SiC Laser Annealing Equipment Market Share Accelerated by Growth in Power Electronics and Wide-Bandgap Semiconductor Applications | Valuates Reports

SiC Laser Annealing Equipment Market Size
The global market for SiC Laser Annealing Equipment was valued at US$ 1506 million in the year 2024 and is projected to reach a revised size of US$ 2932 million by 2031, growing at a CAGR of 10.1% during the forecast period.

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The SiC Laser Annealing Equipment Market is experiencing robust market growth driven by the rising adoption of silicon carbide (SiC) power devices across electric vehicles (EVs), renewable energy systems, and industrial power applications. Laser annealing plays a pivotal role in SiC device fabrication, enabling precise thermal activation of dopants, improved crystalline quality, and reduced defect density. As wide-bandgap semiconductors gain traction for their superior efficiency and high-temperature performance, laser annealing has become an essential process technology supporting advanced SiC wafer manufacturing and power device optimization.

By type, the power laser annealing equipment segment holds a dominant share of the SiC laser annealing market, primarily due to its widespread deployment in SiC power semiconductor production. These systems provide exceptional temperature control, uniform heating, and minimal substrate stress, ensuring optimal dopant activation and electrical performance. Meanwhile, the IC front-end laser annealing equipment segment is expected to witness rapid growth as semiconductor manufacturers expand the use of SiC in advanced process chips and integrated power modules, particularly in next-generation EV inverters and fast-charging systems.

In terms of application, the power semiconductor segment leads the global market, fueled by the increasing integration of SiC components in automotive powertrains, industrial automation, and energy conversion systems. The shift toward electrification and the demand for higher efficiency and faster switching speeds are major factors driving SiC power device adoption. The advanced process chip segment is also gaining traction, as foundries and IDMs leverage laser annealing for advanced chip structures requiring localized thermal treatment and precision control.

The competitive landscape features key players such as Mitsui Group (JSW), Sumitomo Heavy Industries, SCREEN Semiconductor Solutions, Veeco, Applied Materials, Hitachi, YAC BEAM, Shanghai Micro Electronics Equipment, EO Technics, Beijing U-PRECISION Tech, Chengdu Laipu Technology, Hans DSI, and ETA Semitech. These companies hold significant market share through innovations in thermal processing technologies, strategic partnerships with SiC device manufacturers, and continuous product advancements. Their strategies focus on enhancing throughput, achieving sub-micron precision, and integrating AI-based monitoring systems to ensure process stability and yield optimization in SiC wafer production.

From a regional perspective, Asia-Pacific dominates the global SiC laser annealing equipment market, driven by strong semiconductor and power electronics manufacturing bases in China, Japan, South Korea, and Taiwan. The region's growing investment in EV production, renewable energy infrastructure, and SiC wafer fabrication facilities underpins market expansion. North America follows closely, with increasing adoption of SiC technology by automotive and industrial players alongside ongoing R&D in power electronics. Europe also contributes significantly, supported by the region's automotive electrification initiatives and SiC-based inverter development. Emerging regions such as Southeast Asia and Latin America are poised for gradual market growth as new fabrication and assembly plants expand in these geographies.

The market outlook remains optimistic, with ongoing technological advancements, rising demand for high-efficiency power devices, and continuous scaling of SiC wafer production driving the global SiC laser annealing equipment market toward sustained growth over the coming decade.

Segment by Type

• Power Laser Annealing Equipment
• IC Front-end Laser Annealing Equipment

Segment by Application

• Power Semiconductor
• Advanced Process Chip

By Company

Mitsui Group (JSW), Sumitomo Heavy Industries, SCREEN Semiconductor Solutions, Veeco, Applied Materials, Hitachi, YAC BEAM, Shanghai Micro Electronics Equipment, EO Technics, Beijing U-PRECISION Tech, Chengdu Laipu Technology, Hans DSI, ETA Semitech

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This release was published on openPR.