EUV Mask Blanks Market Share Driven by Semiconductor Innovation and Advanced Lithography Demand | Valuates Reports

EUV Mask Blanks Market Size
The global market for EUV Mask Blanks was valued at US$ 591 million in the year 2024 and is projected to reach a revised size of US$ 1360 million by 2031, growing at a CAGR of 12.2% during the forecast period.

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The EUV Mask Blanks Market is witnessing strong momentum as semiconductor manufacturers accelerate the transition toward advanced lithography to support next-generation chip architectures. Market size expansion is fueled by rising demand for high-performance computing, increased device complexity, and rapid advancements in wafer patterning technologies. As chipmakers push toward higher transistor densities and improved yield performance, EUV mask blanks continue to gain market share due to their critical role in ensuring precision, defect control, and consistent optical performance. These market trends are further strengthened by growing adoption of AI chips, 5G devices, and advanced IC manufacturing.

In the type segment, Type 1 mask blanks hold the largest market share, supported by their widespread use across high-volume semiconductor production lines that require stable and reliable EUV reflectivity. Type 2 variants are expanding at a faster pace, driven by improvements in multilayer coating performance and enhanced defect mitigation. Both segments contribute meaningfully to the overall market growth as manufacturers diversify their mask blank portfolios to meet increasingly complex lithography requirements.

The semiconductor segment remains the dominant application, accounting for the highest market share due to continuous investment in leading-edge wafer fabrication and the rising adoption of EUV lithography across major foundries. The IC (integrated circuit) segment is experiencing the fastest market growth, supported by strong demand for miniaturized, power-efficient devices. Other applications add incremental opportunities as industries diversify into specialized circuit designs and advanced packaging solutions, further supporting a positive market forecast.

Companies such as Hoya, AGC Inc, S&S Tech, Applied Materials, and Photronics Inc hold significant influence in the competitive landscape. Their leadership is driven by advanced coating technologies, precision defect control capabilities, and strong relationships with global semiconductor fabs. These companies continue to strengthen market share through R&D investments, multilayer innovation, and strategic alignment with evolving customer requirements in advanced lithography.

Regionally, APAC dominates the EUV Mask Blanks Market, supported by its strong semiconductor manufacturing infrastructure and rapid technology adoption across leading foundries. North America shows robust market growth driven by innovation in chip design and advanced process technology, while Europe continues to expand through strategic investment in local semiconductor capabilities. Emerging markets across Southeast Asia and Latin America are contributing to demand through expanding electronics manufacturing ecosystems. The market forecast points toward sustained growth as technological innovation, capacity expansion, and continued EUV lithography adoption drive long-term development across all regions.

Segment by Type

• Type 1
• Type 2

Segment by Application

• Semiconductor
• IC (integrated circuit)
• Others

By Company

Hoya, AGC Inc, S&S Tech, Applied Materials, Photronics Inc

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