Silicon Wafer for Memory Devices Market Share Driven by Rising Demand for High-Density NAND and DRAM | Valuates Reports

Silicon Wafer for Memory Devices Market Size
The global market for Silicon Wafer for Memory Devices was valued at US$ 5526 million in the year 2023 and is projected to reach a revised size of US$ 9355 million by 2030, growing at a CAGR of 8.6% during the forecast period.

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The Silicon Wafer for Memory Devices market is experiencing steady market growth as global demand for high-performance memory accelerates across consumer electronics, data centers, cloud computing, and Artificial Intelligence workloads. Market trends such as advanced process node migration, higher data storage requirements, and growing semiconductor fabrication investments are driving market size. The industry continues to benefit from strong demand for wafers with superior surface quality, reduced defect density, and improved electrical performance to support next-generation NAND and DRAM devices.

By type, the 300mm silicon wafer segment holds the largest market share due to its widespread adoption in advanced semiconductor manufacturing, offering higher productivity and lower cost per chip compared to smaller wafers. The 200mm silicon wafer segment remains relevant, particularly for mature process nodes, specialized products, and smaller fabs maintaining stable production. The balance of both segments ensures a diversified supply chain as manufacturers support both legacy and cutting-edge technologies.

In application terms, NAND represents the largest share of the market, supported by strong integration in smartphones, solid-state drives, and hyperscale storage systems. DRAM is experiencing robust market growth as memory density per device increases and demand strengthens across server platforms, networking systems, and AI computing. Other application areas, including specialty memory devices and embedded solutions, add further momentum to the overall market landscape, creating broad opportunities for wafer production expansion.

Leading companies such as Shin-Etsu Chemical, SUMCO, GlobalWafers, Siltronic AG, SK Siltron, and FST Corporation hold significant market share through strong process capabilities, advanced material technologies, and global manufacturing footprints. These companies are investing in production expansion, automation, wafer quality enhancement, and advanced polishing and epitaxial processes to support higher-performance memory devices. Emerging players including National Silicon Industry Group, Zhonghuan Advanced Semiconductor Materials, and Shanghai Advanced Silicon Technology are also strengthening competitiveness through new capacity and domestic ecosystem development.

Regionally, Asia-Pacific dominates market share, led by major wafer and memory manufacturing hubs in China, Japan, South Korea, and Taiwan. North America and Europe also contribute meaningfully, driven by semiconductor research, advanced process development, and regional supply chain strengthening. Southeast Asia and Latin America are experiencing rising participation as new fabrication investments, industrial policies, and market demand support expansion across the semiconductor value chain. The market forecast indicates ongoing growth supported by increasing digitalization, AI adoption, and rising demand for high-density memory solutions in both consumer and enterprise applications.

by Type

• 300mm Silicon Wafer
• 200mm Silicon Wafer

by Application

• NAND
• DRAM
• Others

By Company

Shin-Etsu Chemical, SUMCO, GlobalWafers, Siltronic AG, SK Siltron, FST Corporation, National Silicon Industry Group (NSIG), Zhonghuan Advanced Semiconductor Materials, Hangzhou Semiconductor Wafer, Shanghai Advanced Silicon Technology (AST), Beijing ESWIN Technology Group

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