Press release
Conductive DAF(cDAF) for Semiconductor Packaging Market Size, Revenue Share, Insights & Future Outlook
Conductive DAF(cDAF) for Semiconductor Packaging Market SizeThe global market for Conductive DAF(cDAF) for Semiconductor Packaging was valued at US$ 226 million in the year 2024 and is projected to reach a revised size of US$ 394 million by 2031, growing at a CAGR of 8.3% during the forecast period.
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North American market for Conductive DAF(cDAF) for Semiconductor Packaging is estimated to increase from $ million in 2024 to reach $ million by 2031, at a CAGR of % during the forecast period of 2025 through 2031.
Asia-Pacific market for Conductive DAF(cDAF) for Semiconductor Packaging is estimated to increase from $ million in 2024 to reach $ million by 2031, at a CAGR of % during the forecast period of 2025 through 2031.
The major global manufacturers of Conductive DAF(cDAF) for Semiconductor Packaging include Henkel Adhesives, Nitto Denko, Furukawa Electric, LG Chemical, MacDermid Alpha, Hitachi Chemical, AI Technology, Creative Materials, Waferchem Technology, CollTech Group, etc. In 2024, the world's top three vendors accounted for approximately % of the revenue.
By Type
• ≤49μm
• >50μm
By Application
• 2.5D Packaging
• 3D Packaging
Key Companies
Henkel Adhesives, Nitto Denko, Furukawa Electric, LG Chemical, MacDermid Alpha, Hitachi Chemical, AI Technology, Creative Materials, Waferchem Technology, CollTech Group, Jiangsu Kemaite Technology Development, Yantai Darbond Technology
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