Korea, Victrex, Dainichi Shoji K.K., E-SUN, Gudeng Precision, Chung King Enterprise, etc. In 2024, the world's top three vendors accounted for approximately % of the revenue.
By Type
• 13 Pieces
• 25 Pieces
By Application
• 200mm (8 Inches)
• 300mm (12 Inches)
• 450mm (18 Inches)
Key Companies
Entegris, Miraial, Shin-Etsu Polymer, Pozzetta, 3S Korea, Victrex, Dainichi Shoji K.K., E-SUN, Gudeng Precision, Chung King Enterprise, Wuxi Zhuyi Technology, Anhui Xingyuhong Semiconductor Technology, Suzhou Xinjingzhou Semiconductor Materials, SJTC, MIRLE Group
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