Wafer Grinder (Wafer Thinning Equipment) Market Share Driven by Advanced Semiconductor Manufacturing | Valuates Reports

Wafer Grinder (Wafer Thinning Equipment) Market Size
The global market for Wafer Grinder (Wafer Thinning Equipment) was valued at US$ 1042 million in the year 2024 and is projected to reach a revised size of US$ 1699 million by 2031, growing at a CAGR of 7.1% during the forecast period.

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The Wafer Grinder (Wafer Thinning Equipment) Market is growing steadily as semiconductor manufacturers increasingly adopt wafer thinning processes to enhance device performance, packaging efficiency, and yield. The trend toward smaller geometries, ultra-thin wafers, and advanced packaging solutions is driving demand for precision wafer grinding equipment. Automation, process consistency, and high-throughput capabilities are key market trends contributing to market size expansion and overall market growth.

By Type / Level of Automation
The fully automatic segment holds the largest market share, offering high throughput, consistent precision, and minimal operator involvement, which is critical for high-volume wafer production. The semi-automatic segment continues to serve smaller fabs, R&D, and specialized production lines where flexibility and cost efficiency are priorities. Both automation levels are essential to meet diverse operational needs in semiconductor manufacturing.

By Application
The 300 mm wafer segment dominates the market due to its widespread use in leading-edge semiconductor fabs, while the 200 mm wafer segment remains significant for legacy lines and specialized applications. Other wafer sizes, including smaller or non-standard dimensions, are growing in niche markets such as MEMS, sensors, and R&D production, reflecting the increasing versatility required in wafer grinding processes.

By Company
Disco Corporation leads the market with advanced automation and high-precision wafer grinding solutions. Tokyo Seimitsu (ACCRETECH) and Engis Corporation are recognized for their innovative equipment designs and reliability across multiple regions. Okamoto Semiconductor Equipment Division, Revasum, and TSD are notable for rapid growth, targeting emerging fabs and high-mix production environments. Other key players such as Koyo Machinery, WAIDA MFG, Hunan Yujing Machine Industrial, SpeedFam, and NTS continue to expand regional presence and strengthen service networks to support diverse semiconductor manufacturing requirements.

Regional Insights
Asia-Pacific leads production and consumption, driven by extensive wafer fabrication facilities in China, Japan, South Korea, and Taiwan. North America and Europe remain important for high-precision, high-mix wafer grinding applications and R&D activity. India and Latin America are emerging regions with increasing semiconductor investments, contributing to market expansion.

The Wafer Grinder (Wafer Thinning Equipment) Market is expected to continue strong growth as wafer thinning becomes more critical in advanced packaging, MEMS, and next-generation semiconductor production. Advances in automation, precision, and throughput will further shape market trends, market share, market size, and overall market growth globally.

by Application

• 200mm Wafer
• 300mm Wafer
• Others

By Company

Disco, TOKYO SEIMITSU, G&N, Okamoto Semiconductor Equipment Division, CETC, Koyo Machinery, Revasum, WAIDA MFG, Hunan Yujing Machine Industrial, SpeedFam, TSD, Engis Corporation, NTS, by Level of Automation, Fully Automatic, Semi-Automatic

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