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Wafer Slicing Equipment Market Size, Trends & Forecasts | Valuates Reports
Wafer Slicing Equipment Market SizeThe global market for Wafer Slicing Equipment was valued at US$ 955 million in the year 2024 and is projected to reach a revised size of US$ 1302 million by 2031, growing at a CAGR of 4.6% during the forecast period.
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This report aims to provide a comprehensive presentation of the global market for Wafer Slicing Equipment, with both quantitative and qualitative analysis, to help readers develop business/growth strategies, assess the market competitive situation, analyze their position in the current marketplace, and make informed business decisions regarding Wafer Slicing Equipment.
The Wafer Slicing Equipment market size, estimations, and forecasts are provided in terms of output/shipments (Units) and revenue ($ millions), considering 2024 as the base year, with history and forecast data for the period from 2020 to 2031. This report segments the global Wafer Slicing Equipment market comprehensively. Regional market sizes, concerning products by Type, by Application, and by players, are also provided.
For a more in-depth understanding of the market, the report provides profiles of the competitive landscape, key competitors, and their respective market ranks. The report also discusses technological trends and new product developments.
The report will help the Wafer Slicing Equipment manufacturers, new entrants, and industry chain related companies in this market with information on the revenues, production, and average price for the overall market and the sub-segments across the different segments, by company, by Type, by Application, and by regions.
By Type
• Blade Cutting Machine
• Laser Cutting Machine
By Application
• Pure Foundry
• IDM
• OSAT
• LED
• Photovoltaic
Key Companies
DISCO, Tokyo Seimitsu, GL Tech Co Ltd, ASM, Synova, CETC Electronics Equipment Group Co., Ltd., Shenyang Heyan Technology Co., Ltd., Jiangsu Jingchuang Advanced Electronic Technology Co., Ltd., Hi-TESI, Tensun
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