Automatic Mounter Wafer Equipment Market Share Driven by Rapid Semiconductor Packaging Automation and High-Volume IC Production | Valuates Reports

Automatic Mounter Wafer Equipment Market
The global market for Automatic Mounter Wafer Equipment was valued at US$ million in the year 2024 and is projected to reach a revised size of US$ million by 2031, growing at a CAGR of %during the forecast period.

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The Automatic Mounter Wafer Equipment Market is expanding steadily as semiconductor manufacturers accelerate investments in automated packaging systems to boost throughput, precision, and manufacturing yield. Market trends are being shaped by demand for more powerful integrated circuits, the transition toward advanced wafer-level packaging, increased adoption of automation in wafer dicing and back-end processing, and continuous shifts in chip miniaturization requirements. These developments are reinforcing market size expansion and strengthening overall market growth within global fabrication facilities.

By type, the 300 mm wafer size segment holds the largest market share, supported by its widespread use in high-volume semiconductor fabrication for memory, logic, and high-performance computing chips. The 200 mm wafer size segment is experiencing strong market growth, driven by ongoing demand in power electronics, industrial applications, automotive chips, and IoT-based device production. Other formats including 150 mm, 100 mm, and specialty wafer sizes retain essential roles in prototype development, low to mid-volume device manufacturing, and legacy semiconductor lines that continue to maintain stable operational relevance.

Based on application, dicing emerges as the segment with the largest market share, as automated mounter systems are widely deployed to ensure accurate placement, efficient cutting, and reduction of edge defects during chip singulation. The protection or back grinding category is showing notable market growth, supported by increased need to protect fragile wafers that are thinned to enable advanced packaging and die stacking. DAF (die attached film) and other application areas continue to benefit from higher demand for miniaturized device architectures, multilayer stacking, and packaging process optimization across high-performance semiconductor production environments.

Leading companies in the market include DISCO Corporation, Syagrus Systems, Advanced Dicing Technologies, Longhill Industries, Lintec Corporation, Nitto Denko, Tokyo Electron, Technovision, Takatori, and Ultron Systems. These companies maintain strong market share through continuous innovation in automated wafer mounting platforms, improved handling systems, and integrated film application solutions designed to reduce operational errors and enhance production output. Their competitive strength is supported by robust manufacturing capabilities, global service networks, and strategic alignment with semiconductor packaging technology advancements.

Regionally, Asia-Pacific dominates the Automatic Mounter Wafer Equipment Market, driven by vast semiconductor fabrication capacity across China, South Korea, Japan, and Taiwan. These markets benefit from substantial technology investments, large-scale IC production requirements, and strong supply chain ecosystems. North America and Europe also contribute significantly to the market size, supported by advanced R&D activity, industrial semiconductor demand, and increased fab modernization initiatives. The market forecast remains promising as semiconductor manufacturers continue to scale wafer-level packaging, automation, smart factory integration, and next-generation device production, positioning the industry for sustained market growth across major global manufacturing regions.

by Type

• 100 mm Wafer Size
• 150 mm Wafer Size
• 200 mm Wafer Size
• 300 mm Wafer Size
• Others

by Application

• Dicing
• Protection (Back Grinding)
• DAF (Die Attached Film)
• Others

By Company

DISCO Corp., Syagrus Systems, Advanced Dicing Technologies, Longhill Industries, Lintec Corporation, Nitto Denko, Tokyo Electron, Technovision, Takatori, Ultron Systems

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