Taiwan Semiconductor and IC Packaging Materials Market Outlook 2024-2031: Navigating 10.2% CAGR with Focus on Chiplet Architectures, Data Center Processors, Germany Signal Integrity Materials, and Competitive Landscape of Samsung, ASE, Siemens

Global Semiconductor and IC Packaging Materials Market reached US$ 43.1 billion in 2023 and is expected to reach US$ 93.7 billion by 2031, growing with a CAGR of 10.2% during the forecast period 2024-2031.

According to DataM Intelligence has published a new research report on "Semiconductor and IC Packaging Materials Market Size 2025". The report explores comprehensive and insightful Information about various key factors like Regional Growth, Segmentation, CAGR, Business Revenue Status of Top Key Players and Drivers. The purpose of this report is to provide a telescopic view of the current market size by value and volume, opportunities, and development status.

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➣ Recent Developments:

United States: Recent Industry Developments - Semiconductor & IC Packaging Materials
✅ August 2025 - U.S. advanced materials suppliers introduced next-gen fan-out and 2.5D/3D packaging substrates, enabling higher interconnect density for AI and high-performance computing chips.

✅ July 2025 - A leading semiconductor company launched low-warpage epoxy molding compounds (EMC) designed for ultra-thin packages used in mobile devices and wearables.

✅ June 2025 - New high-thermal-conductivity underfill materials were commercialized to support chiplet architectures and improved heat management for data center processors.

🇪🇺 Europe: Recent Industry Developments - Semiconductor & IC Packaging Materials
✅ August 2025 - Germany: European suppliers introduced glass substrate materials for advanced packaging, targeting improved signal integrity and reduced power consumption for advanced processors.

✅ July 2025 - France: A new generation of low-k dielectric materials was released to support high-speed data transmission in advanced interposer and fan-out packages.

✅ June 2025 - Netherlands: European packaging firms deployed high-reliability solder materials designed for automotive-grade semiconductor devices, ensuring durability under extreme thermal cycling.

➣ Top Industry Players:

Intel, Amkor Technology, Deca Technologies, Siemens, Samsung, Advanced Semiconductor Engineering Inc, Taiwan Semiconductor Manufacturing Company, Microchip Technology, Synapse Electronique and FlipChip International LLC.

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➣ Key Segments:

By Type: Organic Substrates, Bonding Wires, Leadframes, Ceramic Packages, Die Attach Materials, Thermal Interface Materials, Solder Balls, Encapsulation Resins, Others.

By Technology: Grid Array, Wafer-level Packaging, Small-outline Package (SOP), Flat no-leads Packages, Dual In-line Packages, 3D Packaging, Others.

By End-User: Consumer Electronics, Automotive, Healthcare, IT & Telecommunication, Aerospace and Defense, Others.

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