Global and U.S. Sn-Bi-Cu Lead-free Solder Market Report, Published by QY Research.

Sn-Bi-Cu Lead-Free Solder is an eco-friendly solder alloy composed primarily of tin (Sn), bismuth (Bi), and copper (Cu), engineered to replace traditional lead-based solders in electronic manufacturing. It features a low melting point, superior wettability, and high joint reliability, making it ideal for temperature-sensitive electronic assemblies. Bismuth enhances mechanical strength and lowers the melting temperature, while copper improves intermetallic bonding and prevents erosion of soldering pads. The alloy ensures consistent solder flow, reduced thermal stress, and strong fatigue resistance under thermal cycling. Sn-Bi-Cu solder is widely used in consumer electronics, automotive control systems, LED modules, and medical devices, offering both performance efficiency and environmental compliance under RoHS and REACH directives.

https://www.qyresearch.com/reports/5277187/sn-bi-cu-lead-free-solder

Core market data:

Global market size: USD 1.4 billion
CAGR (2024-2030): 6.3%
Average price: USD 2400 per ton
Annual production: 62 kilotons
Gross margin: 32%
Production capacity: 78 kilotons

List of Main players:

Indium (USA)
Kester (USA)
Lucas Milhaupt (USA)
Balver Zinn (Germany)
Senju Metal (Japan)
Nihon Almit (Japan)
Ishikawa Metal (Japan)
Yunnan Tin (China)
Shenmao Technology (Taiwan)
Kothari Metsol (India)

1. By Composition Ratio

Sn42Bi58Cu0.7
Sn57Bi42Cu1
Sn60Bi39Cu1

2. By Form

Solder Paste
Solder Wire
Solder Bar
Solder Ball

3. By Melting Temperature

Low-temperature Type
Medium-temperature Type

4. By Application

Automotive
Industrial Machinery
Medical Device
Aerospace & Defense
Consumer Electronic
Semiconductor

Case study for bidding

Time: October 2023
Supplier: Nihon Superior
Buyer: Samsung Electronics
Product: Sn42Bi57.6Cu0.4 Low-Temperature Solder Paste
Quantity: 1,200 tons
Contract Value: USD 35 million
Delivery Timeline: September 2024

Detailed Application Scenario

In this project, Samsung Electronics utilized Nihon Superior's Sn-Bi-Cu low-temperature solder paste for smartphone motherboard and LED backlight unit assembly. The alloy's melting temperature of approximately 138°C minimized heat exposure during reflow, protecting delicate chips, sensors, and flexible printed circuits.

Copper addition improved intermetallic bonding and reduced joint cracking during temperature cycling, enhancing the reliability of fine-pitch surface-mount components. The solder exhibited excellent flowability and wetting on both tin- and nickel-plated surfaces, ensuring consistent joint strength and high productivity in automated lines.

Samsung selected this alloy as part of its lead-free manufacturing initiative and carbon reduction strategy, replacing legacy Sn-Pb solders. The Sn-Bi-Cu alloy delivered lower reflow energy consumption, superior mechanical stability, and strong fatigue resistance, making it a preferred solution for sustainable, high-density electronic manufacturing.

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This release was published on openPR.