Laser Annealing Equipment Market Share Driven by Rising Demand for Power Semiconductors and Advanced Chip Processing | Valuates Reports

Laser Annealing Equipment Market Size
The global market for Laser Annealing Equipment was valued at US$ 1507 million in the year 2024 and is projected to reach a revised size of US$ 2940 million by 2031, growing at a CAGR of 10.2% during the forecast period.

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The Laser Annealing Equipment Market is witnessing robust market growth driven by the increasing adoption of advanced semiconductor fabrication processes and the growing demand for high-performance electronic devices. Laser annealing technology enables precise thermal processing of semiconductor wafers, offering superior temperature control, reduced defect density, and enhanced dopant activation compared to conventional methods. As chip manufacturers push toward smaller geometries and more complex device architectures, laser annealing has become a critical enabler for achieving performance, reliability, and power efficiency in next-generation integrated circuits.

By type, the power laser annealing equipment segment holds a dominant share of the global market, supported by its widespread use in the production of power semiconductors for electric vehicles (EVs), renewable energy systems, and industrial electronics. These systems offer high-temperature processing capabilities and superior energy uniformity, essential for fabricating wide-bandgap semiconductors such as SiC and GaN. The IC front-end laser annealing equipment segment is projected to experience the fastest growth, fueled by increasing investments in advanced logic and memory manufacturing. This equipment plays a key role in front-end processes, including source/drain activation and strain engineering, for cutting-edge nodes below 5nm.

In terms of application, the power semiconductor segment leads the market, driven by the global transition toward energy-efficient technologies and the electrification of transportation. The growing use of power devices in EV drivetrains, charging infrastructure, and renewable power systems continues to boost demand for high-precision annealing equipment. Meanwhile, the advanced process chip segment is expanding rapidly as semiconductor foundries and integrated device manufacturers (IDMs) adopt laser annealing for advanced process nodes, AI accelerators, and 3D stacked memory applications.

The competitive landscape is defined by leading players such as Mitsui Group (JSW), Sumitomo Heavy Industries, SCREEN Semiconductor Solutions, Veeco, Applied Materials, Hitachi, YAC BEAM, EO Technics, Beijing U-PRECISION Tech, Shanghai Micro Electronics Equipment, Chengdu Laipu Technology, Hans DSI, ETA Semitech, and Jihua Laboratory. These companies hold significant market share through continuous innovation, precision engineering, and partnerships with top semiconductor producers. Their strategic focus includes improving energy efficiency, minimizing thermal distortion, and integrating AI-based process monitoring for enhanced yield and consistency.

From a regional perspective, Asia-Pacific dominates the global laser annealing equipment market, with key manufacturing hubs in China, Japan, South Korea, and Taiwan driving large-scale adoption. The region's strong semiconductor ecosystem, government-backed chip production initiatives, and high concentration of wafer fabs contribute to sustained market expansion. North America follows closely, supported by investments from leading foundries and equipment manufacturers focusing on advanced node development and R&D. Europe remains an important market, driven by semiconductor innovation and power electronics applications in the automotive and industrial sectors. Emerging regions such as Southeast Asia and Latin America are also gradually increasing adoption as new semiconductor facilities expand their production capacity.

The market outlook remains highly positive, with ongoing technological advancements, rising demand for power-efficient devices, and continuous scaling of semiconductor process nodes fueling the growth of the global laser annealing equipment market in the coming years.

by Type

• Power Laser Annealing Equipment
• IC front-end Laser Annealing Equipment

by Application

• Power Semiconductor
• Advanced Process Chip

By Company

Mitsui Group (JSW), Sumitomo Heavy Industries, SCREEN Semiconductor Solutions, Veeco, Applied Materials, Hitachi, YAC BEAM, EO Technics, Beijing U-PRECISION Tech, Shanghai Micro Electronics Equipment, Chengdu Laipu Technology, Hans DSI, ETA Semitech, Jihua Laboratory

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This release was published on openPR.