Wafer Thinning Equipment Market Share Driven by Advanced Semiconductor Manufacturing | Valuates Reports

Wafer Thinning Equipment Market Size
The global market for Wafer Thinning Equipment was valued at US$ 1042 million in the year 2024 and is projected to reach a revised size of US$ 1699 million by 2031, growing at a CAGR of 7.1% during the forecast period.

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The Wafer Thinning Equipment Market is witnessing strong growth as semiconductor manufacturers adopt wafer thinning processes to support high-density packaging, improved device performance, and higher yields. Increasing demand for ultra-thin wafers in advanced logic, memory, and power devices is driving investment in precision wafer thinning solutions. Key market trends include automation, process reliability, and integration with high-throughput production lines, all contributing to market size expansion and sustained market growth.

By Type
The fully automatic segment holds the largest market share, offering consistent precision, high throughput, and minimal operator intervention, which is crucial for high-volume semiconductor production. The semi-automatic segment continues to serve smaller fabs, R&D centers, and specialized wafer production lines where flexibility and lower capital investment are priorities. Both types are vital to meet the diverse operational requirements across semiconductor fabs.

By Application
The 300 mm wafer segment dominates the market due to its use in leading-edge semiconductor fabs and high-volume production. The 200 mm wafer segment remains significant for legacy fabs and niche applications, while other wafer sizes are witnessing growth in MEMS, sensors, and specialized device production. The combination of multiple wafer sizes drives innovation and adoption of versatile thinning equipment across the market.

By Company
Disco Corporation leads the market with advanced automation and high-precision wafer thinning solutions. Tokyo Seimitsu (ACCRETECH) and Engis Corporation are known for their reliable equipment and strong regional presence. Okamoto Semiconductor Equipment Division, Revasum, and TSD are expanding rapidly by providing high-precision solutions to emerging fabs. Other key players, including Koyo Machinery, WAIDA MFG, Hunan Yujing Machine Industrial, SpeedFam, CETC, G&N, and NTS, are strengthening regional service networks and offering innovative equipment to support evolving semiconductor manufacturing needs.

Regional Insights
Asia-Pacific dominates production and consumption, led by China, Japan, South Korea, and Taiwan, where wafer fabrication facilities are concentrated. North America and Europe remain key markets for high-precision, high-mix wafer thinning applications and R&D activities. India and Latin America are emerging regions due to growing semiconductor investments and adoption of advanced production technologies.

The Wafer Thinning Equipment Market is poised for continued growth as wafer thinning becomes critical in advanced packaging, MEMS, and next-generation semiconductor production. Innovations in automation, precision, and throughput will continue to shape market trends, market size, market share, and overall market growth worldwide.

by Type

• Fully Automatic
• Semi-automatic

by Application

• 200mm Wafer
• 300mm Wafer
• Others

By Company

Disco, TOKYO SEIMITSU, G&N, Okamoto Semiconductor Equipment Division, CETC, Koyo Machinery, Revasum, WAIDA MFG, Hunan Yujing Machine Industrial, SpeedFam, TSD, Engis Corporation, NTS

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