Press release
Global and U.S. Non-eutectic Solder Alloy Market Report, Published by QY Research.
To solve the issue, the engineering team transitioned to a Non-Eutectic Solder Alloy, specifically a Sn-Bi-Cu system with a wider pasty (semi-solid) range. Unlike eutectic alloys that jump directly from liquid to solid, non-eutectic solders solidify gradually across a temperature interval, accommodating thermal stress and reducing void formation. The controlled mushy zone allowed better wetting on copper pads, smoother joint morphology, and slower solidification-reducing internal stress. After adoption, the converter modules demonstrated a 45% improvement in thermal-cycling reliability, significantly fewer voids under X-ray inspection, and stable performance under vibration and high-temperature operation. Non-eutectic alloys are now widely used in automotive powertrains, high-power LEDs, industrial controls, and defense-grade electronics requiring durable, shock-resistant solder joints.
https://www.qyresearch.com/reports/5487640/non-eutectic-solder-alloy
Core market data:
Global market size: USD 1.5 billion
CAGR (2024-2030): 5.3%
Average price: USD 72,000 per ton
Annual production: 215 kilotons
Gross margin: 27%
Production capacity: 260 kilotons
List of Main players:
Indium Corporation (USA)
AIM Solder (USA)
Senju Metal (Japan)
MacDermid Alpha (USA)
Balver Zinn (Germany)
Nihon Superior (Japan)
KOKI Company (Japan)
Qualitek (USA)
Yunnan Tin (China)
Shenzhen Jufeng Solder (China)
BBIEN Technology (China)
Agni Solders (India)
White Solder Group (Brazil)
PBT Rožnov (Czechia)
1. By Alloy System
Sn-Ag-Cu (Non-Eutectic SAC Variants)
Sn-Bi (Broad Melting Range)
Sn-Zn and Sn-Zn-Al
Sn-Pb Non-Eutectic Grades (Legacy/Industrial)
Custom High-Reliability Multicomponent Alloys
2. By Physical Form
Non-eutectic Solder Wire
Non-eutectic Solder Paste
Non-eutectic Solder Bar
3. By Melting Range
Low-temperature (Below 150°C)
Mid-temperature (150-250°C)
High-temperature (Over 250°C)
4. By Application
Electronic & Semiconductor
Automotive
Aerospace & Defense
Medical Device
Industrial Machinery
Case study for bidding
Time: June 2023
Supplier: Indium Corporation
Buyer: Bosch Automotive Electronics
Product: Sn-Ag-Cu Non-Eutectic Solder Paste (Melting Range 217-225°C)
Quantity: 1,850 tons
Contract Value: USD 154 million
Delivery Timeline: May 2024
Detailed Application Scenario
Bosch Automotive Electronics used Indium's non-eutectic SAC solder paste for assembling engine control units (ECUs) and advanced driver-assistance system (ADAS) modules. The alloy's broader melting range improved vibration resistance and reduced micro-cracking during thermal cycling-critical for automotive electronics exposed to frequent temperature swings.
The paste provided stable viscosity and consistent deposition for fine-pitch components, while the mushy phase during reflow minimized tombstoning and bridging defects. Its enhanced metallurgical structure delivered higher joint toughness and fatigue strength than eutectic SAC alloys.
Bosch selected this solder for its long-term reliability, superior thermal-mechanical stability, and compliance with automotive-grade (AEC-Q200) standards. The project demonstrated the advantages of non-eutectic solder alloys in demanding high-reliability applications where temperature cycling, vibration, and mechanical stress are major design challenges.
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