Edge Grinding Wheel for Semiconductor Market Share Driven by Diamond and Metal-Resin Grinding Applications | Valuates Reports

Edge Grinding Wheel for Semiconductor Market
The global market for Edge Grinding Wheel for Semiconductor was valued at US$ million in the year 2024 and is projected to reach a revised size of US$ million by 2031, growing at a CAGR of %during the forecast period.

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The Edge Grinding Wheel for Semiconductor Market is expanding steadily as semiconductor manufacturers demand high-precision grinding solutions to improve wafer edge quality, reduce chipping, and enhance device performance. Advancements in grinding technology, increasing wafer sizes, and rising adoption of automated manufacturing processes are key market trends driving growth. The focus on efficiency, durability, and high-quality surface finishes continues to expand the market size and support long-term market growth.

By Type
The Diamond Grinding Wheels segment holds the largest market share, offering superior hardness, wear resistance, and precision for semiconductor wafer processing. The Metal & Resin Grinding Wheels segment is experiencing rapid growth due to its versatility, cost-effectiveness, and compatibility with various semiconductor materials. Both types are critical for meeting the demands of high-volume production and advanced wafer fabrication.

By Application
The Wafer segment dominates the market, driven by the need for precise edge conditioning in semiconductor wafer production. The Other Semiconductor Material segment is growing fast as manufacturers adopt edge grinding solutions for alternative substrates, including SiC, GaAs, and sapphire, expanding the application range and improving overall production efficiency.

By Company
Asahi Diamond Industrial and Saint-Gobain Electronics lead the market with the highest market share, offering advanced diamond grinding wheel solutions optimized for wafer edge quality. EHWA DIAMOND, DIAMOTEC, and Semiconductor Materials are among the fastest-growing companies, leveraging innovation, high-performance products, and regional expansion to capture new market opportunities. Other notable players such as KURE GRINDING WHEEL, Nifec, More Superhard Products Co., Ltd, and Taiwan Diamond continue to strengthen their positions through technology-driven offerings and manufacturing expertise.

Regional Insights
Asia-Pacific dominates the market, led by China, Japan, and South Korea, where semiconductor fabrication is concentrated. North America and Europe remain significant due to advanced semiconductor manufacturing and high-quality standards. Emerging regions such as Southeast Asia and Latin America are witnessing steady adoption as wafer production and electronics manufacturing expand.

The Edge Grinding Wheel for Semiconductor Market is projected to maintain robust growth, supported by technological advancements, automation in wafer processing, and rising demand for high-precision semiconductor components. Ongoing innovation will continue to shape market trends, market size, market share, and overall market growth globally.

by Type

• Diamond Grinding Wheels
• Metal & Resin Grinding Wheels

by Application

• Wafer
• Others Semiconductor Material

By Company

Asahi Diamond Industrial, Electronics (Saint-Gobain), EHWA DIAMOND, DIAMOTEC, Semiconductor Materials, KURE GRINDING WHEEL, Nifec, Inc., More Superhard products Co.,Ltd, Taiwan Diamond

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