Press release
Silicon Wafer Polishing Equipment Market Share Driven by Semiconductor Fabrication Expansion and Precision Surface Finishing Demand | Valuates Reports
Silicon Wafer Polishing Equipment Market SizeThe global market for Silicon Wafer Polishing Equipment was valued at US$ 622 million in the year 2024 and is projected to reach a revised size of US$ 871 million by 2031, growing at a CAGR of 5.0% during the forecast period.
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The Silicon Wafer Polishing Equipment Market is experiencing steady growth as the semiconductor and photovoltaic industries demand ever-higher levels of wafer flatness, smoothness, and defect-free surfaces. The global push toward miniaturized electronic devices, advanced IC manufacturing, and efficient solar energy systems is driving investments in precision polishing technologies. With ongoing advancements in CMP (chemical mechanical polishing) systems and automated wafer finishing solutions, manufacturers are enhancing wafer quality and throughput, strengthening the overall market size and competitiveness.
By type, double-sided polishing equipment holds the largest market share, as it delivers uniform surface quality and exceptional planarity, which are essential for high-performance integrated circuits. Final polish systems are rapidly gaining traction in the semiconductor segment for removing micro-defects and achieving superior optical flatness. Meanwhile, edge-polished wafer equipment continues to play a crucial role in eliminating edge chips and improving handling safety, supporting overall yield enhancement across fabs and solar cell production lines.
In terms of application, the semiconductor sector dominates the market, driven by demand for polished wafers used in advanced logic, memory, and analog devices. As semiconductor nodes continue to shrink, wafer surface perfection becomes critical for successful lithography and device patterning. The photovoltaics industry represents another growing application segment, where high-efficiency solar wafers rely on precise surface finishing to boost light absorption and cell conversion rates. Other applications, including research and optics, also contribute to the steady expansion of wafer polishing systems.
Leading manufacturers such as Lapmaster, BBS, OKAMOTO, Tokyo Seiki, MICRO, Fujikoshi, and Speedfam are at the forefront of innovation in wafer surface processing. These companies are developing advanced polishing tools with improved pressure control, slurry management, and process automation to deliver consistent wafer quality. Strategic collaborations between equipment manufacturers and semiconductor fabs are enabling customization of polishing systems to meet specific material, wafer size, and defect density requirements, strengthening their global market presence.
Regionally, Asia-Pacific remains the dominant production and consumption hub for silicon wafer polishing equipment, led by major semiconductor manufacturing centers in China, Japan, South Korea, and Taiwan. North America and Europe are key markets driven by technological innovation, precision engineering, and R&D investments in advanced materials. Emerging regions such as India and Latin America are also showing growth potential as local semiconductor and photovoltaic production expands. With continuous improvements in surface finishing technology, automation, and process control, the silicon wafer polishing equipment market forecast indicates robust market growth supported by innovation and global capacity expansion.
by Type
• Edge Polished
• Double Sided Polishing
• Final Polish
by Application
• Semiconductor
• Photovoltaics
• Others
By Company
Lapmaster, BBS, OKAMOTO, Tokyo Seiki, MICRO, Fujikoshi, Speedfam
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https://reports.valuates.com/market-reports/QYRE-Auto-23F15240/global-silicon-wafer-polishing-equipment
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