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Extreme Ultraviolet (EUV) Photomask Substrates Market Share Driven by Advanced Semiconductor Fabrication and Precision Materials Innovation | Valuates Reports

10-16-2025 02:49 PM CET | Advertising, Media Consulting, Marketing Research

Press release from: Valuates Reports

The Extreme Ultraviolet (EUV) Photomask Substrates market is experiencing accelerated market growth as semiconductor manufacturers push toward smaller node geometries and next-generation chip architectures. EUV photomasks are essential in enabling extreme resolution patterning for advanced logic and memory chips, and their performance directly influences yield and pattern fidelity. The increasing demand for high-performance computing, AI processors, and 5G-enabled devices is expanding the overall market size, while innovations in substrate materials, cleaning technologies, and defect inspection systems are redefining global market trends.

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By type, quartz-based photomask substrates hold the largest market share due to their superior optical transparency and thermal stability under EUV exposure conditions. Low thermal expansion glass (LTEM) materials are gaining momentum as the fastest-growing type segment, offering enhanced dimensional accuracy and reduced distortion for high-precision lithography. Other materials, including advanced composite and multilayer substrates, are being developed to improve reflectivity, contamination resistance, and mechanical robustness, reflecting the industry's continuous efforts to enhance manufacturing yield and consistency.

In terms of application, foundries dominate the EUV photomask substrates market, driven by mass production of high-end semiconductor chips used in smartphones, servers, and AI accelerators. Integrated Device Manufacturers (IDMs) also contribute significantly, integrating EUV photomasks to advance their proprietary chip design and fabrication processes. Other applications, including research institutes and pilot lines, are supporting market growth by fostering innovation in photomask inspection, defect control, and patterning precision-key enablers for extending EUV technology to sub-3 nm nodes.

Among leading companies, AGC Inc., Hoya Corporation, and SCHOTT AG hold substantial market share, supplying high-purity glass and advanced substrate materials critical to EUV mask production. ASML collaborates closely with these suppliers through joint R&D programs aimed at improving pellicle integration and defect-free mask manufacturing. Other notable players, including Corning Incorporated and Applied Materials, contribute through innovations in deposition, cleaning, and metrology technologies. Collectively, these companies are driving market trends through material advancements, supply chain integration, and co-development strategies with semiconductor leaders.

Regionally, Asia-Pacific (APAC) dominates the EUV photomask substrates market, led by strong semiconductor manufacturing bases in Japan, South Korea, China, and Taiwan. These regions benefit from advanced materials expertise, high-volume wafer production, and strategic government support for semiconductor independence. North America and Europe follow with robust R&D ecosystems and partnerships focused on next-generation photomask technologies. The market forecast indicates sustained expansion as fabs transition to EUV-enabled production nodes, driven by the growing need for defect-free substrates, enhanced inspection systems, and precision-engineered materials that ensure the continued evolution of semiconductor lithography.

By Application
• Semiconductor
• Chip Manufacturing
• Telecommunication

By Type
• 6" X 6" Substrate

Key Companies
AGC, Hoya, Applied Materials, S&S Tech, Photronics Inc, Toppan Photomasks

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