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United States Thermal Management Market to Grow at 8.5% CAGR | Boyd Corporation, Honeywell, Laird Performance Materials, and Vertiv | DataM Intelligence

11-04-2025 10:00 AM CET | Energy & Environment

Press release from: DataM Intelligence 4 Market Research LLP

Thermal Management Market

Thermal Management Market

The global thermal management market is growing at a CAGR of 8.5% during the forecast period 2024-2031, according to DataM Intelligence. This sustained growth is primarily driven by the escalating thermal demands of next-generation technologies, including artificial intelligence (AI) servers, electric vehicle (EV) power electronics, and high-performance computing (HPC) systems.

United States: Recent Industry Developments

✅ In October 2025, Boyd Corporation launched a new phase-change material thermal interface achieving 50% better heat dissipation for high-power electronics.
✅ In September 2025, The U.S. Department of Defense allocated USD 850 million for advanced thermal management systems in military electronics.
✅ In August 2025, Honeywell International introduced a graphene-enhanced thermal compound with 3x higher thermal conductivity than traditional materials.

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Europe: Recent Industry Developments

✅ In October 2025, Laird Performance Materials developed an AI-optimized thermal management system for electric vehicle power electronics.
✅ In September 2025, The European Union implemented new energy efficiency standards requiring advanced thermal solutions in all consumer electronics.
✅ In August 2025, Vertiv Holdings expanded its liquid cooling solutions portfolio for high-density data centers across European markets.

Asia-Pacific: Recent Industry Developments

✅ In October 2025, Delta Electronics launched a compact vapor chamber cooling system for 5G infrastructure and telecommunications equipment.
✅ In September 2025, Japan's Ministry of Economy allocated ¥120 billion for thermal management R&D in next-generation electronics.
✅ In August 2025, Aavid Thermal (Boyd Corporation) opened a new manufacturing facility in Taiwan focusing on advanced heat sink production.

Market Trends & Drivers

The United States Thermal Management Market is experiencing robust growth driven by increasing power densities in electronics, rising adoption of electric vehicles, and growing demand for energy-efficient cooling solutions. Key trends include the development of advanced thermal interface materials, integration of liquid cooling systems, and advancement in phase-change cooling technologies. The expansion of 5G infrastructure, growing data center capacities, and increasing automotive electronics content are significantly accelerating market expansion.

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Competitive Landscape

The market features intense competition among thermal solution providers, material scientists, and electronics manufacturers.

1. Boyd Corporation leads in comprehensive thermal management solutions including heat sinks, interface materials, and liquid cooling systems.
2. Honeywell International Inc. dominates in advanced thermal interface materials and aerospace thermal management systems.
3. Laird Performance Materials specializes in thermal interface materials and electromagnetic shielding solutions.
4. Vertiv Holdings Co. provides critical thermal management solutions for data centers and telecommunications infrastructure.
5. Delta Electronics, Inc. offers efficient thermal management products for electronics and industrial applications.
6. Aavid Thermal (Boyd Corporation) focuses on advanced heat sink design and manufacturing for high-power applications.
7. Parker Hannifin Corporation develops sophisticated thermal management systems for aerospace and industrial markets.
8. Gentherm Incorporated specializes in innovative thermal management technologies for automotive and medical applications.
9. European Thermodynamics Ltd. provides custom thermal solutions for electronics cooling and energy harvesting.
10. Mersen S.A. offers thermal management components and solutions for power electronics and renewable energy systems.

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Segmentation

By Devices (Conduction Cooling Devices, Convection Cooling Devices, Advanced Cooling Devices, Hybrid Cooling Devices)
By Services (Installation and Calibration, Optimization, Post-Sales Support, Online Services)

Regional Analysis:

⇥ North America (U.S., Canada, Mexico)
⇥ Europe (Germany, U.K., France, Italy, Spain, Netherlands, Rest of Europe)
⇥ Asia-Pacific (China, Japan, India, South Korea, Australia, Rest of Asia Pacific)
⇥ South America (Brazil, Argentina, Chile, Rest of South America)
⇥ Middle East & Africa (Saudi Arabia, U.A.E., South Africa, Rest of Middle East & Africa)

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