SiC Wafer Thinning Equipment Market Share Driven by EV and Power Electronics Demand | Valuates Reports

SiC Wafer Thinning Equipment Market Size
The global market for SiC Wafer Thinning Equipment was valued at US$ 114 million in the year 2024 and is projected to reach a revised size of US$ 338 million by 2031, growing at a CAGR of 17.1% during the forecast period.

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The SiC Wafer Thinning Equipment Market is witnessing substantial growth due to the increasing adoption of silicon carbide wafers in electric vehicles, renewable energy systems, and high-power electronics. As SiC devices enable higher efficiency, thermal performance, and miniaturization, manufacturers require precise wafer thinning equipment to achieve ultra-thin, mechanically robust wafers. Market trends such as automation, high-precision grinding, and integration with wafer handling systems are driving the overall market size and accelerating market growth globally.

By Type
The full-automatic segment holds the largest market share, as it provides high throughput, consistent wafer quality, and minimal operator intervention, making it ideal for large-scale SiC wafer production. The semi-automatic segment maintains relevance in smaller production facilities and R&D environments where flexibility and lower initial investment are prioritized. Both types are crucial for supporting the growing adoption of SiC wafers in advanced electronic applications.

By Application
The 6 inches and above wafer segment dominates the market due to its widespread use in high-power electronics and EV applications, reflecting the industry trend toward larger wafer sizes for improved efficiency and reduced costs per device. The 6 inches and below segment is experiencing rapid growth, driven by niche applications, research, and specialized semiconductor production. Both segments highlight the importance of versatile wafer thinning equipment that can accommodate multiple wafer dimensions.

By Company
Based on publicly available data, Disco Corporation holds the highest market share, leveraging its advanced automation and precision control technologies for SiC wafer thinning. Tokyo Seimitsu (ACCRETECH) and Engis Corporation are recognized for their innovative grinding solutions and strong presence in Asia-Pacific and North America. Okamoto Semiconductor Equipment Division, Revasum, and TSD are demonstrating fast growth by targeting emerging EV and power electronics fabs with cost-effective and high-precision equipment. Other players such as Koyo Machinery and G&N continue to expand regionally, focusing on equipment reliability and localized service networks.

Regional Insights
Asia-Pacific dominates both production and consumption, with China, Japan, South Korea, and Taiwan leading in SiC wafer fabrication and equipment deployment. North America and Europe remain significant markets for high-power and EV applications, driven by technological advancements and local fab expansions. India and Latin America are emerging as secondary growth regions due to increasing investments in semiconductor manufacturing and adoption of power electronics technologies.

The SiC Wafer Thinning Equipment Market is poised for sustained growth, driven by the expansion of EVs, renewable energy adoption, and power electronics demand. Ongoing innovation in automation, process precision, and wafer handling will continue to shape future market trends, market share, market size, and overall market growth across global semiconductor manufacturing.

by Type

• Full-Automatic
• Semi-Automatic

by Application

• 6 inches and Below
• 6 Inch and Above

By Company

Disco, TSD, TOKYO SEIMITSU, Engis Corporation, Okamoto Semiconductor Equipment Division, Revasum, Koyo Machinery, G&N

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This release was published on openPR.