Semiconductor Wafer Polishing Equipment Market Share Driven by Advanced Lithography Requirements and Wafer Surface Perfection Demand | Valuates Reports

Semiconductor Wafer Polishing Equipment Market
The global market for Semiconductor Wafer Polishing Equipment was valued at US$ million in the year 2024 and is projected to reach a revised size of US$ million by 2031, growing at a CAGR of %during the forecast period.

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The Semiconductor Wafer Polishing Equipment Market is expanding rapidly as chip manufacturers push toward smaller geometries, higher device densities, and superior wafer planarity. Polishing systems play a vital role in achieving defect-free surfaces essential for advanced semiconductor fabrication processes such as photolithography and thin-film deposition. Growing demand for logic, memory, and power devices, combined with rising investments in wafer fabs and automation, continues to shape the global market trends and enhance overall market size.

By type, mechanical polishing equipment holds the largest market share, offering reliable surface finishing and high material removal rates suitable for both silicon and compound semiconductor substrates. Ultrasonic polishing systems are gaining traction as they provide superior control and precision for delicate wafer surfaces used in advanced node production. Other polishing technologies, including hybrid and chemical-mechanical systems, are being optimized to deliver enhanced flatness and particle control, addressing the evolving needs of next-generation semiconductor manufacturing.

In terms of application, foundries represent the leading segment, driven by continuous process upgrades and the need for high-yield wafer finishing in contract manufacturing environments. Memory manufacturers are also major adopters, focusing on polishing equipment that ensures uniform surface quality for 3D NAND and DRAM production. Integrated Device Manufacturers (IDMs) continue to invest in advanced polishing technologies to enhance process integration and maintain competitive advantages in high-performance semiconductor fabrication.

Leading industry players such as Applied Materials, Ebara Corporation, Lapmaster, Logitech, Entrepix, Revasum, Tokyo Seimitsu, and Logomatic are driving innovation in wafer surface preparation. These companies are introducing precision-controlled polishing systems equipped with real-time monitoring, intelligent process control, and advanced slurry management to ensure optimal wafer quality and minimize defects. Their strategies emphasize automation, energy efficiency, and integration with downstream CMP processes to meet the stringent standards of semiconductor fabs worldwide.

Regionally, Asia-Pacific dominates the global market, supported by robust semiconductor manufacturing ecosystems in China, Japan, South Korea, and Taiwan. North America and Europe remain vital markets due to strong technological capabilities, advanced equipment development, and established foundry operations. Emerging regions such as India and Latin America are witnessing rising demand as new fabrication and assembly plants are established. The market forecast for semiconductor wafer polishing equipment points toward consistent market growth, fueled by technology innovation, process automation, and the relentless pursuit of wafer perfection in semiconductor production.

by Type

• Mechanical Polishing
• Ultrasonic Polishing
• Other

by Application

• Foundries
• Memory Manufacturers
• IDMs

By Company
Applied Materials, Ebara Corporation, Lapmaster, Logitech, Entrepix, Revasum, Tokyo Seimitsu, Logomatic

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This release was published on openPR.