Dry Etching Equipment Market Competition Ranking, Market Size, Market Share, Forecast Report 2025-2031

Global Info Research's report offers an in-depth look into the current and future trends in Dry Etching Equipment, making it an invaluable resource for businesses involved in the sector. This data will help companies make informed decisions on research and development, product design, and marketing strategies. It also provides insights into Dry Etching Equipment' cost structure, raw material sources, and production processes. Additionally, it offers an understanding of the regulations and policies that are likely to shape the future of the industry. In essence, our report can help you stay ahead of the curve and better capitalize on industry trends.

According to our (Global Info Research) latest study, the global Dry Etching Equipment market size was valued at US$ 12870 million in 2024 and is forecast to a readjusted size of USD 19580 million by 2031 with a CAGR of 6.2% during review period.
In this report, we will assess the current U.S. tariff framework alongside international policy adaptations, analyzing their effects on competitive market structures, regional economic dynamics, and supply chain resilience.
Dry etching refers to the removal of material, typically a masked pattern of semiconductor material, by exposing the material to a bombardment of ions (usually a plasma of reactive gases such as fluorocarbons, oxygen, chlorine, boron trichloride; sometimes with addition of nitrogen, argon, helium and other gases) that dislodge portions of the material from the exposed surface.
Currently, global production of Dry Etching Equipment is concentrated. The top three manufacturers held 92.16% of the market, in terms of Dry Etching Equipment sales value in 2019. As for the region, APAC is the largest consumption region, holding 76.07% sales revenue market share in 2019, followed by North America, with 13% market share.
With the continuous reduction of integrated circuit process, especially the production of 7nm-28nm advanced process, the demand for dry etching equipment continues to increase. Since DUV lithography machines are limited by the wavelength of light, wafer fabs need to adopt multiple mask processes and use etching processes to achieve smaller sizes. The etching process required for 7nm integrated circuit production is 140 times, which is 2.5 times the 40 times required for 28nm production.
Etching equipment accounts for the highest proportion in the global semiconductor equipment market.
Global competition:
The global etching equipment market presents a highly concentrated competition pattern, with international giants such as Lam Research, Applied Materials, and Tokyo Electron occupying a dominant position. These companies have advanced technology and rich customer resources and have strong competitiveness in the global market.
Chinese competition:
In the Chinese market, local companies such as AMEC and North Huachuang have strong competitiveness in the field of etching machines and have become leading companies in the domestic etching machine industry. These companies continue to increase R&D investment, improve product performance and technical level, and actively seize market share.
Technological progress:
With the continuous advancement of semiconductor technology, the line width of integrated circuits continues to decrease, and the requirements for etching equipment are getting higher and higher.
The development of 3D integrated circuits has promoted the development of etching technology. For example, the competition for the number of stacking layers of 3D NAND has put forward higher requirements for high aspect ratio etching and multi-stack stacking technology.
Market demand:
The rapid development of artificial intelligence, 5G, Internet of Things and other fields has driven the increase in demand for semiconductor chips, which in turn has promoted the growth of the etching equipment market.
Mainland China has become the world's largest semiconductor equipment market for four consecutive years, and the number of new wafer fab projects ranks first in the world, providing a broad development space for the dry etching equipment market.
Policy support:
The Chinese government has continuously issued relevant policies to support the development of the semiconductor industry, including increasing R&D investment and improving the localization rate, which will further promote the growth of the dry etching equipment market.
In summary, the dry etching equipment market has broad development prospects and huge market potential. With technological progress, increased market demand and continuous strengthening of policy support, the dry etching equipment market will continue to grow.
This report is a detailed and comprehensive analysis for global Dry Etching Equipment market. Both quantitative and qualitative analyses are presented by manufacturers, by region & country, by Type and by Application. As the market is constantly changing, this report explores the competition, supply and demand trends, as well as key factors that contribute to its changing demands across many markets. Company profiles and product examples of selected competitors, along with market share estimates of some of the selected leaders for the year 2025, are provided.

Our Dry Etching Equipment Market report is a comprehensive study of the current state of the industry. It provides a thorough overview of the market landscape, covering factors such as market size, competitive landscape, key market trends, and opportunities for future growth. It also pinpoints the key players in the market, their strategies, and offerings.

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https://www.globalinforesearch.com/reports/2415108/dry-etching-equipment

The research report encompasses the prevailing trends embraced by major manufacturers in the Dry Etching Equipment Market, such as the adoption of innovative technologies, government investments in research and development, and a growing emphasis on sustainability. Moreover, our research team has furnished essential data to illuminate the manufacturer's role within the regional and global markets.

The research study includes profiles of leading companies operating in the Dry Etching Equipment Market:

The report is structured into chapters, with an introductory executive summary providing historical and estimated global market figures. This section also highlights the segments and reasons behind their progression or decline during the forecast period. Our insightful Dry Etching Equipment Market report incorporates Porter's five forces analysis and SWOT analysis to decipher the factors influencing consumer and supplier behavior.

Segmenting the Dry Etching Equipment Market by application, type, service, technology, and region, each chapter offers an in-depth exploration of market nuances. This segment-based analysis provides readers with a closer look at market opportunities and threats while considering the political dynamics that may impact the market. Additionally, the report scrutinizes evolving regulatory scenarios to make precise investment projections, assesses the risks for new entrants, and gauges the intensity of competitive rivalry.

Major players covered: Lam Research、 Tokyo Electron Limited、 Applied Materials、 Hitachi High-Tech、 SEMES、 AMEC、 NAURA、 SPTS Technologies (KLA)、 Oxford Instruments、 ULVAC、 Plasma-Therm、 GigaLane、 VM、 Jusung Engineering、 SAMCO
Dry Etching Equipment Market by Type: Inductively Coupled Plasma (ICP)、 Capacitive Coupled Plasma (CCP)、 Reactive Ion Etching (RIE)、 Deep Reactive Ion Etching (DRIE)、 Others
Dry Etching Equipment Market by Application: Logic and Memory、 MEMS、 Power Device、 Others

Key Profits for Industry Members and Stakeholders:

1. The report includes a plethora of information such as market dynamics scenario and opportunities during the forecast period.
2. Which regulatory trends at corporate-level, business-level, and functional-level strategies.
3. Which are the End-User technologies being used to capture new revenue streams in the near future.
4. The competitive landscape comprises share of key players, new developments, and strategies in the last three years.
5. One can increase a thorough grasp of market dynamics by looking at prices as well as the actions of producers and users.
6 Comprehensive companies offering products, relevant financial information, recent developments, SWOT analysis, and strategies by these players.

The content of the study subjects, includes a total of 15 chapters:
Chapter 1, to describe Dry Etching Equipment product scope, market overview, market estimation caveats and base year.
Chapter 2, to profile the top manufacturers of Dry Etching Equipment, with price, sales, revenue and global market share of Dry Etching Equipment from 2020 to 2025.
Chapter 3, the Dry Etching Equipment competitive situation, sales quantity, revenue and global market share of top manufacturers are analyzed emphatically by landscape contrast.
Chapter 4, the Dry Etching Equipment breakdown data are shown at the regional level, to show the sales quantity, consumption value and growth by regions, from 2020 to 2031.
Chapter 5 and 6, to segment the sales by Type and application, with sales market share and growth rate by type, application, from 2020 to 2031.
Chapter 7, 8, 9, 10 and 11, to break the sales data at the country level, with sales quantity, consumption value and market share for key countries in the world, from 2020 to 2024.and Dry Etching Equipment market forecast, by regions, type and application, with sales and revenue, from 2025 to 2031.
Chapter 12, market dynamics, drivers, restraints, trends and Porters Five Forces analysis.
Chapter 13, the key raw materials and key suppliers, and industry chain of Dry Etching Equipment.
Chapter 14 and 15, to describe Dry Etching Equipment sales channel, distributors, customers, research findings and conclusion.

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