Wafer Defect Inspection System Market Research Report

On Oct 17, the latest report "Global Wafer Defect Inspection System Market 2025 by Manufacturers, Regions, Types and Applications, Forecast to 2031" from Global Info Research provides a detailed and comprehensive analysis of the global Wafer Defect Inspection System market. The report provides both quantitative and qualitative analysis by manufacturers, regions and countries, types and applications. As the market is constantly changing, this report explores market competition, supply and demand trends, and key factors that are causing many market demand changes. The report also provides company profiles and product examples of some of the competitors, as well as market share estimates for some of the leading players in 2025.

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According to our (Global Info Research) latest study, the global Wafer Defect Inspection System market size was valued at US$ 7883 million in 2024 and is forecast to a readjusted size of USD 14670 million by 2031 with a CAGR of 9.4% during review period.
Wafer defect inspection system detects physical defects (foreign substances called particles) and pattern defects on wafers and obtains the position coordinates (X, Y) of the defects. Defects can be divided into random defects and systematic defects.
Random defects are mainly caused by particles that become attached to a wafer surface, so their positions cannot be predicted. The major role of a wafer defect inspection system is to detect defects on a wafer and find out their positions (position coordinates).
On the other hand, systematic defects are caused by the conditions of the mask and exposure process, and will occur in the same position on the circuit pattern of all the dies projected. They occur in locations where the exposure conditions are very difficult and require fine adjustment.
The wafer defect inspection system detects defects by comparing the image of the circuit patterns of the adjacent dies. As a result, systematic defects sometimes cannot be detected using a conventional wafer defect inspection system.
Inspection can be performed on a patterned process wafer or on a bare wafer. Each of these has a different system configuration. Below is an explanation of typical inspection systems; Patterned wafer inspection system and Non-patterned wafer inspection system.
The global key manufacturers of Wafer Defect Inspection System include KLA Corporation, Applied Materials, ASML, Hitachi High-Tech Corporation, Onto Innovation, Camtek, Skyverse Technology, SCREEN Semiconductor Solutions, Lasertec, NEXTIN, etc. In 2023, the global top 10 players had a share approximately 92.0% in terms of revenue.
In Patterned Wafer Defect Inspection Systems segment are dominated by KLA and Applied Materials;
Unpatterned Wafer Inspection Systems are dominated by KLA and Hitachi High-Tech Corporation; e-Beam Wafer Defect Review and Classification Systems are dominated by ASML and Applied Materials.
The global market for semiconductor was estimated at US$ 526.8 billion in the year 2023, is projected to US$ 780.7 billion by 2030. IC Manufacturing is the process used to manufacture semiconductor devices, typically integrated circuits (ICs) such as computer processors, microcontrollers, and memory chips (such as NAND flash and DRAM). According to our research, the global semiconductor manufacturing (wafer fabrication) market is projected to grow from US$ 251.7 billion in 2023 to US$ 506.5 billion by 2030, at a Compound Annual Growth Rate (CAGR) of 40.49% during the forecast period. This will drive rapid growth of global Wafer Defect Inspection System.
This report is a detailed and comprehensive analysis for global Wafer Defect Inspection System market. Both quantitative and qualitative analyses are presented by manufacturers, by region & country, by Type and by Application. As the market is constantly changing, this report explores the competition, supply and demand trends, as well as key factors that contribute to its changing demands across many markets. Company profiles and product examples of selected competitors, along with market share estimates of some of the selected leaders for the year 2025, are provided.

This report also provides key insights about market drivers, restraints, opportunities, new product launches or approval.
Wafer Defect Inspection System market is split by Type and by Application. For the period 2020-2031, the growth among segments provides accurate calculations and forecasts for consumption value by Type, and by Application in terms of volume and value. This analysis can help you expand your business by targeting qualified niche markets.

Market segment by Type: Patterned Wafer Defect Inspection System、 Non-patterned Wafer Defect Inspection System、 E-beam Wafer Defect Inspection and Classification System、 Wafer Macro Defects Detection and Classification、 Wafer Inspection System for Advanced Packaging
Market segment by Application: 300mm Wafer Size、 200mm Wafer Size、 Others
Major players covered: KLA Corporation、 Applied Materials、 Lasertec、 Hitachi High-Tech Corporation、 ASML、 Onto Innovation、 Camtek、 SCREEN Semiconductor Solutions、 Skyverse Technology、 Toray Engineering、 NEXTIN、 Suzhou TZTEK (Muetec)、 Microtronic、 Bruker、 SMEE、 Hangzhou Changchuan Technology、 Wuhan Jingce Electronic Group、 Angkun Vision (Beijing) Technology、 Nanotronics、 Visiontec Group、 Hefei Yuwei Semiconductor Technology、 Suzhou Secote (Optima)、 DJEL、 Jiangsu VPTEK、 Ever Red New Technology、 Confovis、 Zhongdao Optoelectronic、 Suzhou Xinshi Technology、 RSIC scientific instrument (Shanghai)、 Gaoshi Technology (Suzhou)、 Unity Semiconductor SAS、 JUTZE Intelligence Technology、 Chroma ATE Inc、 CMIT、 Engitist Corporation、 HYE Technology、 Shuztung Group、 Cortex Robotics、 Takano、 Shanghai Techsense

The content of the study subjects, includes a total of 15 chapters:
Chapter 1, to describe Wafer Defect Inspection System product scope, market overview, market estimation caveats and base year.
Chapter 2, to profile the top manufacturers of Wafer Defect Inspection System, with price, sales quantity, revenue, and global market share of Wafer Defect Inspection System from 2020 to 2025.
Chapter 3, the Wafer Defect Inspection System competitive situation, sales quantity, revenue, and global market share of top manufacturers are analyzed emphatically by landscape contrast.
Chapter 4, the Wafer Defect Inspection System breakdown data are shown at the regional level, to show the sales quantity, consumption value, and growth by regions, from 2020 to 2031.
Chapter 5 and 6, to segment Wafer Defect Inspection System the sales by Type and by Application, with sales market share and growth rate by Type, by Application, from 2020 to 2031.
Chapter 7, 8, 9, 10 and 11, to break the Wafer Defect Inspection System sales data at the country level, with sales quantity, consumption value, and market share for key countries in the world, from 2020 to 2024.and Wafer Defect Inspection System market forecast, by regions, by Type, and by Application, with sales and revenue, from 2025 to 2031.
Chapter 12, market dynamics, drivers, restraints, trends, and Porters Five Forces analysis.
Chapter 13, the key raw materials and key suppliers, and industry chain of Wafer Defect Inspection System.
Chapter 14 and 15, to describe Wafer Defect Inspection System sales channel, distributors, customers, research findings and conclusion.

The Primary Objectives in This Report Are:
To determine the size of the total market opportunity of global and key countries
To assess the growth potential for Wafer Defect Inspection System
To forecast future growth in each product and end-use market
To assess competitive factors affecting the marketplace

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