SiC Wafer Thinning Equipment Market Poised for Steady and Sustainable Growth at a CAGR of 17.1% Through 2031 | Forecast 2025-2031

Los Angeles, United States - QY Research has unveiled its latest study titled "Global SiC Wafer Thinning Equipment Market Share and Ranking, Overall Sales and Demand Forecast 2025-2031." This newly released report delivers a comprehensive overview of the global SiC Wafer Thinning Equipment market, analyzing the forces shaping its growth trajectory and providing valuable insights for stakeholders, investors, and industry professionals. the research covers key areas including market dynamics, segmentation, regional performance, competitive landscape, and emerging technology trends that are redefining industry standards. Backed by reliable data and expert analysis, the report serves as a trusted guide to understanding both microeconomic and macroeconomic factors driving market evolution.

The global market for SiC Wafer Thinning Equipment was estimated to be worth US$ 114 million in 2024 and is forecast to a readjusted size of US$ 338 million by 2031 with a CAGR of 17.1% during the forecast period 2025-2031.

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Wafer Grinder uses a centrally located robot to move a wafer from an input station to a measuring station. Thereafter, the wafer is moved into a grind station and a wash station sequentially. The robot is able to move a wafer from the wash station to either the measuring station for after-grinding measurements or directly to an output station. During grinding of one wafer, a second wafer may be held between the measuring station and the grind station while a ground wafer is moved from the wash station to the measuring station for after-grinding measurements.

This report only studies Silicon Carbide Wafer Thinning Equipment.

The global SiC Wafer Thinning Equipment market is witnessing significant growth, driven by the increasing demand for semiconductors in various industries such as consumer electronics, automotive, and telecommunications. The Asia-Pacific region remains the largest consumer market, accounting for over 60% of the global market share. This trend is expected to continue due to the region's strong semiconductor industry, technological advancements, and growing demand for energy-efficient power devices.

The global key manufacturers of SiC Wafer Thinning Equipment include Disco, TSD, etc. In 2023, the global top five players had a share approximately 81% in terms of revenue.

Among different types of SiC wafer thinning equipment, fully automated systems dominate the market, capturing approximately 77% of the total share in 2024. This reflects the industry's growing demand for precision, scalability, and high-efficiency production processes. Fully automated equipment provides improved throughput and minimizes the risk of human error, making it the preferred choice for manufacturers aiming to scale their operations and ensure high-quality output.

Interms of applications, wafers sized 6 inches and below are the primary demand drivers. These smaller wafers make up approximately 70% of the market in 2024. The widespread use of smaller wafers in power electronics and semiconductor devices, particularly in electric vehicles and renewable energy applications, supports this demand. As SiC continues to gain traction in the power semiconductor sector, the demand for wafer thinning equipment for smaller wafer sizes is expected to increase.

Competitive Landscape: -

Disco
TSD
TOKYO SEIMITSU
Engis Corporation
Okamoto Semiconductor Equipment Division
Revasum
Koyo Machinery
G&N

Market Driving Factors -

Expansion of the Electric Vehicle (EV) Market: SiC materials are particularly suitable for use in power modules for electric vehicles (EVs) due to their superior thermal conductivity and high voltage tolerance. With the rapid growth of the electric vehicle market, the demand for SiC wafers is increasing, which in turn drives the demand for wafer thinning equipment.

Advances in Energy Conversion and Storage Technologies: In high-efficiency energy conversion and storage fields, such as solar inverters and battery management systems, the use of SiC materials can significantly improve efficiency. The market's demand for high-performance components has driven the production and thinning of SiC wafers.

Demand for 5G and High-Frequency Electronics: The demand for SiC materials is rising in 5G networks and other high-frequency electronic devices due to SiC's excellent performance in high-frequency and high-power applications. This has led to an increase in the demand for SiC wafer production and processing equipment.

Market Restraints -

Process Complexity: The wafer thinning process for SiC wafers involves high-precision techniques and is technically challenging. The instability of the process may lead to quality issues, affecting market confidence.

Intensifying Competition: As the SiC market rapidly develops, more companies are entering the field, and market competition is becoming increasingly intense. This may lead to price wars and margin compression.

Technological Iteration: With the fast pace of technological updates, the introduction of new technologies and equipment may quickly render existing equipment obsolete. Companies need to continue investing in research and development to maintain competitiveness.

Regional Insights -

The report takes readers on a journey through four key regions: United States, Asia-Pacific, and EMEA. Key nations like the United States, Germany, the United Kingdom, China, Japan, South Korea, and more are thoroughly examined. The data is presented in a timeline from 2024 as the base year, with projections extending to 2031.

North America: United States, Canada, Mexico

Latin America: Brazil and other key markets

Asia Pacific: China, Japan, South Korea, India, ASEAN countries

Europe, Middle East & Africa (EMEA): Major European economies, GCC countries, and African nations

The report provides a region-wise breakdown of market share, consumption trends, and future prospects.

Detailed of SiC Wafer Thinning Equipment Market Segmentation -

The report offers great insights into important segments of the global SiC Wafer Thinning Equipment market while concentrating on their CAGR, market size, market share, and future growth potential. The global SiC Wafer Thinning Equipment market is mainly segmented according to type of product, application, and region. Each segment in these categories is extensively researched to become familiar with their growth prospects and key trends. Segmental analysis is highly important to identify key growth pockets of a global market. The report provides specific information on the market growth and demand of different products and applications to help players to focus on profitable areas of the global SiC Wafer Thinning Equipment market.

Segmentation By Type :-

Full-Automatic
Semi-Automatic

Segmentation By Application -

6 Inch and Below
8 Inch and Above

This segmentation helps identify high-growth opportunities and niche segments for investors and businesses.

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Why This Report is a Must-Have -

ᗒ Historical Analysis (2020-2024) & Forecasts (2025-2031): Gain a clear understanding of market trends and future growth potential.

ᗒ Comprehensive Market Segmentation: Detailed breakdown by Type, Application, and Region to identify lucrative opportunities.

ᗒ Competitive Landscape: Insights into key players, their market share, and strategic developments like mergers, acquisitions, and expansion plans.

ᗒ Drivers & Restraints: Understand the factors shaping the market's growth and the challenges that could impact your strategy.

ᗒ Expert Opinions & Market Dynamics: Benefit from expert analysis to navigate market risks and capitalize on emerging trends.

SiC Wafer Thinning Equipment Market Report Objectives -

(1) Analyzing the size of the global SiC Wafer Thinning Equipment market on the basis of value and volume

(2) Accurately calculating the market shares, consumption, and other vital factors of different segments of the global SiC Wafer Thinning Equipment market

(3) Exploring key dynamics of the global SiC Wafer Thinning Equipment market

(4) Highlighting important trends of the global SiC Wafer Thinning Equipment market in terms of production, revenue, and sales

(5) Deeply profiling top players of the global SiC Wafer Thinning Equipment market and showing how they compete in the industry

(6) Studying manufacturing processes and costs, product pricing, and various trends related to them

(7) Showing the performance of different regions and countries in the global SiC Wafer Thinning Equipment market

(8) Forecasting the market size and share of all segments, regions, and the global market.

Important Questions Answered included in the Report:-

(A) What is the market size and growth rate of the global and regional market by various segments?

(B) What is the market size and growth rate of the market for selective Countries?

(C) Which region or sub-segment is expected to drive the market in the forecast period?

(D) What factors are estimated to drive and restrain the market growth?

(E) What are the key technology and market trends shaping the market?

(F) what are the key opportunity in the market?

(G) Who are the leading manufacturers operating in the global SiC Wafer Thinning Equipment market?

(H) Which key player accounted for the highest market share?

(I) What are the growth opportunities for the new entrants in the global SiC Wafer Thinning Equipment market?

Table of Contents - Major Key Points:

1 Market Overview
1.1 SiC Wafer Thinning Equipment Product Introduction
1.2 Global SiC Wafer Thinning Equipment Market Size Forecast
1.2.1 Global SiC Wafer Thinning Equipment Sales Value (2020-2031)
1.2.2 Global SiC Wafer Thinning Equipment Sales Volume (2020-2031)
1.2.3 Global SiC Wafer Thinning Equipment Sales Price (2020-2031)
1.3 SiC Wafer Thinning Equipment Market Trends & Drivers
1.3.1 SiC Wafer Thinning Equipment Industry Trends
1.3.2 SiC Wafer Thinning Equipment Market Drivers & Opportunity
1.3.3 SiC Wafer Thinning Equipment Market Challenges
1.3.4 SiC Wafer Thinning Equipment Market Restraints
1.4 Assumptions and Limitations
1.5 Study Objectives
1.6 Years Considered
2 Competitive Analysis by Company
2.1 Global SiC Wafer Thinning Equipment Players Revenue Ranking (2024)
2.2 Global SiC Wafer Thinning Equipment Revenue by Company (2020-2025)
2.3 Global SiC Wafer Thinning Equipment Players Sales Volume Ranking (2024)
2.4 Global SiC Wafer Thinning Equipment Sales Volume by Company Players (2020-2025)
2.5 Global SiC Wafer Thinning Equipment Average Price by Company (2020-2025)
2.6 Key Manufacturers SiC Wafer Thinning Equipment Manufacturing Base and Headquarters
2.7 Key Manufacturers SiC Wafer Thinning Equipment Product Offered
2.8 Key Manufacturers Time to Begin Mass Production of SiC Wafer Thinning Equipment
2.9 SiC Wafer Thinning Equipment Market Competitive Analysis
2.9.1 SiC Wafer Thinning Equipment Market Concentration Rate (2020-2025)
2.9.2 Global 5 and 10 Largest Manufacturers by SiC Wafer Thinning Equipment Revenue in 2024
2.9.3 Global Top Manufacturers by Company Type (Tier 1, Tier 2, and Tier 3) & (based on the Revenue in SiC Wafer Thinning Equipment as of 2024)
2.10 Mergers & Acquisitions, Expansion
3 Segmentation by Type
3.1 Introduction by Type
3.1.1 Full-Automatic
3.1.2 Semi-Automatic
3.2 Global SiC Wafer Thinning Equipment Sales Value by Type
3.2.1 Global SiC Wafer Thinning Equipment Sales Value by Type (2020 VS 2024 VS 2031)
3.2.2 Global SiC Wafer Thinning Equipment Sales Value, by Type (2020-2031)
3.2.3 Global SiC Wafer Thinning Equipment Sales Value, by Type (%) (2020-2031)
3.3 Global SiC Wafer Thinning Equipment Sales Volume by Type
3.3.1 Global SiC Wafer Thinning Equipment Sales Volume by Type (2020 VS 2024 VS 2031)
3.3.2 Global SiC Wafer Thinning Equipment Sales Volume, by Type (2020-2031)
3.3.3 Global SiC Wafer Thinning Equipment Sales Volume, by Type (%) (2020-2031)
3.4 Global SiC Wafer Thinning Equipment Average Price by Type (2020-2031)
4 Segmentation by Application
4.1 Introduction by Application
4.1.1 6 Inch and Below
4.1.2 8 Inch and Above
4.2 Global SiC Wafer Thinning Equipment Sales Value by Application
4.2.1 Global SiC Wafer Thinning Equipment Sales Value by Application (2020 VS 2024 VS 2031)
4.2.2 Global SiC Wafer Thinning Equipment Sales Value, by Application (2020-2031)
4.2.3 Global SiC Wafer Thinning Equipment Sales Value, by Application (%) (2020-2031)
4.3 Global SiC Wafer Thinning Equipment Sales Volume by Application
4.3.1 Global SiC Wafer Thinning Equipment Sales Volume by Application (2020 VS 2024 VS 2031)
4.3.2 Global SiC Wafer Thinning Equipment Sales Volume, by Application (2020-2031)
4.3.3 Global SiC Wafer Thinning Equipment Sales Volume, by Application (%) (2020-2031)
4.4 Global SiC Wafer Thinning Equipment Average Price by Application (2020-2031)
5 Segmentation by Region
5.1 Global SiC Wafer Thinning Equipment Sales Value by Region
5.1.1 Global SiC Wafer Thinning Equipment Sales Value by Region: 2020 VS 2024 VS 2031
5.1.2 Global SiC Wafer Thinning Equipment Sales Value by Region (2020-2025)
5.1.3 Global SiC Wafer Thinning Equipment Sales Value by Region (2026-2031)
5.1.4 Global SiC Wafer Thinning Equipment Sales Value by Region (%), (2020-2031)
5.2 Global SiC Wafer Thinning Equipment Sales Volume by Region
5.2.1 Global SiC Wafer Thinning Equipment Sales Volume by Region: 2020 VS 2024 VS 2031
5.2.2 Global SiC Wafer Thinning Equipment Sales Volume by Region (2020-2025)
5.2.3 Global SiC Wafer Thinning Equipment Sales Volume by Region (2026-2031)
5.2.4 Global SiC Wafer Thinning Equipment Sales Volume by Region (%), (2020-2031)
5.3 Global SiC Wafer Thinning Equipment Average Price by Region (2020-2031)
5.4 North America
5.4.1 North America SiC Wafer Thinning Equipment Sales Value, 2020-2031
5.4.2 North America SiC Wafer Thinning Equipment Sales Value by Country (%), 2024 VS 2031
5.5 Europe
5.5.1 Europe SiC Wafer Thinning Equipment Sales Value, 2020-2031
5.5.2 Europe SiC Wafer Thinning Equipment Sales Value by Country (%), 2024 VS 2031
5.6 Asia Pacific
5.6.1 Asia Pacific SiC Wafer Thinning Equipment Sales Value, 2020-2031
5.6.2 Asia Pacific SiC Wafer Thinning Equipment Sales Value by Region (%), 2024 VS 2031
5.7 South America
5.7.1 South America SiC Wafer Thinning Equipment Sales Value, 2020-2031
5.7.2 South America SiC Wafer Thinning Equipment Sales Value by Country (%), 2024 VS 2031
5.8 Middle East & Africa
5.8.1 Middle East & Africa SiC Wafer Thinning Equipment Sales Value, 2020-2031
5.8.2 Middle East & Africa SiC Wafer Thinning Equipment Sales Value by Country (%), 2024 VS 2031
6 Segmentation by Key Countries/Regions
6.1 Key Countries/Regions SiC Wafer Thinning Equipment Sales Value Growth Trends, 2020 VS 2024 VS 2031
6.2 Key Countries/Regions SiC Wafer Thinning Equipment Sales Value and Sales Volume
6.2.1 Key Countries/Regions SiC Wafer Thinning Equipment Sales Value, 2020-2031
6.2.2 Key Countries/Regions SiC Wafer Thinning Equipment Sales Volume, 2020-2031
6.3 United States
6.3.1 United States SiC Wafer Thinning Equipment Sales Value, 2020-2031
6.3.2 United States SiC Wafer Thinning Equipment Sales Value by Type (%), 2024 VS 2031
6.3.3 United States SiC Wafer Thinning Equipment Sales Value by Application, 2024 VS 2031
6.4 Europe
6.4.1 Europe SiC Wafer Thinning Equipment Sales Value, 2020-2031
6.4.2 Europe SiC Wafer Thinning Equipment Sales Value by Type (%), 2024 VS 2031
6.4.3 Europe SiC Wafer Thinning Equipment Sales Value by Application, 2024 VS 2031
6.5 China
6.5.1 China SiC Wafer Thinning Equipment Sales Value, 2020-2031
6.5.2 China SiC Wafer Thinning Equipment Sales Value by Type (%), 2024 VS 2031
6.5.3 China SiC Wafer Thinning Equipment Sales Value by Application, 2024 VS 2031
6.6 Japan
6.6.1 Japan SiC Wafer Thinning Equipment Sales Value, 2020-2031
6.6.2 Japan SiC Wafer Thinning Equipment Sales Value by Type (%), 2024 VS 2031
6.6.3 Japan SiC Wafer Thinning Equipment Sales Value by Application, 2024 VS 2031
6.7 South Korea
6.7.1 South Korea SiC Wafer Thinning Equipment Sales Value, 2020-2031
6.7.2 South Korea SiC Wafer Thinning Equipment Sales Value by Type (%), 2024 VS 2031
6.7.3 South Korea SiC Wafer Thinning Equipment Sales Value by Application, 2024 VS 2031
6.8 Southeast Asia
6.8.1 Southeast Asia SiC Wafer Thinning Equipment Sales Value, 2020-2031
6.8.2 Southeast Asia SiC Wafer Thinning Equipment Sales Value by Type (%), 2024 VS 2031
6.8.3 Southeast Asia SiC Wafer Thinning Equipment Sales Value by Application, 2024 VS 2031
6.9 India
6.9.1 India SiC Wafer Thinning Equipment Sales Value, 2020-2031
6.9.2 India SiC Wafer Thinning Equipment Sales Value by Type (%), 2024 VS 2031
6.9.3 India SiC Wafer Thinning Equipment Sales Value by Application, 2024 VS 2031
7 Company Profiles
7.1 Disco
7.1.1 Disco Company Information
7.1.2 Disco Introduction and Business Overview
7.1.3 Disco SiC Wafer Thinning Equipment Sales, Revenue, Price and Gross Margin (2020-2025)
7.1.4 Disco SiC Wafer Thinning Equipment Product Offerings
7.1.5 Disco Recent Development
7.2 TSD
7.2.1 TSD Company Information
7.2.2 TSD Introduction and Business Overview
7.2.3 TSD SiC Wafer Thinning Equipment Sales, Revenue, Price and Gross Margin (2020-2025)
7.2.4 TSD SiC Wafer Thinning Equipment Product Offerings
7.2.5 TSD Recent Development
7.3 TOKYO SEIMITSU
7.3.1 TOKYO SEIMITSU Company Information
7.3.2 TOKYO SEIMITSU Introduction and Business Overview
7.3.3 TOKYO SEIMITSU SiC Wafer Thinning Equipment Sales, Revenue, Price and Gross Margin (2020-2025)
7.3.4 TOKYO SEIMITSU SiC Wafer Thinning Equipment Product Offerings
7.3.5 TOKYO SEIMITSU Recent Development
7.4 Engis Corporation
7.4.1 Engis Corporation Company Information
7.4.2 Engis Corporation Introduction and Business Overview
7.4.3 Engis Corporation SiC Wafer Thinning Equipment Sales, Revenue, Price and Gross Margin (2020-2025)
7.4.4 Engis Corporation SiC Wafer Thinning Equipment Product Offerings
7.4.5 Engis Corporation Recent Development
7.5 Okamoto Semiconductor Equipment Division
7.5.1 Okamoto Semiconductor Equipment Division Company Information
7.5.2 Okamoto Semiconductor Equipment Division Introduction and Business Overview
7.5.3 Okamoto Semiconductor Equipment Division SiC Wafer Thinning Equipment Sales, Revenue, Price and Gross Margin (2020-2025)
7.5.4 Okamoto Semiconductor Equipment Division SiC Wafer Thinning Equipment Product Offerings
7.5.5 Okamoto Semiconductor Equipment Division Recent Development
7.6 Revasum
7.6.1 Revasum Company Information
7.6.2 Revasum Introduction and Business Overview
7.6.3 Revasum SiC Wafer Thinning Equipment Sales, Revenue, Price and Gross Margin (2020-2025)
7.6.4 Revasum SiC Wafer Thinning Equipment Product Offerings
7.6.5 Revasum Recent Development
7.7 Koyo Machinery
7.7.1 Koyo Machinery Company Information
7.7.2 Koyo Machinery Introduction and Business Overview
7.7.3 Koyo Machinery SiC Wafer Thinning Equipment Sales, Revenue, Price and Gross Margin (2020-2025)
7.7.4 Koyo Machinery SiC Wafer Thinning Equipment Product Offerings
7.7.5 Koyo Machinery Recent Development
7.8 G&N
7.8.1 G&N Company Information
7.8.2 G&N Introduction and Business Overview
7.8.3 G&N SiC Wafer Thinning Equipment Sales, Revenue, Price and Gross Margin (2020-2025)
7.8.4 G&N SiC Wafer Thinning Equipment Product Offerings
7.8.5 G&N Recent Development
8 Industry Chain Analysis
8.1 SiC Wafer Thinning Equipment Industrial Chain
8.2 SiC Wafer Thinning Equipment Upstream Analysis
8.2.1 Key Raw Materials
8.2.2 Raw Materials Key Suppliers
8.2.3 Manufacturing Cost Structure
8.3 Midstream Analysis
8.4 Downstream Analysis (Customers Analysis)
8.5 Sales Model and Sales Channels
8.5.1 SiC Wafer Thinning Equipment Sales Model
8.5.2 Sales Channel
8.5.3 SiC Wafer Thinning Equipment Distributors
9 Research Findings and Conclusion
10 Appendix
10.1 Research Methodology
10.1.1 Methodology/Research Approach
10.1.1.1 Research Programs/Design
10.1.1.2 Market Size Estimation
10.1.1.3 Market Breakdown and Data Triangulation
10.1.2 Data Source
10.1.2.1 Secondary Sources
10.1.2.2 Primary Sources
10.2 Author Details
10.3 Disclaimer

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