Semiconductor Thinning Machine Market Share Driven by Silicon Wafer and Compound Semiconductor Applications | Valuates Reports

Semiconductor Thinning Machine Market Size
The global market for Semiconductor Thinning Machine was valued at US$ 1042 million in the year 2024 and is projected to reach a revised size of US$ 1699 million by 2031, growing at a CAGR of 7.1% during the forecast period.

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The semiconductor thinning machine market is witnessing strong growth due to increasing demand for high-precision wafer thinning in silicon and compound semiconductor manufacturing. Advancements in thinning technology, process automation, and wafer handling precision are shaping market trends and expanding market size. Rising adoption of advanced semiconductor devices, miniaturization of electronic components, and high-performance wafer fabrication processes continue to drive market growth, while innovations in machine speed, uniformity, and yield optimization further enhance market adoption.

By type, 300mm wafer thinning machines hold the largest market share due to their critical role in high-volume semiconductor production and advanced process nodes. Machines for 200mm wafers are experiencing steady growth, serving mature semiconductor lines and specialty applications. Other machine types accommodate niche wafer sizes and specialized processes, ensuring flexibility for diverse semiconductor manufacturing requirements.

In terms of application, silicon wafers dominate the market share, reflecting the widespread use of thinning machines in mainstream semiconductor device fabrication. Compound semiconductors are the fastest-growing application segment, driven by expanding use in power electronics, optoelectronics, and high-frequency devices. Both applications rely on precise thinning technology to improve wafer quality, device performance, and yield, supporting overall market expansion.

Leading companies in the semiconductor thinning machine market demonstrate significant market share and growth based on publicly available data. Disco and TOKYO SEIMITSU hold the largest market share due to their advanced equipment technology, global presence, and comprehensive product portfolios. Companies such as Revasum and Okamoto Semiconductor Equipment Division are among the fastest-growing players, supported by innovations in wafer handling, machine precision, and expansion into emerging semiconductor manufacturing regions. Their focus on technology, reliability, and customer support reinforces competitive positioning and drives sustained market growth.

Regionally, North America and Europe dominate production and consumption due to established semiconductor manufacturing infrastructure, advanced R&D capabilities, and high technology adoption. Asia-Pacific is experiencing the fastest growth driven by rapid expansion of semiconductor fabs, increasing electronics manufacturing, and government support for high-tech industries. Emerging regions, including Southeast Asia and Latin America, are gradually increasing demand as semiconductor production scales and infrastructure develops. The market forecast anticipates continued innovation in machine technology, broader adoption across silicon and compound semiconductor applications, and regional expansion, positioning the semiconductor thinning machine market for sustained market growth and technological advancement.

by Type

• 200mm Wafer
• 300mm Wafer
• Others

by Application

• Silicon Wafer
• Compound Semiconductors

By Company

Disco, TOKYO SEIMITSU, G&N, Okamoto Semiconductor Equipment Division, CETC, Koyo Machinery, Revasum, WAIDA MFG, Hunan Yujing Machine Industrial, SpeedFam, TSD, Engis Corporation, NTS

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This release was published on openPR.