SiC & GaN Wafer Defect Inspection System Market Size, Trends & Forecasts | Valuates Reports

SiC & GaN Wafer Defect Inspection System Market Size

The global market for SiC & GaN Wafer Defect Inspection System was valued at US$ 1042 million in the year 2024 and is projected to reach a revised size of US$ 3452 million by 2031, growing at a CAGR of 18.9% during the forecast period.

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Inspection and metrology are becoming more critical in the silicon carbide (SiC) industry amid a pressing need to find problematic defects in current and future SiC devices. Finding defects always has been a challenging task for SiC devices. But it's becoming more imperative to find killer defects and reduce them as SiC device vendors begin to expand their production for the next wave of applications, particularly battery-electric vehicles. So SiC device makers will need to bolster their process control measures with more inspection and metrology in the fab. Fortunately, the inspection and metrology equipment for SiC has recently become available, but these tools add cost to the fab equation. Generally, inspection systems locate defects on the wafer, while metrology tools characterize the structures in devices. Both technologies are used to pinpoint problems and ensure yields for all chip types. SiC, a compound semiconductor material based on silicon and carbon, is used to make specialized power semiconductors for high-voltage applications, such as electric vehicles, power supplies and solar inverters. SiC has several advantages over conventional silicon-based power semis like IGBTs and power MOSFETs. But the silicon-based solutions dominate the market because they are less expensive than SiC. In recent times, SiC device makers completed a difficult transition from 100mm (4-inch) to 150mm (6-inch) wafers to 200mm (8-inch) in the fab. Some vendors, though, are still struggling with their yields and defect levels at 150mm. A few vendors have overcome most of these challenges, however. Amid the challenges in the market, SiC device makers are now seeing an increase in demand for battery-electric cars. For years, SiC vendors have served the automotive market to a limited degree. But for next-generation electric vehicles, the industry will need to bring the technology to the next level and meet the industry's rigid reliability, defect and cost specs.

Global key players of SiC Wafer Defect Inspection System include KLA Corporation, Lasertec, Bruker, Visiontec Group, TASMIT, Inc., etc. The top five players hold a share about 95%. North America is the largest market, and has a share about 32%, followed by Europe and Japan with share 27% and 15%, separately. In terms of product type, Optical Inspection System is the largest segment, occupied for a share of 97%. In terms of application, SiC Substrate has a share about 73 percent.

By Type
• Optical Inspection System
• X-ray Diffraction Imaging (XRDI) System

By Application
• SiC Substrate, Epitaxy and Devices
• GaN Substrate, Epitaxy and Devices

Key Companies

KLA Corporation, Lasertec, Visiontec Group, Nanotronics, TASMIT, Inc., Bruker, LAZIN CO.,LTD, EtaMax, Spirox Corporation, Angkun Vision (Beijing) Technology, Shenzhen Glint Vision, CETC Fenghua Information Equipment, CASI Vision Technology (Luoyang) Co., Ltd, Shanghai Youruipu Semiconductor Equipment, Dalian Chuangrui Spectral Technology Co., Ltd, T-Vision.AI (Hangzhou) Tech Co.,Ltd., HGTECH

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This release was published on openPR.