Back Grinding Tape and Dicing Tape Latest Industry Trends: Revenue, Price, Sales Analysis Report 2026

On Dec 9, the latest report "Global Back Grinding Tape and Dicing Tape Market 2026 by Manufacturers, Regions, Types and Applications, Forecast to 2032" from Global Info Research provides a detailed and comprehensive analysis of the global Back Grinding Tape and Dicing Tape market. The report provides both quantitative and qualitative analysis by manufacturers, regions and countries, types and applications. As the market is constantly changing, this report explores market competition, supply and demand trends, and key factors that are causing many market demand changes. The report also provides company profiles and product examples of some of the competitors, as well as market share estimates for some of the leading players in 2026.

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According to our (Global Info Research) latest study, the global Back Grinding Tape and Dicing Tape market size was valued at US$ 961 million in 2025 and is forecast to a readjusted size of USD million by 2032 with a CAGR of % during review period.
BGT (Backside Grinding Tape) is used to protect the wafer surface during back grinding after the IC is formed on the wafer. Attached on the circuit surface, it prevents damages to the circuit surface and pollutions to the wafer surface and improves the grinding accuracy of the wafer. Especially, it can perfectly protect the wafer pattern surface and the chip during the manufacturing process with its excellent physical and chemical properties. With developments of jumbo-sized and thinned wafer and high-bumped wafer, the function required to the BG tape are (1) low contamination levels, (2) highly close contact to wafer-, and (3) easiness of peeling. Dicing Tape is a type of adhesive tape used in semiconductor manufacturing, also known as cutting tape. It is usually made of polyimide film, with high strength and high temperature resistance. In semiconductor manufacturing, chips need to be separated by cutting them into small pieces. Dicing Tape fixes the chip on the back cutting machine and protects the chip surface from damage during the cutting process. The selection of Dicing Tape depends on the size and shape of the chip, as well as the cutting disc and cutting parameters used during the cutting process. Usually, manufacturers provide different types and specifications of Dicing Tapes to meet different application requirements.
This report is a detailed and comprehensive analysis for global Back Grinding Tape and Dicing Tape market. Both quantitative and qualitative analyses are presented by manufacturers, by region & country, by Type and by Application. As the market is constantly changing, this report explores the competition, supply and demand trends, as well as key factors that contribute to its changing demands across many markets. Company profiles and product examples of selected competitors, along with market share estimates of some of the selected leaders for the year 2025, are provided.

This report also provides key insights about market drivers, restraints, opportunities, new product launches or approval.
Back Grinding Tape and Dicing Tape market is split by Type and by Application. For the period 2021-2032, the growth among segments provides accurate calculations and forecasts for consumption value by Type, and by Application in terms of volume and value. This analysis can help you expand your business by targeting qualified niche markets.

Market segment by Type: Back Grinding Tape、 Dicing Tape
Market segment by Application: Front-End Process、 Back-End Process
Major players covered: Mitsui Chemicals Tohcello、 Nitto、 LINTEC、 Furukawa Electric、 Denka、 LG Chem、 Maxell、 D&X、 AI Technology、 Suzhou Boyan Jingjin Photoelectric、 Shanghai Guke Adhesive Tape、 WISE New Material、 Taicang Zhanxin Adhesive Material、 Shanghai Plusco Tech、 Kunshan BYE Science Macromolecule Material、 Cybrid Technologies

The content of the study subjects, includes a total of 15 chapters:
Chapter 1, to describe Back Grinding Tape and Dicing Tape product scope, market overview, market estimation caveats and base year.
Chapter 2, to profile the top manufacturers of Back Grinding Tape and Dicing Tape, with price, sales quantity, revenue, and global market share of Back Grinding Tape and Dicing Tape from 2021 to 2026.
Chapter 3, the Back Grinding Tape and Dicing Tape competitive situation, sales quantity, revenue, and global market share of top manufacturers are analyzed emphatically by landscape contrast.
Chapter 4, the Back Grinding Tape and Dicing Tape breakdown data are shown at the regional level, to show the sales quantity, consumption value, and growth by regions, from 2021 to 2032.
Chapter 5 and 6, to segment Back Grinding Tape and Dicing Tape the sales by Type and by Application, with sales market share and growth rate by Type, by Application, from 2021 to 2032.
Chapter 7, 8, 9, 10 and 11, to break the Back Grinding Tape and Dicing Tape sales data at the country level, with sales quantity, consumption value, and market share for key countries in the world, from 2021 to 2025.and Back Grinding Tape and Dicing Tape market forecast, by regions, by Type, and by Application, with sales and revenue, from 2026 to 2032.
Chapter 12, market dynamics, drivers, restraints, trends, and Porters Five Forces analysis.
Chapter 13, the key raw materials and key suppliers, and industry chain of Back Grinding Tape and Dicing Tape.
Chapter 14 and 15, to describe Back Grinding Tape and Dicing Tape sales channel, distributors, customers, research findings and conclusion.

The Primary Objectives in This Report Are:
To determine the size of the total market opportunity of global and key countries
To assess the growth potential for Back Grinding Tape and Dicing Tape
To forecast future growth in each product and end-use market
To assess competitive factors affecting the marketplace

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