United States Flexible Substrates Market 2025: Industry Developments, Future Growth, Share & Industry Insights | Rogers Corporation, Nippon Electric Glass Co., Ltd., Schott AG, Heraeus Holding GmbH

Global flexible substrates market size reached US$ 475.12 million in 2024 and is expected to reach US$ 1,162.17 million by 2032, growing with a CAGR of 11.83% during the forecast period 2025-2032.

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USA - Industry developments 2025:

✅ June 2025 - Jabil announced a planned multi-year $500 million investment to expand U.S. manufacturing capacity (aimed at cloud & AI/data-center customers; supports advanced flexible PCB production growth).

✅ 2025 (date reported in B. Riley / 2025) - Printed Circuits, Inc. (rigid-flex specialist) was acquired by All Flex (Granite Equity Partners) - consolidation in the U.S. rigid-flex / flexible circuit space.

✅ July 2025 - TTM Technologies acquired/announced a 750,000 sq ft facility in Eau Claire, WI to expand advanced PCB manufacturing capacity (supports advanced & flexible PCB volumes for AI/data center).

Europe - Industry developments 2025:

✅ Mar 4-6, 2025 (JEC World) - Toray Group + other materials players exhibited next-gen composites and films relevant to flexible substrates at JEC World (European demand / OEM interest in flexible films & composites highlighted).

✅ Nov 14, 2025 - NCAB (Sweden) announced acquisition of Multi-Teknik Mönsterkort AB - example of continued consolidation in European PCB/flexible interconnect manufacturing (adds specialized capabilities/capacity).

Japan - Industry developments 2025:

✅ June 3, 2025 - DuPont showcased advanced interconnect and flexible/rigid-flex laminate solutions at JPCA Show 2025 (DuPont promoting Pyralux® family and interconnect materials for AI, EV, aerospace markets).

✅ July 3, 2025 - Toray announced development of a photosensitive polyimide (STF-2000) enabling high-aspect-ratio fine patterning - a materials step relevant to finer flexible substrates and high-density flexible interconnects.

✅ July 28, 2025 - OKI (Oki Circuit Technology) launched rigid-flex PCBs with embedded copper "coins" to improve heat dissipation for space equipment - a product launch applying flexible-board tech in aerospace/new-space markets (sales started August 2025).

South Korea - Industry developments 2025:

✅ Jan 9, 2025 - Samsung Electro-Mechanics announced mass-production plans and new substrate/optics capabilities (at CES 2025 updates), signalling expansion of Korean supply into advanced package/substrate and flexible interconnect areas.

✅ April 2025 - Samsung Electro-Mechanics committed ~KRW 200 billion (2025-2027) to support partner capacity and supply-chain strengthening - part of regional capacity investments that bolster flexible/advanced substrate supply.

✅ Sept 2025 - Samsung Electro-Mechanics showcased next-gen package and substrate tech (including large/ultra-thin substrates and glass-core substrates) at KPCA Show 2025 - demonstrates Korean suppliers pushing high-performance substrate innovations that overlap with flexible/rigid-flex use cases.

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Regional share:

➠ Asia-Pacific (largest region): ~40-50% (majority) - APAC leads thanks to large OLED/flexible display production, electronics manufacturing scale and strong supplier base in China, Korea and Taiwan.

➠ North America: ~30-35% - strong in high-end medical, aerospace and R&D-led consumer electronics demand. (range reported around 30-35% by recent market summaries.)

➠ Europe: ~20-25% - driven by automotive electronics, renewables and sustainable-material initiatives.

Top market growth drivers:

✅ Consumer electronics & foldable displays. Rising demand for foldable/rollable phones, wearables and curved automotive displays is a primary driver for flexible substrates used in OLED stacks and thin-film circuits.

✅ Roll-to-roll manufacturing and cost declines. Scale-up of roll-to-roll (R2R) processes is lowering unit costs and enabling high-volume production of flexible circuits and displays.

✅ Automotive & transportation electrification. Modern cockpits, in-vehicle displays and conformal sensors increase demand for lightweight, flexible interconnects and substrates.

✅ Wearables & medical devices. Flexible medical sensors, patch devices and smart textiles require thin, biocompatible substrate materials.

✅ Renewables and specialty (flexible solar, aerospace). Flexible PV modules and conformal electronics in aerospace/satellites are emerging applications supporting niche but growing demand.

Segments Covered in the Flexible Substrates Market:

By Material Type - Plastic, Metal, Glass

By Application - Electronics & Semi-conductors, Automotive & Transportation, Healthcare & Medical Devices, Energy & Power, Others

Regional Analysis for Flexible Substrates Market:

⇥ North America (U.S., Canada, Mexico)

⇥ Europe (U.K., Italy, Germany, Russia, France, Spain, The Netherlands and Rest of Europe)

⇥ Asia-Pacific (India, Japan, China, South Korea, Australia, Indonesia Rest of Asia Pacific)

⇥ South America (Colombia, Brazil, Argentina, Rest of South America)

⇥ Middle East & Africa (Saudi Arabia, U.A.E., South Africa, Rest of Middle East & Africa)

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Major Key Players: DuPont de Nemours, Inc., 3M Company, Teijin Limited, Kolon Industries, Inc., Rogers Corporation, Nippon Electric Glass Co., Ltd., Schott AG, Heraeus Holding GmbH, Corning Incorporated, and Arkema S.A.

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