SiC CMP Pads Market Share Driven by Rising SiC Wafer Production and Advanced Polishing Technologies | Valuates Reports

SiC CMP Pads Market
The global market for SiC CMP Pads was valued at US$ million in the year 2024 and is projected to reach a revised size of US$ million by 2031, growing at a CAGR of %during the forecast period.

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The SiC CMP Pads Market is witnessing strong market growth driven by the rapid expansion of the silicon carbide semiconductor industry and increasing demand for precision wafer polishing solutions. As SiC-based devices gain traction in electric vehicles, renewable energy systems, and high-performance electronics, the need for advanced chemical mechanical polishing (CMP) materials has surged. Evolving market trends such as miniaturization, higher power density, and improved yield efficiency are further influencing market size and the overall market forecast for SiC CMP Pads.

In terms of type, hard pads hold a significant market share due to their durability and superior planarization performance in high-pressure CMP processes. These pads are preferred for removing defects and maintaining uniformity in SiC wafer surfaces. Meanwhile, soft pads are witnessing steady market growth as they enable finer surface finishes and reduced material loss, making them ideal for advanced applications. Both types are integral to supporting evolving semiconductor manufacturing standards, with ongoing innovations improving their chemical resistance and polishing consistency.

By application, 6 Inch SiC Wafers dominate the market, supported by growing adoption in power electronics and high-voltage applications. These wafers are essential in the production of next-generation transistors and diodes, driving strong market trends toward larger wafer sizes. The 4 Inch and 2+3 Inch wafer segments continue to serve specialized applications, while the 8 Inch wafer category is emerging as the fastest-growing due to the industry's push toward higher throughput and cost efficiency in large-scale semiconductor fabrication.

Leading companies such as DuPont, Fujibo Group, and CMC Materials command major market share through continuous innovation and strong supply chain integration. These firms are investing in advanced CMP formulations and pad materials to meet the precision and quality requirements of SiC wafer production. Regional players like Tianjin Helen and CHUANYAN are expanding their presence through localized production and competitive pricing strategies, contributing to dynamic market growth and diversification within the global supply landscape.

Regionally, Asia-Pacific leads the SiC CMP Pads Market, supported by robust semiconductor manufacturing infrastructure in China, Japan, South Korea, and Taiwan. North America and Europe follow closely, driven by technological advancements and rising investments in SiC device fabrication. Emerging regions such as India and Latin America are expected to experience growing demand as semiconductor production capacity expands globally. With sustained innovation, rising SiC wafer adoption, and supportive industry policies, the market forecast indicates continued expansion and technological evolution shaping the future of CMP pad applications.

by Type

• Hard Pads
• Soft Pads

by Application

• 2+3 Inch SiC Wafer
• 4 Inch SiC Wafer
• 6 Inch SiC Wafer
• Other Size (8 Inch)

By Company

DuPont, Fujibo Group, CMC Materials, Tianjin Helen, CHUANYAN

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